EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX14850 Six-Channel Digital Isolator General Description Benefits and Features The MAX14850 is a six-channel digital isolator utilizing Protection from High-Voltage Environments Maxims proprietary process technology, whose mono- 600V Isolation for 60 Seconds RMS lithic design provides a compact and low-cost transfer Short-Circuit Protection on Unidirectional Outputs 200V Working Isolation Voltage for 50 Years of digital signals between circuits with different power RMS domains. The technology enables low power consump- Complete Digital Isolation Solution tion and stable high-temperature performance. Four Unidirectional Signal Paths: 2-In/2-Out Two Bidirectional Open-Drain Signal Paths The four unidirectional channels are each capable of DC to 50Mbps, with two of the four channels passing data 50Mbps (max) Unidirectional Data Rate 2Mbps (max) Bidirectional Data Rate across the isolation barrier in each direction. The two bidirectional channels are open-drain each capable of Compatible with Many Interface Standards data rates from DC to 2Mbps. 2 I C Independent 3.0V to 5.5V supplies on each side of the SPI isolator also make it suitable for use as a level translator. RS-232, RS-422/RS-485 2 The MAX14850 can be used for isolating SPI buses, I C SMBus, PMBus Interfaces buses, RS-232, RS-485/RS-422 buses, and general-pur- Ordering Information appears at end of data sheet. pose isolation. When used as a bus isolator, extra chan- nels are available for power monitoring and reset signals. Typical Operating Circuits The MAX14850 is available in a narrow body,16-pin SOIC (10mm x 4mm) package (for which an evaluation kit is available) and 16-pin QSOP (3.9mm x 4.94mm) package. 0.1F 0.1F 3.3V 5V The packages are specified over the -40C to +125C temperature range. V V CCA CCB For improved performance, refer to the MAX14851. The MAX14851 has the same functionality and pin con- MAX14850 figurations, and can be used as a footprint and functional R R R R PUA PUA PUB PUB replacement for the MAX14850. GPIO1 I/OA1 I/OB1 RST Applications GPIO2 I/OA2 I/OB2 CS Industrial Control Systems SCLK INA1 OUTB1 SCLK ADC C 2 I C, SPI, SMBus, PMBus Interfaces MOSI INA2 OUTB2 MOSI Isolated RS-232, RS-485/RS-422 MISO OUTA1 INB1 MISO V MONITOR CCB Telecommunication Systems GPIO3 OUTA2 INB2 Battery Management Medical Systems GNDA GNDB 600V RMS ISOLATION PMBus is a trademark of SMIF, Inc. 19-6161 Rev 3 9/19MAX14850 Six-Channel Digital Isolator Absolute Maximum Ratings V to GNDA ........................................................-0.3V to +6V Continuous Power Dissipation (T = +70C) CCA A V to GNDB ........................................................-0.3V to +6V SOIC (derate 13.3mW/C above +70C)...................1067mW CCB OUTA1, OUTA2 to GNDA .......................-0.3V to (V + 0.3V) QSOP (derate 9.6mW/C above +70C) ..................771.5mW CCA OUTB1, OUTB2 to GNDB ......................-0.3V to (V + 0.3V) Operating Temperature Range ......................... -40C to +125C CCB INA1, INA2, I/OA1, I/OA2 to GNDA ........................-0.3V to +6V Junction Temperature ......................................................+150C INB1, INB2, I/OB1, I/OB2 to GNDB ........................-0.3V to +6V Storage Temperature Range ............................ -65C to +150C Short-Circuit Duration (OUTA to GNDA or Lead Temperature (soldering, 10s) .................................+300C V , OUTB to GNDB or V ) ........................Continuous Soldering Temperature (reflow) .......................................+260C CCA CCB Continuous Current (I/OA , I/OB ) Pin ............................50mA Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 16 SOIC Package Code S16+3 Outline Number 21-0041 Land Pattern Number 90-0097 THERMAL RESISTANCE, MULTILAYER BOARD Junction to Ambient ( ) 75C/W JA Junction to Case ( ) 24C/W JC 16 QSOP Package Code E16+1 Outline Number 21-0055 Land Pattern Number 90-0167 THERMAL RESISTANCE, MULTILAYER BOARD Junction to Ambient ( ) 103.7C/W JA Junction to Case ( ) 37C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com