MAX17620 4MHz, Miniature 600mA, Synchronous Step-Down DC-DC Converter with Integrated MOSFETs General Description Benefits and Features The MAX17620 is a high-frequency, high-efficiency Minimizes External Components, Reducing Total synchronous step-down DC-DC converter with integrated Cost MOSFETs that operates over a 2.7V to 5.5V input voltage Synchronous Operation for High Efficiency and range. The device supports up to 600mA load current and Reduced Cost 1.5V to 100% V output voltage. High-frequency operation Internal Compensation for Stable Operation at Any IN Output Voltage enables the use of small, low-cost inductors and capacitors. All-Ceramic Capacitor Solution The device features selectable PWM/skip mode of 4MHz Operation operation at light loads and operates at a 4MHz fixed- Only 5 External Components Required frequency in PWM mode. Skip mode improves system 2 Total Solution Size is 12mm (Sum of the efficiency at light loads, while PWM mode maintains a Components Area) constant switching frequency over the entire load. Reduces Number of DC-DC Regulators to Stock In skip mode, the device draws only 40A of quiescent Wide 2.7V to 5.5V Input Voltage Range current from the supply input. In shutdown mode, the current Adjustable 1.5V to 100% V Output Voltage Range IN consumption is reduced to 0.1A. Delivers Up to 600mA Load Current The device also features a soft-start feature to reduce 100% Duty-Cycle Operation the inrush current during startup, and also incorporates an +1%/-0.75% Reference Voltage Accuracy enable (EN) pin to turn on/off the device. An open-drain Available in a 2mm x 2mm TDFN Package PGOOD pin provides power-good signal to the system Reduces Power Dissipation upon achieving successful regulation of the output voltage. Peak Efficiency 91% The MAX17620 is available in an 8-pin, 2mm x 2mm Skip Mode for High Light-Load Efficiency TDFN package and operates over the -40C to +125C Shutdown Current = 0.1A temperature range. Operates Reliably Applications Peak Current-Limit Protection Point-of-Load Power Supply Soft-Start Reduces Inrush Current During Startup Standard 5V Rail Supplies Built-In Output-Voltage Monitoring Battery-Powered Instruments (Open-Drain PGOOD Pin) Distributed Power Systems -40C to +125C Operation Ordering Information appears at end of data sheet. Typical Application Circuit1.8V, 600mA Step-Down Regulator L 1H 2.7VTO 5.5V VOUT IN LX 1.8V/600mA C IN MAX17620 COUT 2.2F R1 10F GND 24k V OUT EN FB R2 PGOOD MODE 19.1k CIN:2.2F/10V/0603/X7R,GRM188R71A225KE15D,MURATA L1: 1H, 60m, MAKK2016H1ROM, TAIYO-YUDEN COUT: 10F/6.3V/0805/X7R, GRM21BR70J106KE76K, MURATA 19-7543 Rev 3 7/16MAX17620 4MHz, Miniature 600mA, Synchronous Step-Down DC-DC Converter with Integrated MOSFETs Absolute Maximum Ratings IN to GND ..................................................................-0.3V to 6V Operating Temperature Range ......................... -40C to +125C LX to GND .................................................................-0.3V to 6V Junction Temperature ......................................................+150C MODE ..........................................................-0.3V to V + 0.3V Storage Temperature Range ............................ -65C to +150C IN EN, PGOOD, FB, V to GND ..............................-0.3V to 6V Soldering Temperature (Reflow) ......................................+260C OUT Continuous Power Dissipation (up to T = +70C) A (derate 9.8mW/C above T = +70C) .........................784.3mW A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Note 1) Package Thermal Characteristics TDFN Junction-to-Ambient Thermal Resistance ( ) ........102C/W Junction-to-Case Thermal Resistance ( ) .................8C/W JA JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics V = +3.6V, T = T = -40C to +125C, unless otherwise noted. Typical specifications are at T = T = +25C. (Note 2) IN A J A J PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS INPUT SUPPLY (IN) Input Voltage Range V 2.7 5.5 V IN I V = 0V, shutdown mode 0.1 IN-SH EN A Input Supply Current I Nonswitching 40 Q SKIP I PWM mode (switching) 6 mA Q-PWM Undervoltage-Lockout Threshold V V rising 2.55 2.6 2.65 V IN UVLO IN (UVLO) UVLO Hysteresis V 200 mV IN UVLO HYS ENABLE (EN) EN Low Threshold V V falling 0.8 V EN LOW EN EN High Threshold V V rising 2 V EN HIGH EN EN Hysteresis V 220 mV EN HYS EN Input Leakage I V = 5.5V, T = T = +25C 10 50 nA EN EN A J POWER MOSFETS High-Side pMOS On-Resistance R V = 3.6V, I = 190mA 120 200 m DS-ONH IN LX High-Side pMOS On-Resistance R V = 5.0V, I = 190mA 100 160 m DS-ONH IN LX Low-Side nMOS On-Resistance R V = 3.6V, I = 190mA 80 145 m DS-ONL IN LX Low-Side nMOS On-Resistance R V = 5.0V, I = 190mA 70 130 m DS-ONL IN LX LX Leakage Current I LX = GND or IN, T = +25C 0.1 1 A LX LKG A High-Side Peak Current Limit I 1150 1450 1800 mA LIM PEAK Low-Side Valley Current Limit I 920 1170 1450 mA LIM VALLEY Low-Side Negative Current Limit I Current entering into LX pin 1050 mA LIM NEG Low-Side Zero-Crossing MODE = IN, current leaving out of LX I 100 mA LIM ZX Current Limit pin Maxim Integrated 2 www.maximintegrated.com