MAX17411/MAX17511/MAX17511C/MAX17511N/MAX17511T 19-5742 Rev 1 7/11 Dual-Output, 3-/2-/1-Phase + 2-/1-Phase Quick-PWM Controllers for VR12/IMVP7 General Description Features The MAX17411/MAX17511/MAX17511C/MAX17511N/ S Intel VR12/IMVP-7-Compliant Serial Interface MAX17511T are dual-output, step-down, constant on-time S 3-/2-/1-Phase Quick-PWM CPU Core Regulator Quick-PWMK controllers for VR12/IMVP-7 CPU core sup- Two Internal Drivers and One External Driver plies. The controllers consist of two high-current switching Transient-Phase Overlap Mode power supplies for CPU and GFX cores. The CPU regulator (regulator A) is a three-phase constant on-time architecture. Dynamic Phase Selection The GFX regulator (regulator B) is also constant on-time S 2-/1-Phase Quick-PWM GFX Regulator architecture. The MAX17411 supports 2-phase operation One Internal and One External Driver and the MAX17511/MAX17511C/MAX17511N/MAX17511T support 1-phase operation. The MAX17411/MAX17511/ S Active Overshoot Suppression MAX17511C/MAX17511N/MAX17511T include two internal S 8-Bit VR12/IMVP-7 DAC drivers on regulator A and one internal driver on regula- S 0.5% V Accuracy Over Line, Load, and OUT tor B. External drivers such as the MAX17491 enable the Temperature additional phases. S Active Voltage Positioning with Programmable Both regulator A and regulator B include output voltage Gain sensing and accurate load-line gain. Switching frequen- cies are programmable from 200kHz to 600kHz per S Accurate Lossless Current Balance phase. Output overvoltage protection (OVP, MAX17411/ S Accurate Droop and Current Limit MAX17511/MAX17511C/MAX17511N), undervoltage pro- S Remote Output and Ground Sense tection (UVP), and thermal protection ensure effective and reliable operation. When any of these protection features S Power-Good Window Comparators (POKA and detect a fault, the controller shuts down both outputs. POKB) The multiphase regulators include transient-phase over- S 4.5V to 24V Battery-Input Voltage Range lap and active overshoot suppression, which speed up S Programmable 200kHz to 600kHz Switching the response time and reduce the total output capaci- Frequency tance. The CPU and GFX outputs are controlled inde- S External Thermal-Fault Detection Output pendently by writing the appropriate data into a function- (VR HOT ) mapped register file. VID code transitions and soft-start are enabled with a precision slew-rate control circuit. The S Overvoltage (MAX17411/MAX17511/MAX17511C/ SVID interface also allows each regulator to be individu- MAX17511N), Undervoltage, and Thermal-Fault ally set into a low-power, single-phase, pulse-skipping Protection state to optimize efficiency. The MAX17411 is available in S Slew-Rate Controlled Soft-Start a 48-pin, 6mm x 6mm, TQFN package. The MAX17511/ S Passive Soft-Shutdown (20I Discharge Switches) MAX17511C/MAX17511N/MAX17511T are available in a S Integrated Boost Switches 40-pin, 5mm O 5mm, TQFN lead-free package. S Low-Profile, 48-Lead/40-Lead TQFN Packages Applications VR12/IMVP-7 CPU Core Power Supplies Quick PWM is a trademark of Maxim Integrated Products, Inc. Notebooks/Desktops/Servers Ordering Information PART TEMP RANGE PIN-PACKAGE FEATURE MAX17411GTM+ -40NC to +105NC 48 TQFN-EP* 3-/2-/1-Phase + 2-/1-Phase MAX17511GTL+ -40NC to +105NC 40 TQFN-EP* 3-/2-/1-Phase + 1-Phase Ordering Information continued on last page. +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. Maxim Integrated Products 1 For information on other Maxim products, visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLEDual-Output, 3-/2-/1-Phase + 2-/1-Phase Quick-PWM Controllers for VR12/IMVP7 ABSOLUTE MAXIMUM RATINGS V , V , V to GND (AGND) .........................-0.3V to +6V BSTA to V ......................................................-0.3V to +26V CC DDA DDB DDA VDIO, CLK, ALERT to GND (AGND) .....................-0.3V to +6V BSTB to V .......................................................-0.3V to +26V DDB CSPAAVE, CSPBAVE, CSP , LXA to BSTA ........................................................-6V to +0.3V CSN to GND (AGND) ........................................-0.3V to +6V LXB to BSTB ............................................................-6V to +0.3V FBA, FBB to GND (AGND) ....................... -0.3V to (V + 0.3V) LX to GND (AGND) ................................................-6V to +26V CC SR, IMAX to GND (AGND) .................... -0.3V to (V + 0.3V) DHA to LXA .......................................-0.3V to (V + 0.3V) CC BSTA POKA, POKB, EN to GND (AGND) .........................-0.3V to +6V DHB to LXB ........................................... -0.3V to (V + 0.3V) BSTB VR HOT to GND (AGND) ......................................-0.3V to +6V Continuous Power Dissipation (T = +70NC) A THERMA, THERMB to GND (AGND) ....... -0.3V to (V + 0.3V) 40-Pin TQFN (derate 35.7mW/NC above +70NC) ...2857.1mW CC GNDSA, GNDSB to GND (AGND) .......................-0.3V to +0.3V 48-Pin TQFN (derate 37mW/NC above +70NC) .........2963mW TON to GND ..........................................................-0.3V to +26V Operating Temperature Range ........................ -40NC to +105NC DRVPWMA to GND (AGND) .................. -0.3V to (V + 0.3V) Junction Temperature .....................................................+150NC DDA DRVPWMB to GND (AGND) .................. -0.3V to (V + 0.3V) Storage Temperature Range ............................ -65NC to +165NC DDB DLA to GND (PGND) ............................ -0.3V to (V + 0.3V) Lead Temperature (soldering, 10s) ................................+300NC DDA DLB to GND (PGND) .............................. -0.3V to (V + 0.3V) Soldering Temperature (reflow) ......................................+260NC DDB PACKAGE THERMAL CHARACTERISTICS (Note 1) 40 TQFN 48 TQFN Junction-to-Ambient Thermal Resistance (q ) ..........28C/W Junction-to-Ambient Thermal Resistance (q ) ..........27C/W JA JA Junction-to-Case Thermal Resistance (q ) ..............1.6C/W Junction-to-Case Thermal Resistance (q ) ..............1.3C/W JC JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (Circuits of Figures 1 and 2. V = 10V, V = V = V = 5V, EN = V , V = 0V, V = V = V = V IN CC DDA DDB CC GNDS FB CSP AVE CSP CSN = 1V SerialVID = 1.00, FPWM MODE T = 0C to +85C, unless otherwise noted. Typical values are at T = +25NC. All devices A A 100% tested at T = +25NC. Limits over temperature guaranteed by design.) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS PWM CONTROLLER Input Voltage Range V , V , V 4.5 5.5 V CC DDA DDB DAC codes from -0.5 +0.5 % 1.000V to 1.520V Measured at FB with DC Output Voltage respect to GNDS DAC codes from -5 +5 Accuracy includes load regulation 0.800V to 0.995V mV error (Note 2) DAC codes from -8 +8 0.250V to 0.795V Line Regulation Error V = 4.5V to 5.5V, V = 4.5V to 24V 0.1 mV CC IN Upward transitions -15 -10 -5 V Bit Accuracy mV SETTLED Downward transitions 5 10 15 GNDS Input Range -200 +200 mV GNDS Gain A DV /DV 0.97 1.00 1.03 V/V GNDS OUT GNDS GNDS Input Bias Current T = +25NC -0.5 +0.5 FA A TON Shutdown Current EN = GND, V = 24V, V = 0V, T = +25NC 0.01 0.1 FA IN CC A MAX17511N only, Reg A and Reg B 1.094 1.100 1.106 Boot Voltage V V BOOT MAX17511C only, Reg B only 0.895 0.900 0.905 2 MAX17411/MAX17511/MAX17511C/MAX17511N/MAX17511T