EVALUATION KIT AVAILABLE MAX14934MAX14936 Four-Channel, 5kV Digital Isolators RMS General Description Benefits and Features Robust Galvanic Isolation of Digital Signals The MAX14934MAX14936 are a family of four-channel, Withstands 5kV for 60s (V ) 5kV digital isolators utilizing Maxims proprietary RMS ISO RMS process technology. For applications requiring 2.75kV Continuously Withstands 848V (V ) RMS RMS IOWM of isolation, see the MAX14930MAX14932. The 1200V Repetitive Peak Voltage (V ) P IORM MAX14934MAX14936 family transfers digital signals Withstands 10kV Surge per IEC 61000-4-5 between circuits with different power domains at ambient Interfaces Directly with Most Micros and FPGAs temperatures up to +125C. Accepts 1.71V to 5.5V Supplies The MAX14934MAX14936 family offers all three pos- Many Options Support Broad Applications sible unidirectional channel configurations to accom- 3 Data Rates (1Mbps, 25Mbps, 150Mbps) modate any four-channel design, including SPI, RS-232, 3 Channel Direction Configuration RS-485, and large digital IO modules. For applications 2 Output Default States (High or Low) 2 requiring bidirectional channels, such as I C, refer to the Low Power Consumption at High Data Rates MAX14937. At 1.8V: Devices are available with data rates from DC up to 2.5mA per Channel Typical at 1Mbps 1Mbps, 25Mbps, or 150Mbps. Each device is also available 5.25mA per Channel Typical at 100Mbps in either a default high or default low configuration. The At 3.3V: default is the state an output goes to when its input is 2.6mA per Channel Typical at 1Mbps unpowered. See the Ordering Information/Selector Guide 7.1mA per Channel Typical at 100Mbps for the suffixes associated with each option. Safety Regulatory Approvals Independent 1.71V to 5.5V supplies on each side of the (see Safety Regulatory Approvals) isolator also make the devices suitable for use as level translators. UL According to UL1577 cUL According to CSA Bulletin 5A The MAX14934MAX14936 are available in a 16-pin VDE 0884-10 wide body (10.3mm x 7.5mm) SOIC package. All devices are rated for operation at ambient temperatures of -40C Applications to +125C. Fieldbus Communications for Industrial Automation Isolated SPI, RS-232, RS-485/RS-422 Ordering Information/Selector Guide appears at end of data General Multichannel Isolation Applications sheet. Battery Management Medical Systems Functional Diagram V V V V V V DDA DDB DDA DDB DDA DDB MAX14934 MAX14935 MAX14936 ENB ENB ENB INA1 OUTB1 INA1 OUTB1 INA1 OUTB1 INA2 OUTB2 INA2 OUTB2 INA2 OUTB2 5kVRMS 5kVRMS 5kVRMS DIGITAL DIGITAL DIGITAL ISOLATOR ISOLATOR ISOLATOR INA3 OUTB3 INA3 OUTB3 OUTA1 INB1 INA4 OUTB4 OUTA1 INB1 OUTA2 INB2 ENA ENA GNDA GNDB GNDA GNDB GNDA GNDB 19-7067 Rev 6 1/17MAX14934MAX14936 Four-Channel, 5kV Digital Isolators RMS Absolute Maximum Ratings V to GNDA, V to GNDB .............................-0.3V to +6V Continuous Power Dissipation (T = +70C) DDA DDB A INA , ENA to GNDA ................................................-0.3V to +6V Wide SOIC (derate 14.1mW/C above +70C) ......1126.8mW INB , ENB to GNDB ...............................................-0.3V to +6V Operating Temperature Range ......................... -40C to +125C OUTA to GNDA ....................................-0.3V to (V + 0.3V) Maximum Junction Temperature .....................................+150C DDA OUTB to GNDB ....................................-0.3V to (V + 0.3V) Storage Temperature Range ............................ -65C to +150C DDB Short-Circuit Duration Lead Temperature (soldering, 10s) .................................+300C (OUTA to GNDA, OUTB to GNDB) ..................Continuous Soldering Temperature (reflow) ......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) Wide SOIC Junction-to-Ambient Thermal Resistance ( ) ..........71C/W JA Junction-to-Case Thermal Resistance ( ) ...............23C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. DC Electrical Characteristics (V - V = +1.71V to +5.5V, V - V = +1.71V to +5.5V, C = 15pF, T = -40C to +125C, unless otherwise noted. DDA GNDA DDB GNDB L A Typical values are at V - V = +3.3V, V - V = +3.3V, V = V , T = +25C, unless otherwise noted.) (Note 2) DDA GNDA DDB GNDB GNDA GNDB A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY V Relative to GNDA 1.71 5.5 V DDA Operating Supply Voltage V Relative to GNDB 1.71 5.5 V DDB Undervoltage Lockout Threshold V V rising 1.45 1.58 1.71 V UVLO DD Undervoltage Lockout Threshold V UVLO 50 mV Hysteresis HYST Maxim Integrated 2 www.maximintegrated.com