EVALUATION KIT AVAILABLE MAX16977 36V, 2A, 2.2MHz Step-Down Converter with Low Operating Current General Description Benefits and Features The MAX16977 is a 2A, current-mode, step-down Supports Up to 2A Loads without External FET converter with an integrated high-side switch. The device Saves Space and Cost is designed to operate with input voltages from 3.5V to Integrated 2A Internal High-Side (70mI typ) Switch 36V while using only 30FA quiescent current at no load. Fast Load-Transient Response and Current-Mode The switching frequency is adjustable from 1MHz to Architecture 2.2MHz by an external resistor and can be synchronized Direct Car Battery to Sub-5V Rail Conversion at to an external clock. The output voltage is pin selectable Beyond 2MHz Reduces External Component Count to be 5V fixed or adjustable from 1V to 10V. The wide 5V Fixed or 1V to 10V Adjustable Output Voltage input voltage range along with its ability to operate at High Duty Cycle During Undervoltage Transients high duty cycle during undervoltage transients makes the Robust Input Voltage Up to 36V Supports Automotive device ideal for automotive and industrial applications. Applications The device operates in skip mode for reduced current Wide 3.5V to 36V Input Voltage Range consumption in light-load applications. Protection features 42V Input Transients Tolerance include overcurrent limit, overvoltage, and thermal shut- Overvoltage, Undervoltage, Overtemperature, and down with automatic recovery. The device also features Short-Circuit Protections a power-good monitor to ease power-supply sequencing. Meets Tight OEM Power-Consumption Requirements The device operates over the -40NC to +125NC automo- with Low I Q tive temperature range, and is available in 16-pin TSSOP 30A Standby Mode Operating Current and TQFN (5mm x 5mm) packages with exposed pads. 5A Typical Shutdown Current Advanced Clock Capabilities Offer Further Reduction Applications in EMI if Necessary to Enable Noise-Free System Automotive Design Industrial Adjustable Switching Frequency (1MHz to 2.2MHz) High-Voltage Input DC-DC Converters Frequency-Synchronization Input Spread Spectrum (Optional) Point-of-Load Applications Ordering Information appears at end of data sheet. Typical Application Circuit V BAT C C IN1 IN2 C 47F 4.7F BST 0.1F SUP SUPSW L1 V EN BST OUT 2.2H 5V AT 2A FSYNC LX V C OUT OUT D1 MAX16977 22F OUT COMP C COMP1 V R BIAS FOSC 2.2nF C COMP2 12kI V BIAS R 12pF COMP FOSC FB 20kI R PGOOD 10kI BIAS PGOOD POWER GOOD C BIAS GND 1F 19-5844 Rev 4 1/17MAX16977 36V, 2A, 2.2MHz Step-Down Converter with Low Operating Current Absolute Maximum Ratings SUP, SUPSW, LX, EN to GND ...............................-0.3V to +42V Continuous Power Dissipation (T = +70NC) A o o SUP to SUPSW .....................................................-0.3V to +0.3V TSSOP (derate 26.1mW/ C above +70 C) .......... 2088.8mW* o o BST to GND ...........................................................-0.3V to +47V TQFN (derate 28.6mW/ C above +70 C) ............ 2285.7mW* BST to LX ...............................................................-0.3V to +6V Operating Temperature Range ........................ -40NC to +125NC OUT to GND ..........................................................-0.3V to +12V Junction Temperature .....................................................+150NC FOSC, COMP, BIAS, FSYNC, I.C., PGOOD, Storage Temperature Range ............................ -65NC to +150NC FB to GND ............................................................-0.3V to +6V Lead Temperature (soldering, 10s) ................................+300NC o LX Continuous RMS Current ...................................................3A Soldering Temperature (reflow) ..................................... +260 C Output Short-Circuit Duration ....................................Continuous *As per the JEDEC 51 standard (multilayer board). Package Thermal Characteristics (Note 1) TSSOP TQFN Junction-to-Ambient Thermal Resistance (B ) .......38.3NC/W Junction-to-Ambient Thermal Resistance (B ) ..........35NC/W JA JA Junction-to-Case Thermal Resistance (B ) .................3NC/W Junction-to-Case Thermal Resistance (B ) ..............2.7NC/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Electrical Characteristics (V = V = 14V, V = 14V, C = 1FF, R = 12kI, T = T = -40NC to +125NC, unless otherwise noted. Typical values SUP SUPSW EN BIAS FOSC A J are at T = +25NC.) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS V , SUP Supply Voltage Range 3.5 36 V V SUPSW Load-Dump Event Supply V t < 1s 42 V SUP LD LD Voltage I I = 1.5A 3.5 mA SUP LOAD Standby mode, no load, V = 5V 30 60 OUT Supply Current I FA SUP STANDBY Standby mode, no load, V = 5V, OUT 30 45 T = +25C A Shutdown Supply Current I V = 0V 5 12 FA SHDN EN BIAS Regulator Voltage V V = V = 6V to 36V 4.7 5 5.3 V BIAS SUP SUPSW BIAS Undervoltage Lockout V V rising 2.9 3.1 3.3 V UVBIAS BIAS BIAS Undervoltage-Lockout 400 mV Hysteresis Thermal Shutdown Threshold +175 NC Thermal-Shutdown Threshold 15 NC Hysteresis Maxim Integrated 2 www.maximintegrated.com