MAX17761 4.5V to 76V, 1A, High-Efficiency, Synchronous Step-Down DC-DC Converter General Description Benefits and Features The MAX17761, high-efficiency, high-voltage, synchronous Reduces External Components and Total Cost step-down DC-DC converter with integrated MOSFETs No SchottkySynchronous Operation operates over a 4.5V to 76V input. The converter can Internal Compensation Components All-Ceramic Capacitors, Compact Layout deliver up to 1A current. Output voltage is programmable from 0.8V up to 90% of V . The feedback voltage regula- IN Reduces Number of DC-DC Regulators to Stock tion accuracy over -40C to +125C is 1.5%. Wide 4.5V to 76V Input Output Adjustable from 0.8V up to 90% of V The device features a peak-current-mode control architecture IN and can be operated in either the pulse-width modulation Delivers up to 1A Over Temperature 200kHz to 600kHz Adjustable Frequency with (PWM) or pulse-frequency modulation (PFM) control schemes. External Clock Synchronization Programmable Current Limit The MAX17761 is available in a 12-pin (3mm x 3mm) Reduces Power Dissipation TDFN package. Simulation models are available. Peak Efficiency > 90% Applications PFM Mode Enables Enhanced Light-Load Efficiency Auxiliary Bootstrap LDO for Improved Efficiency Industrial Control Power Supplies 5A Shutdown Current General-Purpose Point-of-Load Distributed Supply Regulation Operates Reliably in Adverse Industrial Environments Basestation Power Supplies Adjustable Soft-Start and Prebiased Power-Up Wall Transformer Regulation Built-in Output-Voltage Monitoring with RESET High-Voltage, Single-Board Systems Programmable EN/UVLO Threshold Monotonic Startup into Prebiased Load Ordering Information appears at end of data sheet. Overtemperature Protection High Industrial -40C to +125C Ambient Operat- ing Temperature Range/-40C to +150C Junction Temperature Range 19-8608 Rev 1 2/18MAX17761 4.5V to 76V, 1A, High-Efficiency, Synchronous Step-Down DC-DC Converter Absolute Maximum Ratings V to SGND .........................................................-0.3V to +80V Continuous Power Dissipation (T = +70C) IN A EN/UVLO to SGND ...............................................-0.3V to +26V (derate 24.4mW/C above +70C) EXTVCC to SGND ................................................-0.3V to +26V (Multilayer board) ....................................................1951.2mW LX to PGND................................................-0.3V to (V + 0.3V) Output Short-Circuit Duration ....................................Continuous IN FB, RESET, SS, MODE/ILIM, V , Operating Temperature Range (Note 1) ........... -40C to +125C CC RT/SYNC to SGND .............................................-0.3V to +6V Junction Temperature ......................................................+150C PGND to SGND.................................................... -0.3V to +0.3V Storage Temperature Range ............................ -65C to +150C LX Total RMS Current ........................................................1.6A Lead Temperature (soldering, 10s) .................................+300C Soldering Temperature (reflow) .......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Junction temperature greater than +125C degrades operating lifetimes. Package Information PACKAGE TYPE: 12 TDFN Package Code TD1233+1C Outline Number 21-0664 Land Pattern Number 90-0397 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 41C/W JA Junction to Case ( ) 8.5C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 24V, V = unconnected, R = 105k (f = 400kHz), LX = unconnected, T = -40C to +125C, unless otherwise IN EN/UVLO RT SW A noted. Typical values are at T = +25C. All voltages are referenced to SGND, unless otherwise noted.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS INPUT SUPPLY (V ) IN Input Voltage Range V 4.5 76 V IN Input Shutdown Current I V = 0V, shutdown mode 2.5 5 10 A IN-SH EN I R = open or 422k 195 A Q PFM ILIM Input Quiescent Current I R = 243k or 121k 3 4 5 mA Q PWM ILIM ENABLE/UVLO (EN) V V rising 1.19 1.215 1.24 ENR EN/UVLO EN Threshold V V falling 1.09 1.115 1.14 V ENF EN/UVLO V V falling, true shutdown 0.7 EN-TRUESD EN/UVLO EN Pullup Current I VEN/UVLO = 1.215V 2.2 2.5 2.8 A EN Maxim Integrated 2 www.maximintegrated.com