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MAX19993EVKIT# Analog Devices

MAX19993EVKIT# electronic component of Analog Devices
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Part No.MAX19993EVKIT#
Manufacturer: Analog Devices
Category: RF Development Tools
Description: RF Development Tools Eval Kit MAX19993 (Dual, SiGe, High-Linearity, 1200MHz to 1700MHzDownconversion Mixer with LO Buffer/Switch)
Datasheet: MAX19993EVKIT# Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MAX19993 19-5307 Rev 0 6/10 Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch General Description Features The MAX19993 dual-channel downconverter is designed S 1200MHz to 1700MHz RF Frequency Range to provide 6.4dB of conversion gain, +27dBm input IP3, S 1000MHz to 1560MHz LO Frequency Range 15.4dBm 1dB input compression point, and a noise S 50MHz to 500MHz IF Frequency Range figure of 9.8dB for 1200MHz to 1700MHz diversity S 6.4dB Typical Conversion Gain receiver applications. With an optimized LO frequency range of 1000MHz to 1560MHz, this mixer is ideal S 9.8dB Typical Noise Figure for low-side LO injection architectures. High-side LO S +27dBm Typical Input IP3 injection is supported by the MAX19993A, which is pin- S 15.4dBm Typical Input 1dB Compression Point pin and functionally compatible with the MAX19993. S 72dBc Typical 2RF - 2LO Spurious Rejection at In addition to offering excellent linearity and noise P = -10dBm performance, the MAX19993 also yields a high level RF of component integration. This device includes two S Dual Channels Ideal for Diversity Receiver double-balanced passive mixer cores, two LO buffers, a Applications dual-input LO selectable switch, and a pair of differential S 47dB Typical Channel-to-Channel Isolation IF output amplifiers. Integrated on-chip baluns allow for S Low -6dBm to +3dBm LO Drive single-ended RF and LO inputs. The device requires a nominal LO drive of 0dBm and a typical supply current of S Integrated LO Buffer 337mA at V = +5.0V or 275mA at V = +3.3V. CC CC S Internal RF and LO Baluns for Single-Ended The MAX19993 is pin compatible with the MAX9985/ Inputs MAX19985A/MAX9995/MAX19993A/MAX19994/ S Built-In SPDT LO Switch with 57dB LO-to-LO MAX19994A/MAX19995/MAX19995A series of 700MHz Isolation and 50ns Switching Time to 2200MHz mixers and pin similar to the MAX19997A/ S Pin Compatible with the MAX9985/MAX19985A/ MAX19999 series of 1850MHz to 4000MHz mixers, MAX9995/MAX19993A/MAX19994/MAX19994A/ making this entire family of downconverters ideal for MAX19995/MAX19995A Series of 700MHz to applications where a common PCB layout is used across 2200MHz Mixers multiple frequency bands. S Pin Similar to the MAX19997A/MAX19999 Series The device is available in a 6mm x 6mm, 36-pin TQFN of 1850MHz to 4000MHz Mixers package with an exposed pad. Electrical performance is guaranteed over the extended temperature range, from S Single +5V or +3.3V Supply T = -40NC to +85NC. C S External Current-Setting Resistors Provide Option for Operating Device in Reduced-Power/Reduced- Applications Performance Mode WCDMA/LTE Base Stations Wireless Local Loop Ordering Information Fixed Broadband Wireless Access Private Mobile Radios PART TEMP RANGE PIN-PACKAGE Military Systems MAX19993ETX+ -40NC to +85NC 36 TQFN-EP* MAX19993ETX+T -40NC to +85NC 36 TQFN-EP* +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. T = Tape and reel. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com.Dual, SiGe, High-Linearity, 1200MHz to 1700MHz Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS V to GND ..........................................................-0.3V to +5.5V Continuous Power Dissipation (Note 1) ..............................8.7W CC LO1, LO2 to GND ..............................................................Q0.3V B (Notes 2, 3) ........................................................... +38NC/W JA LOSEL to GND ......................................... -0.3V to (V + 0.3V) B (Notes 1, 3) .............................................................7.4NC/W CC JC RFMAIN, RFDIV, and LO Input Power ........................+15dBm Operating Temperature Range (Note 4) ... T = -40NC to +85NC C RFMAIN, RFDIV Current (RF is DC shorted to GND Junction Temperature .....................................................+150NC through a balun) .............................................................50mA Storage Temperature Range ............................ -65NC to +150NC TAPMAIN, TAPDIV to GND .....................................-0.3V to +2V Lead Temperature (soldering, 10s) ................................+300NC Any Other Pins to GND ............................ -0.3V to (V + 0.3V) Soldering Temperature (reflow) ......................................+260NC CC Note 1: Based on junction temperature T = T + (B x V x I ). This formula can be used when the temperature of the J C JC CC CC exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150NC. Note 2: Junction temperature T = T + (B x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150NC. Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 4: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = 4.75V to 5.25V, no input AC signals. T = -40NC to +85NC, R1 = R4 = 681I, CC C R2 = R5 = 1.82kI. Typical values are at V = 5.0V, T = +25NC, unless otherwise noted. All parameters are production tested.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5 5.25 V CC Supply Current I Total supply current 337 400 mA CC LOSEL Input High Voltage V 2 V IH LOSEL Input Low Voltage V 0.8 V IL LOSEL Input Current I I -10 +10 FA IH and IL 3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = 3.0V to 3.6V, no input AC signals. T = -40NC to +85NC, R1 = R4 = 681I, R2 = R5 = 1.43kI. CC C Typical values are at V = 3.3V, T = +25NC, unless otherwise noted. Parameters are guaranteed by design and not production CC C tested.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 3.0 3.3 3.6 V CC Supply Current I Total supply current (Note 5) 275 mA CC LOSEL Input High Voltage V 2 V IH LOSEL Input Low Voltage V 0.8 V IL 2 MAX19993

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