MAX17542G 42V, 1A, Ultra-Small, High-Efficiency, Synchronous Step-Down DC-DC Converter General Description Benefits and Features Reduces External Components and Total Cost The MAX17542G high-efficiency, high-voltage, synchronous No Schottky-Synchronous Operation step-down DC-DC converter with integrated MOSFETs operates over 4.5V to 42V input. The converter can All-Ceramic Capacitors, Ultra-Compact Layout deliver up to 1A and generates output voltages from 0.9V Reduces Number of DC-DC Regulators to Stock up to 0.92 x V . The feedback (FB) voltage is accurate to IN Wide 4.5V to 42V Input within 1.7% over -40C to +125C. Adjustable 0.9V to 92%V Output IN Delivers up to 1A The MAX17542G uses peak-current-mode control with pulse-width modulation (PWM) and operates with fixed Reduces Power Dissipation 600kHz switching frequency at any load. The device Peak Efficiency > 90% is available in a 10-pin (3mm x 2mm) TDFN package. Shutdown Current = 0.9A (typ) Simulation models are available. Operates Reliably in Adverse Industrial Environments Hiccup-Mode Current Limit, Sink Current Limit, and Applications Autoretry Startup Industrial Process Control Built-In Output-Voltage Monitoring (RESET Pin) HVAC and Building Control Programmable EN/UVLO Threshold Base Station, VOIP, Telecom Adjustable Soft-Start and Prebiased Power-Up Home Theatre High Industrial -40C to +125C Ambient Operating Battery-Powered Equipment Temperature Range / -40C to +150C Junction General-Purpose Point of Load Temperature Range Ordering Information appears at end of data sheet. MAX17542G Application Circuit (5V Output, 1A Maximum Load Current) L1 22H V OUT V IN V LX IN 5V, 1A C1 C4 R1 2.2F 10F 3.32M 1 PGND JU1 2 EN/UVLO 3 R2 R4 MAX17542G 681k 82.5k GND V CC C2 1F FB/VO SS C3 R5 3300pF 18.2k COMP RESET RESET R3 C9 16.5k 27pF L1 = XAL5050-223, C5 5.3mm x 5.5mm 4700pF 19-7531 Rev 1 2/17MAX17542G 42V, 1A, Ultra-Small, High-Efficiency, Synchronous Step-Down DC-DC Converter (Note 1) Absolute Maximum Ratings V to GND.............................................................-0.3V to +48V LX Total RMS Current......................................................... 1.6A IN EN/UVLO to GND.......................................-0.3V to (V + 0.3V) Output Short-Circuit Duration.....................................Continuous IN LX to PGND................................................-0.3V to (V + 0.3V) Junction Temperature......................................................+150C IN FB, RESET, COMP, SS to GND .............................-0.3V to +6V Storage Temperature Range............................. -65C to +160C V to GND..............................................................-0.3V to +6V Lead Temperature (soldering, 10s).................................+300C CC GND to PGND.......................................................-0.3V to +0.3V Soldering Temperature (reflow).......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Junction temperature greater than +125C degrades operating lifetimes. Package Thermal Characteristics 10 TDFN Continuous Power Dissipation (T = +70C) A (derate 14.9mW/C above +70C) (multilayer board) .1188.7mW Junction-to-Ambient Thermal Resistance ( ) ...........67.3C/W JA Junction-to-Case Thermal Resistance ( ) ................18.2C/W JC Package Information PACKAGE TYPE: 10-PIN TDFN Package Code T1032N+1 Outline Number 21-0429 Land Pattern Number 90-0082 For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 24V, V = V = 0V, C = 2.2F, C = 1F, V = 1.5V, C = 3300pF, V = 0.98 x V , LX = unconnected, IN GND PGND VIN VCC EN SS FB OUT RESET = unconnected. T = -40C to +125C, unless otherwise noted. Typical values are at T = +25C. All voltages are referenced to A A GND, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS INPUT SUPPLY (V ) IN Input Voltage Range V 4.5 42 V IN I V = 0V, shutdown mode 0.9 3.5 A IN-SH EN Input Supply Current I Normal switching mode, no load 4.75 6.75 mA IN-SW ENABLE/UVLO (EN/UVLO) V V rising 1.194 1.218 1.236 ENR EN EN Threshold V V falling 1.114 1.135 1.156 V ENF EN V V falling, true shutdown 0.7 EN-TRUESD EN EN Input Leakage Current I V = V = 42V, T = +25C 8 200 nA EN EN IN A Maxim Integrated 2 www.maximintegrated.com