Click here to ask an associate for production status of specific part numbers. 2.7V to 5.5V, 700mA. Synchronous Step- MAX17625/MAX17626 Down Converter with Integrated MOSFETs Product Highlights Simplified Application Diagram Easy to Use VIN L1 VOUT MAX17626 2.7V to 5.5V Input IN LX Adjustable 0.8V to 3.3V Output C C IN OUT R1 EN OUTSNS 1% Feedback Accuracy Up to 700mA Output Current PGOOD FB Fixed 2MHz or 4MHz Operation R2 MODE GND 100% Duty-Cycle Operation Internally Compensated All Ceramic Capacitors High Efficiency Selectable PWM- or PFM-Mode of Operation Shutdown Current as Low as 0.1A (typ) Pin Description Flexible Design TOP VIEW Internal Soft-Start and Prebias Startup LX OUTSNS FB PGOOD Open-Drain Power Good Output (PGOOD Pin) 8 7 6 5 Robust Operation Overtemperature Protection Overcurrent Protection -40C to +125C Ambient Operating MAX17625/ MAX17626 Temperature/-40C to +150C Junction Temperature *EP + Key Applications 1 2 3 4 Factory Automation IN GND EN MODE Within the Factory Automation space, which includes TDFN many different applications, one key need is the 2mm x 2mm ability to generate less heat. Heat within the system has to be managed, prevent overheating and Point-of-Load Power Supply shutdown. The MAX17625/6 produces less heat as General point of load is just that, a generic term. It it is a fully synchronous DC-DC with integrated FETs applies to a switching regulator that serves many with high efficiency. The more efficient a switching applications and design environments. Critical to any regulator is, the less it will lose power and therefore environment is the robustness of the power create less heat in the system. conversion. With an operating range of -40C to Personal Electronics +125C, current limit protection, and overtemperature Personal Electronics are designed to be as small as protection, the MAX17625/MAX17626 deliver a possible. The MAX17625/6 have integrated FETS, small, high efficient power conversion in the most integrated compensation, and are fully configured adverse environments and provides the designer the using only four external components, making for a peace of mind that it is robust and reliable. very small solution size. Small size and fewer components help drive overall design costs down for Ordering Information appears at end of data sheet. the system. 19-101294 Rev 0 11/21 2021 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. One Analog Way, Wilmington, MA 01887 U.S.A. Tel: 781.329.4700 2021 Analog Devices, Inc. All rights reserved. MAX17625/MAX17626 2.7V to 5.5V, 700mA. Synchronous Step-Down Converter with Integrated MOSFETs Absolute Maximum Ratings IN, EN, PGOOD, FB, OUTSNS to GND ..................-0.3V to +6V Operating Temperature ..................................... -40C to +125C MODE, LX to GND ....................................... -0.3V to (IN + 0.3V) Junction Temperature (Note 1) ....................................... +150C Output Short-Circuit Duration ................................... Continuous Storage Temperature Range ............................. -65C to +150C Continuous Power Dissipation (up to T = +70C) (derate Lead Temperature (soldering,10s) .................................. +260C A 11.7mW/C above T = +70C) ................................... 937.9mW A Soldering Temperature (reflow) ...................................... +260C Note 1: Junction temperature greater than +125C degrades operating lifetimes. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 8- PIN TDFN Package Code T822+3C Outline Number 21-0168 Land Pattern 90-0065 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 85.3C/W JA Junction to Case ( ) 8.9C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = V = 3.6V, V = V = V = 0V, LX = OUTSNS = PGOOD= OPEN. T = T = -40C to +125C, unless otherwise noted. IN EN GND MODE FB A J Typical values are at T = +25C. All voltages are referenced to GND, unless otherwise noted.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS INPUT SUPPLY (V ) IN Input-Voltage Range V 2.7 5.5 V IN I V = 0, shutdown mode 0.1 IN-SHDN EN A I PFM mode, No Load 40 Q-PFM Input-Supply Current PWM mode, MAX17625 4.5 I mA Q-PWM PWM mode, MAX17626 6 Undervoltage-Lockout V V Rising 2.55 2.6 2.65 V IN UVLO IN Threshold (UVLO) V IN UVLO HY UVLO Hysteresis 200 mV S ENABLE(EN) EN LOW Threshold V EN falling 0.8 V EN LOW EN HIGH Threshold V EN rising 2 V EN HIGH EN Input Leakage I EN = 5.5V, T = T = +25 C 10 50 nA EN A J POWER MOSFETS V = 3.6V, I = 190mA 120 200 High-Side pMOS On- IN OUT R m DS ONH Resistance V = 5V, I = 190mA 100 160 IN OUT www.analog.com Analog Devices 2