EVALUATION KIT AVAILABLE Click here to ask an associate for production status of specific part numbers. MAX17220MAX17225 400mV to 5.5V Input, nanoPower Synchronous Boost Converters with True Shutdown General Description Benefits and Features The MAX17220MAX17225 is a family of ultra-low qui- 300nA Quiescent Supply Current into OUT escent current boost (step-up) DC-DC converters with a True Shutdown Mode 225mA/0.5A/1A peak inductor current limit and True Shut- 0.5nA Shutdown Current down. True Shutdown disconnects the output from the Output Disconnects from Input input with no forward or reverse current. The output volt- No Reverse Current with V 0V to 5V OUT age is selectable using a single standard 1% resistor. The 95% Peak Efficiency 225mA (MAX17220/MAX17221), 500mA (MAX17222/ 400mV to 5.5V Input Range MAX17223), and 1A (MAX17224/MAX17225) peak induc- 0.88V Minimum Startup Voltage tor current limits allow flexibility when choosing inductors. 1.8V to 5V Output Voltage Range The MAX17220/MAX17222/MAX17224 versions have 100mV/Step post-startup enable transient protection (ETP), allowing Single 1% Resistor-Selectable Output the output to remain regulated for input voltages down 225mA, 500mA, and 1A Peak Inductor Current Limit to 400mV, depending on load current. The MAX17220 MAX17220/MAX17221: 225mA I LIM MAX17225 offer ultra-low quiescent current, small total MAX17222/MAX17223: 500mA I LIM solution size, and high efficiency throughout the entire MAX17224/MAX17225: 1A I LIM load range. The MAX17220MAX17225 are ideal for bat- tery applications where long battery life is a must. MAX17220/MAX17222/MAX17224 Enable Transient Protection (ETP) 2mm x 2mm, 6-Pin DFN Applications 0.88mm x 1.4mm, 6-Bump WLP (2 x 3, 0.4mm Pitch) Optical Heart-Rate Monitoring (OHRM) LED Drivers Supercapacitor Backup for Real-Time Clock (RTC)/ Typical Operating Circuit Alarm Buzzers Primary-Cell Portable Systems Tiny, Low-Power IoT Sensors IN L1 2.2H Secondary-Cell Portable Systems 400mV TO 5.5V Wearable Devices OUT CIN EN Battery-Powered Medical Equipment 10F Low-Power Wireless Communication Products COUT GND MAX1722XMAX1722X 10F STARTUP 0.88 (TYP) R SEL Arm and Cortex are registered trademarks of Arm Limited. Bluetooth is a registered trademark of Bluetooth SIG, Inc. True Shutdown is a trademark of Maxim Integrated Products, Inc. Ordering Information appears at end of data sheet. 19-8753 Rev 8 10/21 2021 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. One Analog Way, Wilmington, MA 01887 U.S.A. Tel: 781.329.4700 2021 Analog Devices, Inc. All rights reserved. SEL EN IN LX GND OUTMAX17220MAX17225 400mV to 5.5V Input, nanoPower Synchronous Boost Converters with True Shutdown Absolute Maximum Ratings OUT, EN, IN to GND ................................................ -0.3V to +6V Continuous Power Dissipation (T = +70C) A R to GND ................. -0.3V to Lower of (V + 0.3V) or +6V DFN (derate 4.5mW/C above +70C) .....................357.8mW SEL OUT LX RMS Current WLP ............................... -1.6A to 1.6A Operating Temperature Range ...........................-40C to +125C RMS RMS LX RMS Current DFN .................................. -1A to +1A Junction Temperature .......................................................+150C RMS RMS LX to GND (Note 1) .................................... -0.3V to V + 0.3V Storage Temperature Range ..............................-40C to +150C OUT Continuous Power Dissipation (T = +70C) Soldering Temperature (reflow) ........................................+260C A WLP (derate 10.5mW/C above +70C) ....................... 840mW Note 1: The LX pin has internal clamps to GND and OUT. These diodes may be forward biased during switching transitions. During these transitions, the maximum LX current should be within the maximum RMS current rating for safe operation. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information DFN Package Code L622+1C Outline Number 21-0164 Land Pattern Number 90-0004 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 223.6C/W JA Junction to Case ( ) 122C/W JC WLP Package Code N60E1+1 Outline Number 21-100128 Land Pattern Number Refer to Application Note 1891 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 95.15C/W JA Junction to Case ( ) N/A JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/ thermal-tutorial. www.analog.com Analog Devices 2