EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX20019/MAX20020 3.2MHz, 500mA Dual Step-Down Converters for Automotive Cameras General Description Benefits and Features MAX20019/MAX20020 are 2.2MHz and 3.2MHz dual Small Solution Size step-down converters with integrated high-side and low- 2mm x 3mm x 0.75mm 10-pin TDFN with side MOSFETs. The high-voltage step-down converter an Exposed Pad 2.2MHz and 3.2MHz Operation Allows is designed for continuous operation up to 17V input voltages. The output voltage is factory preset. Buck 1 is Smaller System Size No External Components Needed for Soft-Start preset to 3.3V, 3.0V, or 2.8V. Buck 2 is preset to 1.8V, 1.5V, 1.2V, or 1V. Another option is Buck 1 preset to 5V Cable Flexibility and Buck 2 preset to 3.3V. 500mV Enable Hysteresis Allows for Long, Low-Cost Cables During Slow Starts The low-voltage buck features fixed-frequency PWM- mode operation with a switching frequency of 2.2MHz EMI Solutions or 3.2MHz. High-frequency operation allows for an Optional Spread-Spectrum Frequency Modulation all-ceramic capacitor design and small-size external Pinout Placement Allows for Tight PCB Layout of components. The low-resistance on-chip switches ensure Switching Nodes high efficiency while minimizing critical inductance. A Self-Protected 500mV enable hysteresis on the MAX20019 allows the Overvoltage Protection, Thermal Shutdown, use of long, low-cost coax cables, even during slow start- Short-Circuit Protection up situations. The MAX20020s Buck 1 starts after V SUP Automotive Ready is greater than 5.5V and Buck 1 is driven by the EN input. Wide 3.5V to 17V Input Voltage Range Protection features include overvoltage (OV) protection, for Power-Over-Coax cycle-by-cycle current limit, and thermal shutdown with Automotive Temperature Range -40C to +125C automatic recovery. The buck converters operate 180 AEC-Q100 Qualified out-of-phase from each other to minimize input-current ripple. Ordering Information and Typical Operating Circuits appear Applications at end of data sheet. Surround-View Camera Power Supplies Automotive Point-of-Load 19-100040 Rev 9 1/19MAX20019/MAX20020 3.2MHz, 500mA Dual Step-Down Converters for Automotive Cameras Absolute Maximum Ratings SUP, EN, LX1 to PGND* .......................................-0.3V to +18V Operating Temperature Range ......................... -40C to +125C OUT2 to PGND .......................................-0.3V to (V + 0.3)V Junction Temperature ......................................................+150C PV2 BST to LX1 ..............................................................-0.3V to +6V Storage Temperature Range ............................ -65C to +150C PV2, LX2 to PGND* ................................................-0.3V to +6V Soldering Temperature (reflow) .......................................+260C AGND to PGND ....................................................-0.3V to +0.3V Lead Temperature ...........................................................+300C BIAS to AGND ......................................................-0.3V to +6.0V LX1 Short-Circuit Duration ........................................Continuous *LX1 has internal clamp diodes to PGND/AGND and SUP. LX2 has internal LX2 Short-Circuit Duration ........................................Continuous clamp diodes to PV2 and PGND. Applications that forward bias these diodes Continuous Power Dissipation (T = +70C) should take care not to exceed the ICs package power-dissipation limits. A derate 15.7mW/C above +70C ............................1253.9mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 10 TDFN Package Code T1032+2C Outline Number 21-100125 Land Pattern Number 90-100079 PACKAGE TYPE: 10 SWTDFN Package Code T1032Y+2C Outline Number 21-100197 Land Pattern Number 90-100079 THERMAL RESISTANCE, SINGLE-LAYER BOARD Junction to Ambient ( ) 87.5C/W JA Junction to Case ( ) 11.7C/W JC THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 63.8C/W JA Junction to Case ( ) 11.7C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. 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