MAX1840/MAX1841 19-1716 Rev 0 4/00 Low-Voltage SIM/Smart Card Level Translators in MAX General Description Features The MAX1840/MAX1841 subscriber identity module SIM/Smart Card Level Shifting (SIM)/smart card level translators provide level shifting +1.4V to +5.5V Controller Voltage Range and electrostatic discharge (ESD) protection for SIM and smart card ports. These devices integrate two unidirec- +1.7V to +5.5V Card Voltage Range tional level shifters for the reset and clock signals, a bidi- 10kV ESD Card Socket Protection rectional level shifter for the serial data stream, and 10kV ESD protection on all card contacts. Allows Level Translation with DV V or CC CC The MAX1840 includes a SHDN control input to aid DV V CC CC insertion and removal of SIM and smart cards, while the Automatically Shuts Down When Either Supply Is MAX1841 includes a system-side data driver to support Removed system controllers without open-drain outputs. The logic supply voltage range is +1.4V to +5.5V for the controller Card Contacts Actively Pulled Low During side and +1.7V to +5.5V for the card side. Total sup- Shutdown ply current is 1.0A. Both devices automatically shut 1A Total Quiescent Supply Current down when either power supply is removed. For a com- plete SIM card interface, combine the MAX1840/ 0.01A Total Shutdown Supply Current MAX1841 with the MAX1686H 0V/3V/5V regulated Ultra-Small 10-Pin MAX Package charge pump. Compliant with GSM Test Specifications 11.11 The MAX1840/MAX1841 are available in ultra-small 10-pin MAX packages that are only 1.09mm high and and 11.12 half the area of an 8-pin SO. The MAX1840/MAX1841 are compliant with GSM test specifications 11.11 and 11.12. Applications Ordering Information SIM Interface in GSM Cellular Telephones PART TEMP. RANGE PIN-PACKAGE Smart Card Readers MAX1840EUB -40C to +85C 10 MAX MAX1841EUB -40C to +85C 10 MAX Logic Level Translation SPI/QSPI/MICROWIRE Level Translation Typical Operating Circuit Pin Configuration DV V CC CC TOP VIEW V V DV DV CC CC CC CC DATA 1 10 IO RIN RST RST DV 2 9 V CC CC SIM OR CIN 3 8 CLK MAX1840 SYSTEM MAX1840 SMART MAX1841 CONTROLLER MAX1841 RIN 4 7 RST CARD CLK CLK CIN SHDN (DDRV) 5 6 GND DATA MAX OPTIONAL ( ) ARE FOR MAX1841. IO SHDN* IO OPTIONAL DDRV* GND GND GND SPI and QSPI are trademarks of Motorola, Inc. * SHDN FOR MAX1840 ONLY MICROWIRE is a trademark of National Semiconductor Corp. DDRV FOR MAX1841 ONLY. Maxim Integrated Products 1 For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800. For small orders, phone 1-800-835-8769.Low-Voltage SIM/Smart Card Level Translators in MAX ABSOLUTE MAXIMUM RATINGS DV , V to GND................................................-0.3V to +6.0V Operating Temperature Range ...........................-40C to +85C CC CC RIN, CIN, DATA, DDRV, Storage Temperature Range .............................-65C to +150C SHDN to GND ......................................-0.3V to (DV + 0.3V) Junction Temperature......................................................+150C CC RST, CLK, IO to GND .................................-0.3V to (V + 0.3V) Lead Temperature (soldering, 10s) .................................+300C CC Continuous Power Dissipation (T = +70C) A 10-Pin MAX (derate 5.6mW/C above +70C) ...........444mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (Figure 1, DV = +1.8V V = +1.8V, +3.0V, or +5.0V SHDN = DV , CIN = RIN = GND or DV , IO = V , DATA = DDRV = DV , CC CC CC CC CC CC C = C = C = C = 30pF, T = -40C to +85C, unless otherwise noted. Typical values are at T = +25C.) (Note1) IO CLK RST DATA A A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLIES DV Operating Range DV 1.4 5.5 V CC CC V Operating Range V 1.7 5.5 V CC CC CIN static 0.1 0.5 CIN clocked at 1.625MHz from GND to DV CC 2.5 with 50% duty cycle DV Operating Current I A CC DVCC CIN clocked at 3.25MHz from GND to DV CC 5 with 50% duty cycle CIN static 0.9 3.0 A CIN clocked at 1.625MHz from GND to DV CC 0.4 with 50% duty cycle V Operating Current I CC VCC mA CIN clocked at 3.25MHz from GND to DV CC 0.8 with 50% duty cycle I = I + I , SHDN = GND OFF VCC DVCC Total Shutdown Current I 0.01 1 A (MAX1840 only), or DV = GND SHDN CC or V = GND CC CIN, RIN, SHDN, DDRV LOGIC INPUTS 0.2 DV Digital Input Low Threshold V CC V IL Digital Input High Threshold V 0.7 DV V IH CC Input Leakage Current 0.01 1 A CLK, RST OUTPUTS Digital Output Low Level V I = 200A 0.4 V OL SINK I = 20A 0.9 V SOURCE CC Digital Output High Level V V OH I = 200A 0.8 VCC SOURCE DATA INPUT/OUTPUT DATA Pullup Resistance R Between DATA and DV 13 20 28 k DATA CC Input Low Threshold V (Note 2) 0.3 V IL(DATA) Input High Threshold V (Note 3) DV - 0.6 V IH(DATA) CC Input Low Current I V = 5.0V 1 mA IL CC Input High Current I 2 A IH 2 MAX1840/MAX1841