MAX16945 30mA Inverting Charge Pump in SOT23 for EMI-Sensitive Automotive Applications General Description Features The MAX16945 ultra-small, monolithic, CMOS charge- +1.4V to +5.5V Input Voltage Range pump voltage inverter accepts an input voltage ranging 30mA Guaranteed Output Current at +105C from +1.4V to +5.5V. This device features an ultra-low Slew-Rate Limited to Reduce EMI 12 output resistance, permitting loads of up to 30mA at +105C with maximum efficiency. The MAX16945 0.1A Logic-Controlled Shutdown operates at a frequency of 125kHz, allowing use of Low 12 Output Resistance small external components. Its small external compo- nents, micropower shutdown mode, and wide tempera- Startup Current Limited ture range make this device ideal for both automotive 6-Pin SOT23 Package and industrial applications. AEC-Q100 Qualified Oscillator control circuitry and four power MOSFET switches are included on-chip. The MAX16945 comes in a 6-pin SOT23 package and operates over -40C to +105C. Ordering Information Applications Automotive and Industrial Equipment PART TEMP RANGE PIN-PACKAGE Small LCD Panels MAX16945TGUT -40C to +105C 6 SOT23 Negative Supply from +5V or +3.3V Logic MAX16945TGUT/V+ -40C to +105C 6 SOT23 Supplies Denotes an RoHS-compliant device that may include lead that is exempt under RoHS requirements. GaAsFET Bias Supplies /V denotes an automotive qualified part. Handy-Terminals, PDAs +Denotes a lead(Pb)-free/RoHS-compliant package. Note: The MAX16945 requires a special solder temperature profile described in the Absolute Maximum Ratings section. Typical Operating Circuit Pin Configuration 1F TOP VIEW C1+ C1- NEGATIVE INPUT OUT 1 6 C1+ OUTPUT 1.5V TO 5.5V OUT IN -1 V IN 60mA MAX16945 IN 2 5 SHDN MAX16945 1F SHDN ON C1- 3 GND 4 OFF GND SOT23 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-4241 Rev 2 6/15MAX16945 30mA Inverting Charge Pump in SOT23 for EMI-Sensitive Automotive Applications ABSOLUTE MAXIMUM RATINGS IN to GND.................................................................-0.3V to +6V Junction-to-Case Thermal Resistance ( ) (Note 1) JC C1+, SHDN to GND .......................................0.3V to (V +0.3V) 6-Pin SOT23 ................................................................39C/W IN C1- to GND...............................................(V - 0.3V) to +0.3V Junction-to-Ambient Thermal Resistance ( ) (Note 1) OUT JA OUT to GND .............................................................+0.3V to -6V 6-Pin SOT23 ..............................................................134C/W OUT Output Current............................................................90mA Operating Temperature Range .........................-40C to +105C OUT Short Circuit to GND..............................................Indefinite Junction Temperature......................................................+150C Continuous Power Dissipation (T = +70C) Storage Temperature Range ............................-65C to +150C A 6-Pin SOT23 (derate 7.4mW/C above +70C) (Note 1) .....595mW Lead Temperature.......................................................... (Note 2) Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. Maxim recommends the use of the solder profiles recom- mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow processes. Preheating, per this standard, is required. Hand or wave soldering is not recommended. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (Circuit of Figure 1, C1 = C2 =2.2F, V = V = +5V, V = 0, T = 0C to +105C, unless otherwise noted. Typical values are IN SHDN GND A at T = +25C.) A PARAMETER CONDITIONS MIN TYP MAX UNITS T = +25C 1.4 5.5 A Supply Voltage Range R = 5k V L T = 0C to +105C 1.5 5.5 A Quiescent Supply Current T = +25C (Note 3) 950 1700 A A T = +25C 0.002 1 A Shutdown Supply Current V = 0 A SHDN T = 0C to +105C 0.03 A Short-Circuit Current Output shorted to ground, T = +25C 170 mA A Oscillator Frequency T = +25C 70 125 180 kHz A Voltage Conversion Efficiency I = 0, T = +25C 99 99.9 % OUT A T = +25C 12 25 A Output Resistance I = 30mA ( N ote 4) OUT T = 0C to +105C 36 A V = 0, OUT is internally pulled to GND SHDN OUT-to-GND Shutdown Resistance 3 8.5 in shutdown 2.5V V 5.5V 2.0 IN SHDN Input Logic-High V V V 2.5V V - 0.2 IN(MIN) IN IN 2.5V V 5.5V 0.6 IN SHDN Input Logic-Low V V V 2.5V 0.2 IN(MIN) IN T = +25C -100 +0.05 +100 A SHDN Bias Current SHDN = GND or IN nA T = 0C to +105C 10 A Wake-Up Time from Shutdown I = 15mA 100 s OUT 2 Maxim Integrated