EVALUATION KIT AVAILABLE MAX16814 Integrated, 4-Channel, High-Brightness LED Driver with High-Voltage DC-DC Controller General Description Features The MAX16814 high-efficiency, high-brightness LED (HB S 4-Channel Linear LED Current Sinks with Internal LED) driver provides up to four integrated LED current- MOSFETs sink channels. An integrated current-mode switching Full-Scale LED Current Adjustable from 20mA DC-DC controller drives a DC-DC converter that pro- to 150mA vides the necessary voltage to multiple strings of HB Drives One to Four LED Strings LEDs. The MAX16814 accepts a wide 4.75V to 40V input voltage range and withstands direct automotive load- S Boost, SEPIC, or Coupled-Inductor Boost-Buck dump events. The wide input range allows powering HB Current-Mode DC-DC Controller LEDs for small to medium-sized LCD displays in automo- 200kHz to 2MHz Programmable Switching tive and general lighting applications. Frequency An internal current-mode switching DC-DC controller External Switching Frequency Synchronization supports the boost, coupled-inductor boost-buck, or S Adaptive Output-Voltage Optimization to Minimize SEPIC topologies and operates in an adjustable fre- Power Dissipation quency range between 200kHz and 2MHz. It can also be used for single-inductor boost-buck topology in conjunc- S 4.75V to 40V Operating Input Voltage Range tion with the MAX15054 and an additional MOSFET. The S Less than 40A Shutdown Current current-mode control with programmable slope com- pensation provides fast response and simplifies loop S 5000:1 PWM Dimming at 200Hz (MAX16814A compensation. The MAX16814 also features an adaptive and MAX16814U Only) output-voltage control scheme that minimizes the power S Open-Drain Fault Indicator Output dissipation in the LED current-sink paths. S Open-LED and LED Short Detection and The MAX16814 consists of four identical linear current source channels to drive four strings of HB LEDs. The Protection channel current is adjustable from 20mA to 150mA with S Overtemperature Protection an accuracy of 3% using an external resistor. The S Thermally Enhanced, 20-Pin TQFN, QFND, and external resistor sets all 4-channel currents to the same value. The device allows connecting multiple channels TSSOP Packages in parallel to achieve higher current per LED string. The Ordering Information MAX16814 also features pulsed dimming control, on all four channels through a logic input (DIM). In addition,the PART TEMP RANGE PIN-PACKAGE MAX16814A and MAX16814U include a unique MAX16814ATP+ -40C to +125C 20 TQFN-EP* feature that allows a very short minimum pulse width as MAX16814ATP/V+ -40C to +125C 20 TQFN-EP* low as 1s. MAX16814AGP/VY+ -40C to +125C 20 QFND-EP* (SW) The MAX16814 includes an output overvoltage, open- MAX16814AUP+ -40C to +125C 20 TSSOP-EP* LED detection and protection, programmable shorted MAX16814AUP/V+ -40C to +125C 20 TSSOP-EP* LED detection and protection, and overtemperature pro- MAX16814BETP+ -40C to +85C 20 TQFN-EP* tection. The device operates over the -40NC to +125NC MAX16814BEUP+ -40C to +85C 20 TSSOP-EP* automotive temperature range. The MAX16814 is avail- MAX16814BUTP+ 0C to +85C 20 TQFN-EP* able in 6.5mm x 4.4mm, 20-pin TSSOP, 4mm x 4mm, MAX16814BUUP+ 0C to +85C 20 TSSOP-EP* 20-pin TQFN and QFND packages. MAX16814UTP+ 0C to +85C 20 TQFN-EP* Applications MAX16814UUP+ 0C to +85C 20 TSSOP-EP* Automotive Displays LED Backlights +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. Automotive RCL, DRL, Front Position, and Fog /V Denotes an automotive qualified part, (SW) = side wettable. Lights LCD TV and Desktop Display LED Backlights Typical Operating Circuit and Pin Configurations appear at Architectural, Industrial, and Ambient Lighting end of data sheet. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-4722 Rev 8 4/13 MAX16814 Integrated, 4-Channel, High-Brightness LED Driver with High-Voltage DC-DC Controller ABSOLUTE MAXIMUM RATINGS IN to SGND ............................................................-0.3V to +45V Continuous Power Dissipation (T = +70NC) (Note 1) A 20-Pin TQFN (derate 25.6mW/NC above +70NC) .......2051mW EN to SGND ...............................................-0.3V to (V + 0.3V) IN PGND to SGND ....................................................-0.3V to +0.3V 20-Pin Side-Wettable QFND (derate 26.5mW/NC above +70NC) ............................2050mW LEDGND to SGND ...............................................-0.3V to +0.3V OUT to LEDGND .................................................-0.3V to +45V 26-Pin TSSOP (derate 26.5mW/NC above +70NC) .....2122mW Operating Temperature Range V to SGND ..........-0.3V to the lower of (V + 0.3V) and +6V CC IN MAX16814A .............................................. -40NC to +125NC DRV, FLT, DIM, RSDT, OVP to SGND .....................-0.3V to +6V MAX16814BE ............................................. -40NC to +85NC CS, RT, COMP, SETI to SGND ................. -0.3V to (V + 0.3V) CC MAX16814U and MAX16814BU ................0NC to +85NC NDRV to PGND .......................................-0.3V to (V + 0.3V) DRV Junction Temperature .....................................................+150NC NDRV Peak Current (< 100ns) .............................................Q3A Storage Temperature Range ............................ -65NC to +150NC NDRV Continuous Current ............................................Q100mA Lead Temperature (soldering, 10s) ................................+300NC OUT Continuous Current .............................................Q175mA Soldering Temperature (reflow) ......................................+260NC V Short-Circuit Duration ........................................Continuous CC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) 20 TQFN/QFND 20 TSSOP Junction-to-Ambient Thermal Resistance (B ) ........ +39NC/W Junction-to-Ambient Thermal Resistance (B ) ..... +37.7NC/W JA JA Junction-to-Case Thermal Resistance (B ) ............... +6NC/W Junction-to-Case Thermal Resistance (B ) ............ +2.0NC/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to