EVALUATION KIT AVAILABLE Click here to ask about the production status of specific part numbers. MAX14934MAX14936 Four-Channel, 5kV Digital Isolators RMS General Description Benefits and Features Robust Galvanic Isolation of Digital Signals The MAX14934MAX14936 are a family of four-channel, Withstands 5kV for 60s (V ) 5kV digital isolators utilizing Maxims proprietary RMS ISO RMS Continuously Withstands 848V (V ) process technology. For applications requiring 2.75kV RMS IOWM RMS 1200V Repetitive Peak Voltage (V ) P IORM of isolation, see the MAX14930MAX14932. The Withstands 10kV Surge per IEC 61000-4-5 MAX14934MAX14936 family transfers digital signals Interfaces Directly with Most Micros and FPGAs between circuits with different power domains at ambient temperatures up to +125C. Accepts 1.71V to 5.5V Supplies The MAX14934MAX14936 family offers all three Many Options Support Broad Applications possible unidirectional channel configurations to accommodate 3 Data Rates (1Mbps, 25Mbps, 150Mbps) any four-channel design, including SPI, RS-232, RS-485, 3 Channel Direction Configuration and large digital IO modules. For applications 2 Output Default States (High or Low) 2 requiring bidirectional channels, such as I C, refer to the Low Power Consumption at High Data Rates MAX14937. At 1.8V: Devices are available with data rates from DC up to 2.5mA per Channel Typical at 1Mbps 1Mbps, 25Mbps, or 150Mbps. Each device is also available 5.25mA per Channel Typical at 100Mbps in either a default high or default low configuration. The At 3.3V: default is the state an output goes to when its input is 2.6mA per Channel Typical at 1Mbps unpowered. See the Product Selector Guide and Ordering 7.1mA per Channel Typical at 100Mbps Information for the suffixes associated with each option. Safety Regulatory Approvals Independent 1.71V to 5.5V supplies on each side of the (see Safety Regulatory Approvals) isolator also make the devices suitable for use as level UL According to UL1577 translators. cUL According to CSA Bulletin 5A The MAX14934MAX14936 are available in a 16-pin VDE 0884-11 Basic Insulation wide body (10.3mm x 7.5mm) SOIC package. All devices are rated for operation at ambient temperatures of -40C Applications to +125C. Fieldbus Communications for Industrial Automation Isolated SPI, RS-232, RS-485/RS-422 Product Selector Guide and Ordering Information appear at General Multichannel Isolation Applications end of data sheet. Battery Management Medical Systems Functional Diagram V V V V V V DDA DDB DDA DDB DDA DDB MAX14934 MAX14935 MAX14936 ENB ENB ENB INA1 OUTB1 INA1 OUTB1 INA1 OUTB1 INA2 OUTB2 INA2 OUTB2 INA2 OUTB2 5kVRMS 5kVRMS 5kVRMS DIGITAL DIGITAL DIGITAL ISOLATOR ISOLATOR ISOLATOR INA3 OUTB3 INA3 OUTB3 OUTA1 INB1 INA4 OUTB4 OUTA1 INB1 OUTA2 INB2 ENA ENA GNDA GNDB GNDA GNDB GNDA GNDB 19-7067 Rev 7 11/20MAX14934MAX14936 Four-Channel, 5kV Digital Isolators RMS Absolute Maximum Ratings V to GNDA, V to GNDB .............................-0.3V to +6V Continuous Power Dissipation (T = +70C) DDA DDB A INA , ENA to GNDA ................................................-0.3V to +6V Wide SOIC (derate 14.1mW/C above +70C) ......1126.8mW INB , ENB to GNDB ...............................................-0.3V to +6V Operating Temperature Range ......................... -40C to +125C OUTA to GNDA ....................................-0.3V to (V + 0.3V) Maximum Junction Temperature .....................................+150C DDA OUTB to GNDB ....................................-0.3V to (V + 0.3V) Storage Temperature Range ............................ -65C to +150C DDB Short-Circuit Duration Lead Temperature (soldering, 10s) .................................+300C (OUTA to GNDA, OUTB to GNDB) ..................Continuous Soldering Temperature (reflow) ......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 16 Wide SOIC Package Code W16M+8 Outline Number 21-0042 Land Pattern Number 90-0107 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 71C/W JA Junction to Case ( ) 23C/W JC Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Maxim Integrated 2 www.maximintegrated.com