MAX14840E/MAX14841E 40Mbps, +3.3V, RS-485 Half-Duplex Transceivers General Description Benefits and Features The MAX14840E/MAX14841E are +3.3V ESD-protected High ESD Protection Provides Increases Equipment transceivers intended for half-duplex RS-485 communica- Uptime tion up to 40Mbps. These transceivers are optimized for 35kV Human Body Model (HBM) per JEDEC high speeds over extended cable runs while maximizing JS-001-2012 tolerance to noise. 20kV Air Gap Discharge per IEC 61000-4-2 12kV Contact Discharge per IEC 61000-4-2 The MAX14840E features symmetrical fail-safe and larg- er receiver hysteresis, providing improved noise rejection Integrated Features Increases Robustness and improved recovered signals in high-speed and long Large 170mV Receiver Hysteresis (MAX14840) for cable applications. The MAX14841E has true fail-safe High Receiver Noise Tolerance receiver inputs guaranteeing a logic-high receiver output True Fail Safe Receiver Input (MAX14841E) Keeps when inputs are shorted or open. Receiver Output Logic-High Upon Shorts and Open On Receiver Input The MAX14840E/MAX14841E are available in 8-pin SO Thermal Self-Protection Shutdown at 160C and small, 8-pin (3mm x 3mm) TDFN-EP packages. Both Junction Temperature devices operate over the -40NC to +125NC temperature High Industrial -40C to +125C Ambient Operating range. Temperature Range/-40C to +150C Junction Temperature Range Applications Hot Swap Capability Eliminates False Transition Motion Controllers During Power-Up or Hot Insertion Fieldbus Networks Low Current Reduces Power Requirements Industrial Control Systems 10A (max) Shutdown Current Backplane Buses 1.5mA (typ) Supply Current HVAC Networks 3.3V Supply Voltage Ordering Information/Selector Guide appears at end of data Available in Industry Standard 8-Pin SO or sheet. Space-Saving 8-Pin TDFN-EP (3mm x 3mm) Packages Functional Diagram V CC MAX14840E MAX14841E R RO B RE SHUTDOWN DE A D DI GND 19-5131 Rev 2 7/15MAX14840E/MAX14841E 40Mbps, +3.3V, RS-485 Half-Duplex Transceivers Absolute Maximum Ratings (Voltages referenced to GND.) Junction-to-Ambient Thermal Resistance (B ) (Note 1) JA V ..................................................................... -0.3V to +6.0V 8-Pin SO ....................................................................132NC/W CC RE, RO .................................................. -0.3V to +(V + 0.3V) 8-Pin TDFN ..................................................................41NC/W CC DE, DI .................................................................. -0.3V to +6.0V Operating Temperature Range (Note 2) ........ -40NC to +125NC A, B .................................................................... -8.0V to +13.0V Junction Temperature .................................................. +150NC Short-Circuit Duration (RO, A, B) to GND ............... Continuous Storage Temperature Range ......................... -65NC to +150NC Continuous Power Dissipation (T = +70NC) Lead Temperature (soldering, 10s) ...............................+300NC A 8-Pin SO (derate 7.6mW/NC above +70NC) ............... 606mW Soldering Temperature (reflow) ......................................+260NC 8-Pin TDFN (derate 24.4mW/NC above +70NC) ....... 1951mW Junction-to-Case Thermal Resistance (B ) (Note 1) JC 8-Pin SO .......................................................................38NC/W 8-Pin TDFN ....................................................................8NC/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Note 2: Operation is specified with junction temperatures up to +150C. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Characteristics (V = +3.0V to +3.6V, T = -40NC to +125NC, unless otherwise noted. Typical values are at V = +3.3V and T = +25NC.) (Notes 3, 4) CC A CC A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY Supply Voltage V 3.0 3.6 V CC DE = RE = V , or CC DE = RE = GND, or Supply Current I 1.5 4 mA CC DE = V , RE = GND, CC DI = V or GND, no load CC Shutdown Supply Current I DE = GND and RE = V 10 FA SH CC DRIVER Differential Driver Output V R = 54I, Figure 1 1.5 V OD L Change in Magnitude of DV R = 54I, Figure 1 (Note 5) -0.2 0 +0.2 V OD L Differential Output Voltage Driver Common-Mode Output V R = 54I, Figure 1 V /2 3 V OC L CC Voltage Change in Common-Mode DV R = 54I, Figure 1 (Note 5) -0.2 0.2 V OC L Voltage Single-Ended Driver Output High V A/B output, I = -20mA 2.2 V OH OUT Single-Ended Driver Output Low V A/B output, I = 20mA 0.8 V OL OUT 0V P V P +12V, output low 250 Driver Short-Circuit Output OUT I mA OSD Current -7V P V P V , output high 250 OUT CC RECEIVER V = +12V 1000 DE = GND, IN Input Current (A and B) I FA A,B V = GND or +3.6V V = -7V -800 CC IN Differential Input Capacitance C Between A and B, DE = GND, f = 2MHz 12 pF A,B Maxim Integrated 2 www.maximintegrated.com