MAX14885E 19-5143 Rev 1 1/12 Low-Capacitance VGA 2:2 Dual-Graphics Crossover Switch General Description Features S Low Quiescent Current 5A (max) The MAX14885E integrates high-bandwidth analog switches, level-translating buffers, and level-translating S Low 5I (typ) On-Resistance (RGB Signals) FET switches. The device implements a complete 2:2 S High Bandwidth, 700MHz (typ), RGB dual-graphics crossover solution for VGA signal switch- S DDC Level Shifting, Isolation with Internal Pullup ing. The MAX14885E provides 12 very high-frequency Termination, and Protection 700MHz (typ) SPST switches for RGB signals, four low- frequency clamping switches for display data channel S Horizontal and Vertical Sync Level Shifting and (DDC) signals, two pairs of level-translating buffers for Buffering the HSYNC and VSYNC signals, and integrated extend- S Inputs Compatible with V , Outputs TTL L ed ESD protection. The MAX14885E is used to select Compatible one of two sources to either of two destinations (see the S Source/Sink 10mA on Each SH , SV Output Typical Operating Circuit) within a laptop computer. S Independent Selectable Logic Inputs for Switching Horizontal and vertical synchronization (SH /SV ) inputs S High ESD Protection on Outputs feature level-shifting buffers to support low-voltage con- 15kV ESD HBM trollers and standard 5V TTL-level monitors. DDC, con- 6kV IEC 61000-4-2 Contact Discharge sisting of SDA and SCL , are FET switches that protect S Small, 40-Pin TQFN (5mm x 5mm) Package the low-voltage VGA source from potential damage from high-voltage presence on the monitor while reducing Applications capacitive load. Notebook ComputerSwitchable Graphics All 14 output terminals of the MAX14885E feature high- ESD protection to Q15kV Human Body Model (HBM) Ordering Information and Q6kV IEC 61000-4-2 Contact Discharge (see the Pin Description). All other pins are protected to Q2kV HBM. PART TEMP RANGE PIN-PACKAGE The MAX14885E is specified over the extended -40NC to MAX14885EETL+ -40NC to +85NC 40 TQFN-EP* +85NC temperature range, and is available in a 40-pin +Denotes a lead(Pb)-free/RoHS-compliant package. TQFN (5mm x 5mm) package. *EP = Exposed pad. Typical Application Circuit +3.3V +5V 1F 1F V V L CC 3 3 REDA, GRNA, BLUA RED1, GRN1, BLU1 MXM 2 2 VGA SHA, SVA SH1, SV1 MODULE PORT 2 2 SDA1, SCL1 SDAA, SCLA MAX14885E 3 3 REDB, GRNB, BLUB RED2, GRN2, BLU2 INTERNAL 2 2 DOCKING SHB, SVB SH2, SV2 GRAPHICS STATION 2 2 SDA2, SCL2 SDAB, SCLB EN S00 S01 S10 S11 GND GPIO Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLELow-Capacitance VGA 2:2 Dual-Graphics Crossover Switch ABSOLUTE MAXIMUM RATINGS (Voltages referenced to GND.) Continuous Current Through SDA , SCL Switches ..... Q50mA V ........................................................................ -0.3V to +6V Peak Current Through All Switches CC V .......................................................................... -0.3V to +6V (pulsed at 1ms, 10% duty cycle) .............................. Q100mA L RED , GRN , BLU , SCL1, SCL2, SDA1, Continuous Power Dissipation (Multilayer Board, T = +70NC): A SDA2, SH1, SH2, SV1, SV2 ................. -0.3V to (V + 0.3V) 40-Pin TQFN (derate 35.7mW/NC above +70NC) .......2857mW CC SCLA, SCLB, SDAA, SDAB, SHA, SHB, Operating Temperature Range .......................... -40NC to +85NC SVA, SVB, S00, S01, S10, S11, EN ........ -0.3V to (V + 0.3V) Storage Temperature Range ............................ -65NC to +150NC L Continuous Current Through RED , Junction Temperature .....................................................+150NC GRN , BLU Switches ................................................ Q50mA Soldering Temperature (reflow) ......................................+260NC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) TQFN Junction-to-Ambient Thermal Resistance (q ) ..........28C/W JA Junction-to-Case Thermal Resistance (q ) .................2C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (V = +4.5V to +5.5V, V = +2.3V to V , T = -40NC to +85NC, unless otherwise noted. Typical values are at V = +5.0V, CC L CC A CC V = +3.3V and T = +25NC.) (Note 2) L A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.5 5.5 V CC Logic Supply Voltage V 2.3 3.3 5.5 V L V P V L CC V = +5.5V, V = +3.6V, V = 0V, CC L EN V Supply Current I 0.2 5 FA CC CC V V V V = 0V or V SHA, SHB, SVA, SVB L V , V , V , EN SHA SHB 0.2 5 FA V = +5.5V, V = CC L V , V = 0V SVA SVB V Supply Current I +3.6V, SCL and L L V , V V , EN SHA, SHB SDA unconnected 0.3 0.5 mA V , V = V SVA SVB L On-Resistance (RED , GRN , RHF V = +0.7V, I = +10mA 5 8 I ON IN IN BLU ) On-Resistance Match (RED , 1 DR 0V P V P +0.7V, I = -10mA I ON IN IN GRN , BLU ) On-Resistance Flatness (RED , R 0V P V P +0.7V, I = -10mA 0.5 1 I FLAT(ON) IN IN GRN , BLU ) Leakage Current (RED , GRN , I V = 0V -1 +1 FA LK EN BLU ) On-Resistance (SDA , SCL ) RDDC V = +0.7V, I = Q10mA 25 I ON IN IN V Pullup Resistor (SDA1, CC Resistor to V 20 kI CC SDA2, SCL1, SCL2) V Pullup Resistor (SDAA, SDAB, L Resistor to V 3 kI L SCLA, SCLB) 2 MAX14885E