MAX15036/MAX15037 19-4222 Rev 0 7/08 2.2MHz, 3A Buck or Boost Converters with an Integrated High-Side Switch General Description Features 4.5V to 5.5V or 5.5V to 23V Input Voltage Range The MAX15036/MAX15037 high-frequency, DC-DC con- verters with an integrated n-channel power MOSFET Output Voltage Adjustable Down to 0.6V (Buck) or provide up to 3A of load current. The MAX15036 Up to 28V (Boost) includes an internal power MOSFET to enable the 3A Output Current design of a nonsynchronous buck or boost topology Synchronous Rectifier Driver Output (MAX15037) power supply. The MAX15037 is for the design of a for Higher Efficiency synchronous buck topology power supply. These Resistor-Programmable Switching Frequency devices operate from a 4.5V to 5.5V or 5.5V to 23V from 200kHz to 2.2MHz input voltage and offer the ability to set the switching External Synchronization and Enable (On/Off) frequency from 200kHz to 2.2MHz with an external Inputs resistor. The voltage-mode architecture with a peak Clock Output for Driving Second Converter 180 switch current-limit scheme provides stable operation Out-Of-Phase (MAX15036) up to a 2.2MHz switching frequency. The MAX15036 Integrated 150m High-Side n-Channel Power includes a clock output for driving a second DC-DC MOSFET converter 180 out-of-phase and a power-on-reset (RESET) output. The MAX15037 includes a power-good Power-On-Reset Output (MAX15036)/Power-Good Output (MAX15037) output and a synchronous rectifier driver to drive an external low-side MOSFET in the buck converter config- Short-Circuit Protection (Buck)/Maximum Duty- uration for high efficiency. Cycle Limit (Boost) Thermal-Shutdown Protection The MAX15036/MAX15037 protect against overcurrent conditions by utilizing a peak current limit as well as Thermally Enhanced 16-Pin TQFN Package overtemperature shutdown providing a very reliable Dissipates 2.7W and compact power source for point-of-load regulation Ordering Information applications. Additional features include synchroniza- tion, internal digital soft-start, and an enable input. The PART TEMP RANGE PIN-PACKAGE MAX15036/MAX15037 are available in a thermally MAX15036ATE+ -40C to +125C 16 TQFN-EP* enhanced, space-saving 16-pin TQFN (5mm x 5mm) MAX15037ATE+ -40C to +125C 16 TQFN-EP* package and operate over the -40C to +125C tem- perature range. +Denotes a lead-free/RoHS-compliant package. *EP = Exposed pad. Applications Pin Configurations xDSL Modem Power Supplies TOP VIEW Automotive Radio Power Supplies Servers and Networks 12 11 10 9 IP Phones/WLAN Access Points 8 V SYNC 13 L Selector Guide 14 7 RESET V+ PART CONFIGURATION FEATURES MAX15036 Nonsynchronous RESET Output, BST/VDD 15 6 BYPASS MAX15036ATE Buck or Boost Clock Output EN 16 5 OSC EP* PGOOD Output, + MAX15037ATE Synchronous Buck Synchronous FET Driver 12 3 4 Pin Configurations continued at end of data sheet. THIN QFN *EXPOSED PAD. 5mm x 5mm Maxim Integrated Products 1 For pricing delivery, and ordering information please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. DRAIN SOURCE DRAIN PGND COMP SGND FB CKO2.2MHz, 3A Buck or Boost Converters with an Integrated High-Side Switch ABSOLUTE MAXIMUM RATINGS V+ to PGND............................................................-0.3V to +25V BYPASS to SGND..................................................-0.3V to +2.2V BST/VDD, DRAIN to SGND ....................................-0.3V to +30V V and BYPASS Short-Circuit Duration to SGND ......Continuous L SGND to PGND .....................................................-0.3V to +0.3V Continuous Power Dissipation (T = +70C) A BST/VDD to SOURCE...............................................-0.3V to +6V 16-Pin TQFN (derate 33mW/C above +70C) ..........2666mW SOURCE to SGND..................................................-0.6V to +25V Junction-to-Case Thermal Resistance ( ) (Note 1) JC SOURCE or DRAIN Maximum Peak Current...............5A for 1ms 16-Pin TQFN................................................................1.7C/W V to SGND ................-0.3V to the lower of +6V and (V+ + 0.3V) Junction-to-Ambient Thermal Resistance ( ) (Note 1) L JA SYNC, EN, DL, CKO, OSC, COMP, 16-Pin TQFN.................................................................30C/W FB to SGND...............................................-0.3V to (V + 0.3V) Operating Temperature Range .........................-40C to +125C L BYPASS, CKO, OSC, COMP, FB, EN, SYNC, RESET, Junction Temperature Range ............................-65C to +150C PGOOD Maximum Input Current .................................50mA Storage Temperature Range .............................-65C to +150C RESET, PGOOD to SGND ........................................-0.3V to +6V Lead Temperature (soldering, 10s) .................................+300C Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to