EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX17575 4.5V60V, 1.5A, High-Efficiency, Synchronous Step-Down DC-DC Converter with Internal Compensation General Description Benefits and Features The MAX17575 high-efficiency, high-voltage, synchronous Reduces External Components and Total Cost step-down DC-DC converter with integrated MOSFETs No Schottky-Synchronous Operation operates over a 4.5V to 60V input. The converter can Internal Compensation for Any Output Voltage deliver up to 1.5A and generates output voltages from All-Ceramic Capacitors, Compact Layout 0.9V up to 0.9 x V . The feedback (FB) voltage is accu- IN Reduces Number of DC-DC Regulators to Stock rate to within 1.2% over -40C to +125C. Built-in com- Wide 4.5V to 60V Input pensation across the output-voltage range eliminates the Adjustable 0.9V to 0.9 V Output IN need for external components. The MAX17575 features Continuous 1.5A Current Over Temperature peak-current-mode control architecture and operates 400kHz to 2.2MHz Adjustable Switching Frequency in fixed frequency forced PWM mode. The MAX17575 with External Synchronization offers a low minimum on-time that allows high switching Reduces Power Dissipation frequencies and a smaller solution size. Peak Efficiency of 94% The device is available in a 12-pin (3mm 3mm) TDFN Auxiliary Bootstrap LDO for Improved Efficiency package. Simulation models are available. 4.65A Shutdown Current Operates Reliably in Adverse Industrial Environments Applications Hiccup Mode Overload Protection Industrial Control Power Supplies Adjustable Soft-Start General-Purpose Point-of-Load Built-In Output-Voltage Monitoring with RESET Distributed Supply Regulation Programmable EN/UVLO Threshold Base Station Power Supplies Monotonic Startup into Prebiased Load Wall Transformer Regulation Overtemperature Protection High-Voltage, Single-Board Systems High Industrial -40C to +125C Ambient Operating Temperature Range/-40C to +150C Junction Temperature Range Ordering Information appears at end of data sheet. 5V Output: Typical Application Circuit and Efficiency vs. Load Current V IN VIN EN/UVLO C1 fSW = 500kHz BST 2.2F PGND C4 L1 V MAX17575 OUT 0.1F 15H 5V, 1.5A SGND LX R1 RT/SYNC FB FB 75k C5 SS FB RESET 22F R3 C3 R2 4.7 5.6nF VCC EXTVCC 16.2k EP C2 C6 2.2F 0.1F 19-8785 Rev 3 12/19MAX17575 4.5V60V, 1.5A, High-Efficiency, Synchronous Step-Down DC-DC Converter with Internal Compensaton Absolute Maximum Ratings (Note 1) V to PGND .........................................................-0.3V to +65V V to GND .........................................................-0.3V to +6.5V IN CC EN/UVLO to GND.........................................-0.3V to V + 0.3V LX Total RMS Current ........................................................1.6A IN EXTV to GND ...................................................-0.3V to +26V Continuous Power Dissipation (T = +70C) CC A BST to PGND ........................................................-0.3V to +70V (Derate 24.4mW/C above +70C) (Multilayer board)..1951mW LX to PGND................................................-0.3V to (V + 0.3V) Output Short-Circuit Duration ....................................Continuous IN BST to LX .............................................................-0.3V to +6.5V Junction Temperature ......................................................+150C BST to V ...........................................................-0.3V to +65V Storage Temperature Range ............................ -65C to +160C CC RESET, SS, RT/SYNC to GND ............................-0.3V to +6.5V Lead Temperature (soldering, 10s) .................................+300C PGND to GND ......................................................-0.3V to +0.3V Soldering Temperature (reflow) .......................................+260C FB to GND ............................................................-0.3V to +1.5V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Junction temperature greater than +125C degrades operating lifetimes. Package Information PACKAGE TYPE: 12 TDFN Package Code TD1233+1C Outline Number 21-0664 Land Pattern Number 90-0397 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 41C/W JA Junction to Case ( ) 8.5C/W JC Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Maxim Integrated 2 www.maximintegrated.com