EVALUATION KIT AVAILABLE MAX17600MAX17605 4A Sink/Source Current, 12ns, Dual MOSFET Drivers General Description Features The MAX17600MAX17605 devices are high-speed Dual Drivers with Enable Inputs MOSFET drivers capable of sinking /sourcing 4A peak +4V to +14V Single Power-Supply Range currents. The devices have various inverting and non- 4A Peak Sink /Source Current inverting part options that provide greater flexibility in controlling the MOSFET. The devices have internal Inputs Rated to +14V, Regardless of V Voltage DD logic circuitry that prevents shoot-through during output- Low 12ns Propagation Delay state changes. The logic inputs are protected against 6ns Typical Rise and 5ns Typical Fall Times with voltage spikes up to +14V, regardless of V volt- DD 1nF Load age. Propagation delay time is minimized and matched Matched Delays Between Channels between the dual channels. The devices have very fast switching time, combined with short propagation delays Parallel Operation of Dual Outputs for Larger (12ns typ), making them ideal for high-frequency circuits. Driver Output Current The devices operate from a +4V to +14V single power TTL or HNM Logic-Level Inputs with Hysteresis for supply and typically consume 1mA of supply current. The Noise Immunity MAX17600/MAX17601 have standard TTL input logic Low Input Capacitance: 10pF (typ) levels, while the MAX17603 /MAX17604/MAX17605 have CMOS-like high-noise margin (HNM) input logic levels. Thermal Shutdown Protection The MAX17600/MAX17603 are dual inverting input driv- TDFN, MAX, and SO Package Options ers, the MAX17601/MAX17604 are dual noninverting -40C to +125C Operating Temperature Range input drivers, and the MAX17602/MAX17605 devices have one noninverting and one inverting input. These devices are provided with enable pins (ENA, ENB) for Typical Operating Circuit better control of driver operation. These devices are available in 8-pin (3mm x 3mm) TDFN, ENA V 8-pin (3mm x 5mm) MAX , and 8-pin SO packages and DD (UP TO +14V) V DD operate over the -40C to +125C temperature range. OUTA MAX17600 Applications MAX17601 MAX17602 Power MOSFET Switching ENB MAX17603 Switch-Mode Power Supplies MAX17604 DC-DC Converters INA MAX17605 OUTB Motor Control Power-Supply Modules INB GND Ordering Information appears at end of data sheet. MAX is a registered trademark of Maxim Integrated Products, Inc. 19-6177 Rev 2 6/17MAX17600MAX17605 4A Sink/Source Current, 12ns, Dual MOSFET Drivers Absolute Maximum Ratings V , INA, INB, ENA, ENB to GND .......................-0.3V to +16V Operating Temperature Range ......................... -40C to +125C DD OUTA, OUTB to GND............................................-0.3V to +16V Junction Temperature ......................................................+150C Junction Operating Temperature Range .......... -40C to +125C Storage Temperature Range ............................ -65C to +150C Continuous Power Dissipation (T = +70C) Lead Temperature (soldering, 10s) .................................+300C A 8-Pin TDFN (derate 23.8mW/C above +70C) ........1904mW Soldering Temperature (reflow) .......................................+240C 8-Pin SO (derate 74mW/C above +70C) ............. 588.2mW* 8-Pin MAX (derate 12.9mW/C above +70C) .....1030.9mW *As per JEDEC 51 standard. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 8 TDFN Package Code T833+2 Outline Number 21-0137 Land Pattern Number 90-0059 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 42C/W JA Junction to Case ( ) 8C/W JC PACKAGE TYPE: 8 SO Package Code S8+2 Outline Number 21-0041 Land Pattern Number 90-0096 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 136C/W JA Junction to Case ( ) 38C/W JC PACKAGE TYPE: 8 MAX Package Code U8E+2 Outline Number 21-0107 Land Pattern Number 90-0145 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 77.6C/W JA Junction to Case ( ) 5C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com