MAX17113 19-4709 Rev 0 8/09 Low-Cost, Multiple-Output Power Supply for LCD TVs General Description Features Optimized for 10.8V to 13.2V Input Supply The MAX17113 multiple-output power-supply controller generates all the supply rails for thin-film transistor 8V to 16.5V Input Supply Range (TFT) liquid-crystal display (LCD) panels in TVs and Selectable Frequency (450kHz/600kHz) monitors operating from a regulated 12V input. It Current-Mode Step-Up Regulator includes a step-down and a step-up regulator, a posi- Built-In 24V, 3.3A, 80m n-Channel MOSFET tive and a negative charge pump, a Dual Mode logic- High-Accuracy Output Voltage (1%) controlled high-voltage switch control block, and an True Shutdown adjustable-timing power-good output. The MAX17113 Fast Load-Transient Response can operate from 8V to 16.5V input voltages and is opti- High Efficiency mized for LCD TV panel and LCD monitor applications 10ms Internal Soft-Start running directly from 12V supplies. Current-Mode Step-Down Regulator The step-up and step-down regulators feature internal Built-In 24V, 3A, 100m n-Channel MOSFET power MOSFETs and high-frequency operation allow- Fast Load-Transient Response Adjustable Output Voltage Down to 1.5V ing the use of small inductors and capacitors, resulting Skip Mode at Light Load (EN2 = AGND) in a compact solution. Both switching regulators use High Efficiency fixed-frequency current-mode control architectures, 3ms Internal Soft-Start providing fast load-transient response and easy com- Adjustable Positive and Negative Charge-Pump pensation. A current-limit function for internal switches Regulators and output-fault shutdown protect the step-up and step-down power supplies against fault conditions. The Soft-Start and Timer-Delay Fault Latch for All MAX17113 provides soft-start functions to limit inrush Outputs current during startup. The MAX17113 provides Logic-Controlled High-Voltage Integrated adjustable power-up timing. Switches with Adjustable Delay The positive and negative charge-pump regulators pro- 120m p-Channel FET for AV Sequencing DD vide TFT gate-driver supply voltages. Both output volt- Input Undervoltage Lockout and Thermal- ages can be adjusted with external resistive voltage- Overload Protection dividers. The switch control block allows the manipula- 40-Pin, 5mm x 5mm Thin QFN Package tion of the positive TFT gate-driver voltage. A series p-channel MOSFET is integrated to sequence Pin Configuration power to AV after the MAX17113 has proceeded DD through normal startup, and provides True Shutdown. TOP VIEW The MAX17113 is available in a small (5mm x 5mm), 30 29 28 27 26 25 24 23 22 21 low-profile (0.8mm), 40-pin thin QFN package and operates over a -40C to +85C temperature range. 20 PGND 31 LX2 LX1 32 19 LX2 LX1 33 18 BST Applications 34 17 FB2 LCD TV Panels SWI 35 16 DEL1 SWO LCD Monitor Panels MAX17113 15 REF FB1 36 Ordering Information COMP 37 14 FBN 38 13 AGND PART TEMP RANGE PIN-PACKAGE PGOOD 12 CRST 39 DRVN MAX17113ETL+ -40C to +85C 40 Thin QFN-EP* 11 CTL AGND 40 +Denotes a lead(Pb)-free/RoHS-compliant package. 12 3 45 6 7 89 10 *EP = Exposed pad. Simplified Operating Circuit appears at end of data sheet. Dual Mode is a trademark of Maxim Integrated Products, Inc. THIN QFN True Shutdown is a trademark of Maxim Integrated Products, Inc. 5mm x 5mm Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLE THR PGND DRVP EN2 GND2 VL DEL2 SRC GON EN1 DRN FSEL VIN MODE DLP IN2 IN2 FBP OUT CPGNDLow-Cost, Multiple-Output Power Supply for LCD TVs ABSOLUTE MAXIMUM RATINGS VIN, IN2, EN1, EN2, FSEL to AGND.......................-0.3V to +24V RMS LX1 Current (total for both pins)...................................3.2A CPGND, GND2, PGND to AGND........................................0.3V RMS PGND Current (total for both pins)...............................3.2A MODE, DLP, CTL, THR, DEL1, DEL2, VL, RMS IN2 Current (total for both pins)....................................3.2A PGOOD to AGND .............................................-0.3V to +7.5V RMS LX2 Current (total for both pins)...................................3.2A REF, FBP, FBN, FB1, FB2, COMP, OUT, RMS GND2, CPGND Current................................................0.8A CRST to AGND .......................................-0.3V to (V + 0.3V) RMS SWI Current ..................................................................2.4A VL LX1, SWI, SWO to AGND .......................................-0.3V to +24V RMS SWO Current ................................................................2.4A SWI to SWO............................................................-0.3V to +24V RMS DRVN, DRVP Current ...................................................0.8A DRVN to AGND..........................................-0.3V to (V + 0.3V) RMS VL Current ..................................................................50mA IN2 DRVP to AGND ........................................-0.3V to (V + 0.3V) Continuous Power Dissipation (T = +70C) SWO A LX2 to GND2..............................................-0.3V to (V + 0.3V) 40-Pin Thin QFN IN2 BST to VL................................................................-0.3V to +24V (derate 35.7mW/C above +70C) .........................2857.1mW SRC to AGND.........................................................-0.3V to +48V Operating Temperature Range ...........................-40C to +85C GON, DRN to AGND.................................-0.3V to (V + 0.3V) Junction Temperature......................................................+160C SRC SRC to DRN............................................................-0.3V to +40V Storage Temperature Range .............................-65C to +165C DRN to AGND.........................................................-0.3V to +40V Lead Temperature (soldering, 10s)....................................+300 GON to DRN...........................................................-0.3V to +48V REF Short Circuit to AGND.........................................Continuous Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (Circuit of Figure 1, V = V = 12V, T = 0C to +85C. Typical values are at T = +25C, unless otherwise noted.) VIN IN2 A A PARAMETER CONDITIONS MIN TYP MAX UNITS GENERAL VIN, IN2 Input Voltage Range 8.5 16.5 V Only LX2 switching (V = V = 1.5V, V = 0V) FB1 FBP FBN VIN + IN2 Quiescent Current 10 mA EN1 = EN2 = VL, V = 0V FSEL LX2 not switching (V = V = V = 1.5V, FB1 FB2 FBP VIN + IN2 Standby Current 3 mA V = 0V) EN1 = EN2 = VL, V = 0V FBN FSEL VIN + IN2 Shutdown Current EN1 = EN2 = AGND (shutdown) 300 600 A SWO Shutdown Current EN1 = EN2 = AGND (shutdown) 0.25 2 A FSEL = VIN 510 600 690 SMPS Operating Frequency kHz FSEL = AGND 390 450 510 Phase Difference Between Step- 180 Degrees Down/Positive and Step-Up/Negative Regulators VIN Undervoltage Lockout Threshold VIN rising edge, 100mV typical hysteresis 6.0 7.0 8.3 V VL REGULATOR I = 25mA, V = V = V = 1.1V, V = 0.4V VL FB1 FB2 FBP FBN VL Output Voltage 4.9 5.0 5.15 V (all regulators switching) VL Undervoltage Lockout Threshold VL rising edge, 100mV typical hysteresis 3.6 4.0 4.5 V 2 MAX17113