MAX15054 19-4747 Rev 0 9/09 High-Side MOSFET Driver for HB LED Drivers and DC-DC Applications General Description Features The MAX15054 is a high-side, n-channel MOSFET driver Input Voltage on High-Side n-Channel MOSFET Up S for high-voltage applications capable of switching at high to 60V frequencies. This device is controlled by a CMOS logic- S Up to 13.5V Logic Input Independent of Supply level signal referenced to ground and features a very Voltage short (12ns, typ) propagation delay from input to output. S 2A Peak Source and Sink Current The high-voltage operation and high source/sink-current capability make the MAX15054 ideal for HB LED drivers S 12ns Propagation Delay and DC-DC converters. S Rise and Fall Times of 6ns while Driving 1000pF The MAX15054 is well suited to complement other Maxim Capacitance LED driver products such as the MAX16814, MAX16838, S Low Input Capacitance MAX16833, MAX16834, and MAX16826. The MAX15054 adds a high-side driver to those products that include only a S Low-Side and High-Side Undervoltage Protection low-side driver it then allows for buck-boost configurations S Allows Buck-Boost Topology Referred to Ground for multistring drivers similar to the MAX16814, MAX16838, for LED Drivers and DC-DC Converters and MAX16826, and for buck-boost conversion with output S Allows Buck-Boost Topology for Multistring LED referenced to ground for single-string drivers such as the Drivers MAX16834 and MAX16833. S 6-Pin SOT23 Package The MAX15054 is available in the industry-standard 6-pin SOT23 package and operates over the -40NC to +125NC Ordering Information automotive temperature range. PIN- TOP Applications PART TEMP RANGE PACKAGE MARK HB LED Drivers for Single and Multiple Strings MAX15054AUT+ -40NC to +125NC 6 SOT23 ACOM LED Backlight Drivers +Denotes a lead(Pb)-free/RoHS-compliant package. High-Side Driver for DC-DC Converters Pin Configuration appears at end of data sheet. (Buck, Buck-Boost, Half-Bridge, Full-Bridge) Typical Operating Circuits VIN D1 BST V DD C BST C 1 MAX15054 HDRV Q1 LX GND HI D L1 3 C5 D 2 R 8 C 2 IN CFB GATE NDRV R 1 DRAIN R9 EN VCC OV R 2 C 3 R OUT1 3 VDRV OUT2 C 4 R7 MAX16838 ISET FLT DIM CS COMP RT R4 R6 R5 SGND PGND LEDGND C4 Typical Operating Circuits continued at end of data sheet. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.High-Side MOSFET Driver for HB LED Drivers and DC-DC Applications ABSOLUTE MAXIMUM RATINGS V to GND .............................................................-0.3V to +6V Thermal Resistance (Note 1) DD LX to GND ................................................................-2V to +65V Junction-to-Ambient Thermal Resistance (B ) .........115NC/W JA HDRV to LX ................................................-0.3V to (V + 0.3V) Junction-to-Case Thermal Resistance (B ) ................80NC/W DD JC BST to LX .................................................................-0.3V to +6V Operating Temperature Range ........................ -40NC to +125NC HI to GND ..............................................................-0.3V to +15V Maximum Junction Temperature .....................................+150NC dV/dt at LX ........................................................................50V/ns Storage Temperature Range ............................ -65NC to +150NC Peak Current into HDRV (< 100ns) ......................................Q2A Lead Temperature (soldering, 10s) .................................+300NC Continuous Current into HDRV .....................................Q100mA Continuous Power Dissipation (T = +70NC) A 6-Pin SOT23 (derate 8.7mW/NC above +70NC) .........695.7mW Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (V = V = 5V, V = V = 0V, T = T = -40C to +125C, unless otherwise noted. Typical values are at T = T = +25C, DD BST LX GND A J A J unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Operating Supply Voltage V 4.6 5.5 V DD V Quiescent Supply Current I No switching 40 75 FA DD DD BST Quiescent Supply Current I No switching 65 125 FA BST BST Operating Supply Current I f = 500kHz, no load 0.3 1.3 mA BSTO SW V Undervoltage Lockout DD V V rising 3.92 4.22 4.56 V DD UVLO DD Threshold V Undervoltage Lockout DD 0.2 V Threshold Hysteresis BST-to-LX Undervoltage V BST BST rising 3.54 3.82 4.1 V Lockout Threshold UVLO BST-to-LX Undervoltage 0.2 V Lockout Threshold Hysteresis LOGIC INPUT (HI) HI Logic-High Threshold V 3.9 V IH HI Logic-Low Threshold V 1.8 V IL HI Logic-Input Hysteresis 0.9 V HI Input Current I HI = GND -2 +2 FA IN HI Input Resistance R 300 kI IN DRIVER LX Withstand Voltage V 60 V LX MAX BST Withstand Voltage V 65 V BST MAX LX Pulldown Current V = 2.5V 500 740 1100 FA LX Driver Output Resistance V - V = 4.5V, T = +25NC 1 1.5 BST LX A R I ON HP (Sourcing) 100mA sourcing 1.25 2 T = +125NC A 0.75 1 Driver Output Resistance V - V = 4.5V, T = +25NC BST LX A R I ON HN (Sinking) 100mA sinking T = +125NC 1 1.5 A 2 MAX15054