EVALUATION KIT AVAILABLE MAX16814 Integrated, 4-Channel, High-Brightness LED Driver with High-Voltage DC-DC Controller General Description Benefits and Features The MAX16814 high-efficiency, high-brightness LED (HB Cost-Effective 4-Channel Linear LED Current Sinks LED) driver provides up to four integrated LED current- for Wide Range of LED Lighting Applications sink channels. An integrated current-mode switching Drives One to Four LED Strings 4.75V to 40V Input Voltage Range DC-DC controller drives a DC-DC converter that provides the necessary voltage to multiple strings of HB LEDs. Full-Scale LED Current Adjustable from 20mA to 150mA The MAX16814 accepts a wide 4.75V to 40V input volt- age range and withstands direct automotive load-dump 5000:1 PWM Dimming at 200Hz Less than 40A Shutdown Current events. The wide input range allows powering HB LEDs for small to medium-sized LCD displays in automotive Minimal Component Count Saves Cost and Space and general lighting applications. Internal MOSFET for Each Channel An internal current-mode switching DC-DC control- Internal Current-Mode Switching DC-DC Controller ler supports the boost, coupled-inductor boost-buck, Supporting Boost, Coupled-Inductor Boost-Buck, or or SEPIC topologies and operates in an adjustable SEPIC Topologies frequency range between 200kHz and 2MHz. It can 200kHz to 2MHz Programmable Switching also be used for single-inductor boost-buck topology in Frequency for Optimizing Size vs. Efficiency conjunction with the MAX15054 and an additional External Switching-Frequency Synchronization MOSFET. The current-mode control with programma- Protection Features and Wide Operating ble slope compensation provides fast response and Temperature Range improves Reliability simplifies loop compensation. The MAX16814 also Open-Drain Fault-Indicator Output features an adaptive output-voltage-control scheme that Open-LED and LED-Short Detection and Protection minimizes the power dissipation in the LED current-sink Overtemperature Protection paths. Available in Thermally Enhanced 20-Pin TQFN, The MAX16814 consists of four identical linear current QFND, and TSSOP Packages Operation Over -40C to +125C Temperature Range source channels to drive four strings of HB LEDs. The channel current is adjustable from 20mA to 150mA with an accuracy of 3% using an external resistor. The external resistor sets all 4-channel currents to the same Applications value. The device allows connecting multiple channels Automotive Displays LED Backlights in parallel to achieve higher current per LED string. The Automotive RCL, DRL, Front Position, and Fog Lights MAX16814 also features pulsed dimming control on all LCD TV and Desktop Display LED Backlights four channels through a logic input (DIM). In addition, Architectural, Industrial, and Ambient Lighting the MAX16814A and MAX16814U include a unique feature that allows a very short minimum pulse width as low as 1s. The MAX16814 includes output overvoltage, open- LED detection and protection, programmable shorted- Typical Operating Circuit and Ordering Information appear LED detection and protection, and overtemperature at end of data sheet. protection. The device operates over the -40NC to +125NC automotive temperature range. The MAX16814 is available in 6.5mm x 4.4mm, 20-pin TSSOP, 4mm x 4mm, 20-pin TQFN and QFND packages. 19-4722 Rev 11 3/16MAX16814 Integrated, 4-Channel, High-Brightness LED Driver with High-Voltage DC-DC Controller Absolute Maximum Ratings IN to SGND ............................................................-0.3V to +45V Continuous Power Dissipation (T = +70NC) (Note 1) A 20-Pin TQFN (derate 25.6mW/NC above +70NC) .......2051mW EN to SGND ...............................................-0.3V to (V + 0.3V) IN PGND to SGND ....................................................-0.3V to +0.3V 20-Pin Side-Wettable QFND (derate 26.5mW/NC above +70NC) ............................2050mW LEDGND to SGND ...............................................-0.3V to +0.3V OUT to LEDGND .................................................-0.3V to +45V 26-Pin TSSOP (derate 26.5mW/NC above +70NC) .....2122mW Operating Temperature Range V to SGND ..........-0.3V to the lower of (V + 0.3V) and +6V CC IN MAX16814A .............................................. -40NC to +125NC DRV, FLT, DIM, RSDT, OVP to SGND .....................-0.3V to +6V MAX16814BE ............................................. -40NC to +85NC CS, RT, COMP, SETI to SGND ................. -0.3V to (V + 0.3V) CC MAX16814U and MAX16814BU ................0NC to +85NC NDRV to PGND .......................................-0.3V to (V + 0.3V) DRV Junction Temperature .....................................................+150NC NDRV Peak Current (< 100ns) .............................................Q3A Storage Temperature Range ............................ -65NC to +150NC NDRV Continuous Current ............................................Q100mA Lead Temperature (soldering, 10s) ................................+300NC OUT Continuous Current .............................................Q175mA Soldering Temperature (reflow) ......................................+260NC V Short-Circuit Duration ........................................Continuous CC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) 20 TQFN/QFND 20 TSSOP Junction-to-Ambient Thermal Resistance (B ) ........ +39NC/W Junction-to-Ambient Thermal Resistance (B ) ..... +37.7NC/W JA JA Junction-to-Case Thermal Resistance (B ) ............... +6NC/W Junction-to-Case Thermal Resistance (B ) ............ +2.0NC/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to