MAX14842 19-5714 Rev 1 3/11 6-Channel, Digital Ground-Level Translator General Description Features The MAX14842 translates digital signals between two S Supports Ground Differences Up to 72V domains that have different ground references of up to S Four Unidirectional Channels: Two In/Two Out 72V. The device features six communication channels, S Two Bidirectional Channels two bidirectional and four unidirectional. Two of the four unidirectional channels go in each direction. The device 2 S I C Compatible is powered by two supply voltages that independently 2 S Supports I C Clock Stretching define the logic levels of each ground domain. S 30Mbps Unidirectional Data Rates The MAX14842 supports guaranteed data rates up to S 2Mbps Bidirectional Data Rates 30Mbps on the four unidirectional channels and up to 2Mbps on the two bidirectional channels. The bidirec- S +3.3V to +5V Level Translation tional channels have open-drain outputs, making them S Undervoltage Lockout 2 2 suitable for I C signals. I C clock stretching and hot swapping is supported on the bidirectional channels. S 4mm x 4mm, 16-Pin TQFN Package Undervoltage lockout ensures that the output pins have S -40NC to +125NC Automotive Temperature Range a defined behavior during power-up, power-down, and during supply transients. For proper operation, ensure Applications that 0V (V - V ) 72V. Note that GNDB must GNDB GNDA Telecommunication Systems be greater than or equal to GNDA. Battery Management The MAX14842 is available in a 16-pin TQFN package 2 I C, SMBusK, SPIK, and MICROWIREK Signals and is specified over the -40NC to +125NC automotive temperature range. Medical Systems Power-Over-Ethernet Ordering Information PART TEMP RANGE PIN-PACKAGE SMBus is a trademark of Intel Corp. MAX14842ATE+ -40NC to +125NC 16 TQFN-EP** SPI is a trademark of Motorola, Inc. **EP = Exposed pad. MICROWIRE is a trademark of National Semiconductor Corp. +Denotes a lead(Pb)-free/RoHS-compliant package. Typical Operating Circuit 3.3V 0.1F 0.1F5V V V DDA DDB GPIO INA1 OUTB1 WAKE CS INA2 OUTB2 ADDR RST OUTA1INB1 UV IRQ OUTA2INB2 ALARM R R PUA PUB C PERIPHERAL V V DDA DDB MAX14842 SDA I/OA1 I/OB1 SDA R R PUA PUB V V DDA DDB SCL I/OA2 I/OB2 SCL GNDA GNDB V GG FOR PROPER OPERATION: 0V (V - V ) 72V GNDB GNDA Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLE6-Channel, Digital Ground-Level Translator ABSOLUTE MAXIMUM RATINGS V to GNDA ........................................................-0.3V to +6V Short-Circuit Duration (OUTA1, OUTA2 to GNDA DDA V to GNDB ........................................................-0.3V to +6V OUTB1, OUTB2 to GNDB) .....................................Continuous DDB GNDB to GNDA .....................................................-0.3V to +80V Continuous Power Dissipation (T = +70NC) A INA1, INA2 to GNDA .............................. -0.3V to (V + 0.3V) TQFN (derate 25mW/NC above +70NC) .....................2000mW DDA INB1, INB2 to GNDB .............................. -0.3V to (V + 0.3V) Operating Temperature Range ........................ -40NC to +125NC DDB OUTA1, OUTA2 to GNDA ...................... -0.3V to (V + 0.3V) Junction Temperature .....................................................+150NC DDA OUTB1, OUTB2 to GNDB ...................... -0.3V to (V + 0.3V) Storage Temperature Range ............................ -65NC to +150NC DDB I/OA1, I/OA2 to GNDA ............................................-0.3V to +6V Lead Temperature (soldering, 10s) ................................+300NC I/OB1, I/OB2 to GNDB ............................................-0.3V to +6V Soldering Temperature (reflow) ......................................+260NC Common-Mode Transients (i.e., Transients Between GNDA and GNDB) .........................................10V/Fs PACKAGE THERMAL CHARACTERISTICS (Note 1) TQFN Junction-to-Ambient Thermal Characteristics (q ) ....40C/W JA Junction-to-Case Thermal Characteristics (q ) ...........6C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V - V = +3.0V to +5.5V, V - V = +3.0V to +5.5V, V - V = 0 to +72V, T = -40NC to +125NC, unless oth- DDA GNDA DDB GNDB GNDB GNDA A erwise noted. Typical values are at V - V = +3.3V, V - V = +3.3V, V - V = +50V, T = +25NC.) (Note 2) DDA GNDA DDB GNDB GNDB GNDA A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT DC CHARACTERISTICS V Relative to GNDA 3.0 5.5 DDA Supply Voltage V V Relative to GNDB 3.0 5.5 DDB V - V = +5.5V V - V = DDA GNDA DDB GNDB I DDA Supply Current +5.5V V - V = +70V all inputs 7.5 mA GNDB GNDA I DDB at V , V , or +5.5V no load GNDA GNDB Voltage Between GNDB and V V - V 0 72 V GG GNDB GNDA GNDA Side B Leakage Current I 1 mA L Undervoltage-Lockout Threshold V V - V , V - V 2 V UVLO DDA GNDA DDB GNDB Undervoltage-Lockout Hysteresis V V - V , V - V 0.1 V UVLOHYS DDA GNDA DDB GNDB LOGIC INPUTS AND OUTPUTS Input Logic Threshold Voltage V I/OA1, I/OA2, relative to GNDA 0.5 0.7 V IT 0.7 x INA1, INA2, relative to GNDA V DDA 0.7 x INB1, INB2, relative to GNDB V Input Logic-High Voltage V DDB V IH I/OA1, I/OA2, relative to GNDA 0.7 0.7 x I/OB1, I/OB2, relative to GNDB V DDB 2 MAX14842