EVALUATION KIT AVAILABLE MAX15023 Wide 4.5V to 28V Input, Dual-Output Synchronous Buck Controller General Description Features 5.5V to 28V or 5V 10% Input Supply Range The MAX15023 dual, synchronous step-down controller operates from a 5.5V to 28V or 5V 10% input voltage 0.6V to (0.85 x V ) Adjustable Outputs IN range and generates two independent output voltages. Adjustable 200kHz to 1MHz Switching Frequency Each output is adjustable from 85% of the input voltage Guaranteed Monotonic Startup into a Prebiased Load down to 0.6V and supports loads of 12A or higher. Input Lossless, Cycle-by-Cycle, Low-Side, Source voltage ripple and total RMS input ripple current are Peak Current Limit with Adjustable, Temperature- reduced by interleaved 180 out-of-phase operation. Compensated Threshold Cycle-by-Cycle, Low-Side, Sink Peak Current-Limit The MAX15023 offers the ability to adjust the switching Protection frequency from 200kHz to 1MHz with an external resis- Proprietary Adaptive Internal Digital Soft-Start tor. The MAX15023s adaptive synchronous rectification eliminates the need for external freewheeling Schottky 1% Accurate Voltage Reference diodes. The device also utilizes the external low-side Internal Boost Diodes MOSFETs on-resistance as a current-sense element, Adaptive Synchronous Rectification Eliminates eliminating the need for a current-sense resistor. This pro- External Freewheeling Schottky Diodes tects the DC-DC components from damage during output Hiccup-Mode Short-Circuit Protection and Thermal overloaded conditions or output short-circuit faults without Shutdown requiring a current-sense resistor. Hiccup-mode current Power-Good Outputs and Analog Enable Inputs for limit reduces power dissipation during short-circuit con- Power Sequencing ditions. The MAX15023 includes two independent pow- Ordering Information er-good outputs and two independent enable inputs with precise turn-on/turn-off thresholds, which can be used for PART TEMP RANGE PIN-PACKAGE supply monitoring and for power sequencing. MAX15023ETG+ -40C to +85C 24 TQFN-EP* Additional protection features include cycle-by-cycle, MAX15023ETG/V+ -40C to +85C 24 TQFN-EP* low-side, sink peak current limit, and thermal shutdown. +Denotes a lead(Pb)-free/RoHS-compliant package. Cycle-by-cycle, low-side, sink peak current limit prevents *EP = Exposed pad. reverse inductor current from reaching dangerous levels /V denotes an automotive qualified package. when the device is sinking current from the output. The MAX15023 also allows prebiased startup without dis- Pin Configuration charging the output and features adaptive internal digital soft-start. This new proprietary feature enables monotonic TOP VIEW charging of externally large output capacitors at startup, and achieves good control of the peak inductor current 18 17 16 15 14 13 during hiccup-mode short-circuit protection. RT 19 12 LX2 SGND 20 11 BST2 The MAX15023 is available in a space-saving and ther- mally enhanced 4mm x 4mm, 24-pin TQFN-EP package. IN 21 10 DH2 MAX15023 The device operates over the -40C to +85C extended LIM2 22 9 DH1 temperature range. LIM1 23 8 BST1 *EP + COMP1 24 7 LX1 Applications 1 2 3 4 5 6 Point-of-Load Switches/Routers Regulators Power Modules TQFN Set-Top Boxes DSP Power Supplies *EXPOSED PAD (CONNECT TO GROUND). LCD TV Secondary Supplies 19-4219 Rev 3 4/15 COMP2 FB1 FB2 EN1 EN2 V CC PGOOD1 PGOOD2 DL1 DL2 PGND1 PGND2MAX15023 Wide 4.5V to 28V Input, Dual-Output Synchronous Buck Controller Absolute Maximum Ratings IN to SGND............................................................ -0.3V to +30V V Short Circuit to SGND ......................................... Continuou CC BST to V ......................................................... -0.3V to +30V V Input Current (IN = V , internal LDO not used) ..... 600mA CC CC CC LX to SGND............................................................ -1V to +30V PGOOD Sink Current ....................................................... 20mA EN to SGND .......................................................... -0.3V to +6V Continuous Power Dissipation (T = +70C)(Note 1) A PGOOD to SGND................................................ -0.3V to +30V 24-Pin TQFN-EP (derate 27.8mW/C above +70C) .. 2222.2mW BST to LX ............................................................ -0.3V to +6V Operating Temperature Range ............................ -40C to +85C DH to LX .........................................-0.3V to (V + 0.3V) Junction Temperature ...................................................... +150C BST DL to PGND ..........................................-0.3V to (V + 0.3V) Storage Temperature Range ............................. -60C to +150C CC SGND to PGND ................................................. -0.3V to +0.3V Lead Temperature (soldering, 10s) .................................. +300C V to SGND ............. -0.3V to the lower of +6V or (V + 0.3V) Soldering Temperature (reflow) ....................................... +260C CC IN All Other Pins to SGND ..............................-0.3V to (V + 0.3V CC Note 1: These power limits are due to the thermal characteristics of the package, absolute maximum junction temperature (150C), and the JEDEC 51-7 defined setup. Maximum power dissipation could be lower, limited by the thermal shutdown protection included in this IC. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 2) 24 TQFN-EP Junction-to-Ambient Thermal Resistance ( ) ........+36C/W JA Junction-to-Case Thermal Resistance ( ) ...............+8C/W JC Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to