MAX17009 19-0814 Rev 0 5/07 AMD Mobile Serial VID Dual-Phase Fixed-Frequency Controller General Description Features The MAX17009 is a 2-phase, step-down interleaved, Dual-Output, Fixed-Frequency, Core Supply fixed-frequency controller for AMDs serial VID inter- Controller face (SVI) CPU core supplies. Power-on detection of Separate or Combinable Outputs Detected at the CPU configures the MAX17009 as two independent Power-Up single-phase regulators for a dual CPU core applica- Reference Buffer Output for NB Controller tion, or one high-current, dual-phase, combined-output regulator for a unified core application. A reference 0.4% V Accuracy Over Line, Load, and OUT buffer output (NBV BUF) sets the voltage-regulation Temperature level for a North Bridge (NB) regulator, completing the AMD SVI-Compliant Serial Interface total CPU cores and NB power requirements. 7-Bit On-Board DAC: 0 to +1.550V Output Adjust The MAX17009 is fully AMD SVI compliant. Output volt- Range ages are dynamically changed through a 2-wire serial Dynamic Phase Selection Optimizes Active/Sleep interface, allowing the switching regulator and the refe- Efficiency rence buffer to be individually programmed to different voltages. A programmable slew-rate controller enables Transient Phase Repeat Reduces Output controlled transitions between VID codes, soft-start limits Capacitance the inrush current, and soft-shutdown brings the output True Out-of-Phase Operation Reduces Input voltage back down to zero without any negative ring. Capacitance Transient phase repeat improves the response of the Integrated Boost Switches fixed-frequency architecture. Independently program- Programmable AC and DC Droop mable AC and DC droop and selectable offset improve stability and reduce the total output-capacitance Programmable 100kHz to 1.2MHz Switching requirement. A thermistor-based temperature sensor Frequency allows for a programmable thermal-fault output Accurate Current Balance and Current Limit (VRHOT). The MAX17009 includes thermal-fault protec- Adjustable Slew-Rate Control tion, undervoltage protection (UVP), and selectable out- put overvoltage protection (OVP). When any of these Power-Good (PWRGD) and Thermal-Fault protection features detect a fault, the controller shuts (VRHOT) Outputs down. True differential current sensing improves cur- System Power-OK (PGD IN) Input rent limit, load-line accuracy, and current balance when Drives Large Synchronous-Rectifier MOSFETs operating in combined mode. The MAX17009 has an adjustable switching frequency, allowing 100kHz to 4V to 26V Battery Input-Voltage Range 1.2MHz per-phase operation. Overvoltage, Undervoltage, and Thermal-Fault Protection Applications Power Sequencing and Timing Mobile AMD SVI Core Supply Soft-Startup and Soft-Shutdown Multiphase CPU Core Supply < 1A Typical Shutdown Current Voltage-Positioned, Step-Down Converters Notebook/Desktop Computers Ordering Information PIN- PKG PART TEMP RANGE PACKAGE CODE 40 TQFN-EP*, MAX17009GTL+ -40C to +105C T4055-1 5mm x 5mm Pin Configuration appears at end of data sheet. +Denotes a lead-free package. *EP = Exposed pad. AMD is a registered trademark of Advanced Micro Devices, Inc. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLEAMD Mobile Serial VID Dual-Phase Fixed-Frequency Controller ABSOLUTE MAXIMUM RATINGS V V V , V to GND ............................-0.3V to +6V DH1 to LX1 .............................................-0.3V to (V + 0.3V) DD1, DD2, CC DDIO BST1 PWRGD to GND ......................................................-0.3V to +6V DH2 to LX2 .............................................-0.3V to (V + 0.3V) BST2 FBDC , FBAC , PRO to GND ...................-0.3V to (V + 0.3V) DL1 to GND .............................................-0.3V to (V + 0.3V) CC DD1 GNDS2, THRM, VRHOT to GND .............................-0.3V to +6V DL2 to GND .............................................-0.3V to (V + 0.3V) DD2 CSP , CSN , ILIM to GND ......................................-0.3V to +6V GNDS1, GNDS NB to GND .................................-0.3V to +0.3V SVC, SVD, PGD IN to GND ....................................-0.3V to +6V Continuous Power Dissipation (T = +70C) A NBV BUF, NBSKP to GND .......................-0.3V to (V + 0.3V) Multilayer PCB (derate 35.7mW/C above +70C) .....2857mW CC REF, OSC, TIME, OPTION to GND ..........-0.3V to (V + 0.3V) Single-Layer PCB (derate 22.2mW/C above +70C)..1778mW CC BST1, BST2 to GND ..............................................-0.3V to +36V Operating Temperature Range .........................-40C to +105C BST1 to V ..........................................................-0.3V to +30V Junction Temperature......................................................+150C DD1 BST2 to V ..........................................................-0.3V to +30V Storage Temperature Range .............................-65C to +150C DD2 LX1 to BST1..............................................................-6V to +0.3V Lead Temperature (soldering, 10s) .................................+300C LX2 to BST2..............................................................-6V to +0.3V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (Circuit of Figure 2, V = 12V, V = V = V = SHDN = PGD IN = 5V, V = 1.8V, PRO = OPTION = GNDS NB = GNDS = IN CC DD1 DD2 DDIO GND , FBDC = FBAC = CSP = CSN = 1.2V, all DAC codes set to the 1.2V code, T = 0C to +85C, unless otherwise noted. A Typical values are at T = +25C.) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS INPUT SUPPLIES V Drain of external high-side MOSFET 4 26 IN Input Voltage Range V V , V , V 4.5 5.5 V BIAS CC DD1 DD2 V 1.0 2.7 DDIO V Undervoltage-Lockout CC V V rising 50mV typical hysteresis 4.10 4.25 4.45 V UVLO CC Threshold Falling edge, typical hysteresis = 1.1V, V Power-On Reset CC V faults cleared and DL forced high when 1.8 V CC Threshold V falls below this level CC V Undervoltage-Lockout DDIO V rising 100mV typical hysteresis 0.7 0.8 0.9 V DDIO Threshold Skip mode, FBDC forced above their Quiescent Supply Current (V)I 510 mA CC CC regulation points Quiescent Supply Currents Skip mode, FBDC forced above their I , I 0.01 1A DD1 DD2 (V , V ) regulation points DD1 DD2 Q uies cent Sup p l y Cur r ent (V ) I 10 25 A D D I O DDIO Shutdown Supply Current (V ) SHDN = GND 0.01 1A CC Shutdown Supply Currents SHDN = GND 0.01 1A (V , V ) DD1 DD2 Shutdown Supply Current (V ) SHDN = GND 0.01 1A DDIO Reference Voltage V V = 4.5V to 5.5V, no REF load 1.986 2.000 2.014 V REF CC Sourcing: I = 0 to 500A -2 -0.2 REF Reference Load Regulation mV Sinking: I = 0 to -100A 0.21 6.2 REF REF Fault Lockout Voltage Typical hysteresis = 85mV 1.84 V 2 MAX17009