EVALUATION KIT AVAILABLE 2MHz, High-Brightness LED Drivers MAX16832A/MAX16832C with Integrated MOSFET and High-Side Current Sense General Description Benefits and Features Cost-Effective Solution for a Wide Range of LED The MAX16832A/MAX16832C step-down constant-cur- Lighting Applications rent high-brightness LED (HB LED) drivers provide a cost-effective design solution for automotive 6.5V to 65V Input Voltage Range interior/exterior lighting, architectural and ambient light- Output Current Up to 1A ing, LED bulbs, and other LED illumination applications. 3% LED Current Accuracy The MAX16832A/MAX16832C operate from a +6.5V to Selectable Dimming Options: Linear or PWM +65V input voltage range and can provide an output current up to 700mA, if operated up to a temperature of Minimal Component Count Saves Cost and Space +125C, or up to a 1A if operated up to a temperature On-Board 65V, 0.45 Power MOSFET of +105C. A high-side current-sense resistor adjusts Resistor-Programmable Constant LED Current the output current, and a dedicated pulse-width modu- Integrated High-Side Current Sense with 200mV lation (PWM) input enables pulsed LED dimming over a wide range of brightness levels. Current-Sense Reference Hysteretic Control: Up to 2MHz Switching These devices are well suited for applications requiring a wide input voltage range. The high-side current sens- Frequency ing and an integrated current-setting circuitry minimize Protection Features and Wide Operating the number of external components while delivering an Temperature Range Improves Lighting Fixture average output current with 3% accuracy. A hysteretic Reliability control method ensures excellent input supply rejection Thermal-Foldback Protection Dims LEDs to and fast response during load transients and PWM dim- Minimize Overheating ming. The MAX16832A allows 10% current ripple, and the MAX16832C allows 30% current ripple. Both Thermal-Shutdown Protection devices operate up to a 2MHz switching frequency, Available in a Thermally Enhanced 8-Pin SO Package thus allowing the use of small-sized components. Operation over -40C to +125C Temperature Range The MAX16832A/MAX16832C offer an analog dimming Ordering Information and Pin Configuration appear at end feature that reduces the output current by applying an of data sheet. external DC voltage below the internal 2V threshold volt- age from TEMP I to GND. TEMP I also sources 25A to Typical Application Circuit a negative temperature coefficient (NTC) thermistor con- nected between TEMP I and GND, thus providing an analog thermal-foldback feature that reduces the LED D1 current when the temperature of the LED string exceeds a specified temperature point. Additional features HB LEDs include thermal-shutdown protection. V IN R L1 SENSE The MAX16832A/MAX16832C operate over the -40C to +125C automotive temperature range and are available in a thermally enhanced 8-pin SO package. C2 Applications 1 8 Architectural, Industrial, and Ambient Lighting CS TEMP I ON * Automotive RCL, DRL, and Fog Lights NTC 2 7 OFF IN DIM Heads-Up Displays MAX16832A C1 MAX16832C 3 6 Indicator and Emergency Lighting GND LX PoE Powered Lighting 4 5 PGND LX * OPTIONAL 19-4140 Rev 7 2/152MHz, High-Brightness LED Drivers MAX16832A/MAX16832C with Integrated MOSFET and High-Side Current Sense Absolute Maximum Ratings IN, CS, LX, DIM to GND .........................................-0.3V to +70V Operating Temperature Range TEMP I to GND .......................................................-0.3V to +6V 700mA (max) Output Current ........................-40C to +125C PGND to GND ......................................................-0.3V to +0.3V 1A (max) Output Current ...............................-40C to +105C CS to IN .................................................................-0.3V to +0.3V Junction Temperature......................................................+150C Maximum Current into Any Pin Storage Temperature Range .............................-65C to +150C (except IN, LX, and PGND).............................................20mA Soldering (reflow).............................................................+260C Continuous Power Dissipation (T = +70C) Lead Temperature (soldering, 10s) .................................+300C A 8-Pin SO (derate 18.9mW/C above +70C)...........1509.4mW Pin-to-Pin ESD Ratings......................................................2.5kV Package Thermal Characteristics (Note 1) SO-EP Junction-to-Ambient Thermal Resistance ( )...............+53C/W JA Junction-to-Case Thermal Resistance ( )......................+5C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Electrical Characteristics (V = +24V, V = V , T = T = -40C to +125C, unless otherwise noted. Typical values are at T = +25C.) IN DIM IN A J A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Input Voltage Range V 6.5 65 V IN Ground Current No switching 1.5 mA Supply Current V < 0.6V, V = 12V 350 A DIM IN UNDERVOLTAGE LOCKOUT (UVLO) V = V - 100mV, V rising until V < CS IN IN LX 6.25 6.5 0.5V IN Undervoltage Lockout UVLO V V = V - 100mV, V falling until V > CS IN IN LX 6.0 0.5V IN Undervoltage-Lockout Hysteresis 0.5 V SENSE COMPARATOR MAX16832A, V - V rising from 140mV IN CS 197 205 213 until V > 0.5V , V = 5V LX IN DIM Sense Voltage Threshold High V mV SNSHI MAX16832C, V - V rising from 140mV IN CS 218 230 236 until V > 0.5V , V = 5V LX IN DIM MAX16832A, V - V falling from 260mV IN CS 185 190 198 until V < 0.5V , V = 5V LX IN DIM Sense Voltage Threshold Low V mV SNSLO MAX16832C, V - V falling from 260mV IN CS 166 170 180 until V < 0.5V , V = 5V LX IN DIM Falling edge of V - V from 140mV to IN CS Propagation Delay to Output High t 50 ns DPDH 260mV to V > 0.5V LX IN Rising edge of V - V from 260mV to CS IN Propagation Delay to Output Low t 50 ns DPDL 140mV to V < 0.5V LX IN CS Input Current I V - V = 200mV, V = V 3.5 A CSIN IN CS IN CS 2 www.maximintegrated.com Maxim Integrated 2