EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX20030/MAX20031 Dual Buck, Sync Boost and LDO Complete Front-End Power Supply with 17A I Q General Description Benefits and Features The MAX20030/MAX20031 ICs are automotive 2.2MHz Meets Stringent OEM Module Power Consumption dual-synchronous step-down controllers with preboost and Performance Specifications controller and low-I LDO. The preboost controller 17A I with 3.3V Buck On Q Q enables V and V to stay in regulation during 25A I with 5V Buck On OUT1 OUT2 Q cold-crank operation all the way down to battery input 25A I with LDO On Q 65A I with All Controllers Enabled of 2V. The ICs offer two high-voltage synchronous step- Q down controllers that operate 180 degrees out of phase. Enables Crank-Ready Designs This device operates with an input-voltage supply from Synchronous Boost Converter for High-Current 3.5V to 42V and can operate in dropout conditions by run- Capability and Efficiency ning at 97% duty cycle. It is intended for applications with EMI Reduction Features Reduce Interference with mid- to high-power requirements that operate at a wide Sensitive Radio Bands without Sacrificing Wide Input input voltage range, such as during automotive cold-crank Voltage Range or engine stop-start conditions. 50ns (typ) Minimum On-Time Guarantees Skip- The step-down controllers operate at a frequency of up Free Operation for 3.3V Output from Car Battery to 2.2MHz to allow small external components, reduced at 2.2MHz output ripple, and to guarantee no AM band interference. Forced Fixed-Frequency PWM Operation The switching frequency is resistor-adjustable (220kHz Resistor-Programmable Frequency Between to 2200kHz). SYNC input programmability enables three 220kHz and 2.2MHz frequency modes for optimized performance: forced fixed- Pin-Selectable Spread Spectrum frequency operation, skip mode with ultra-low quiescent Integration and Thermally Enhanced Packages Save current, and synchronization to an external clock. The ICs Board Space and Cost have a spread-spectrum pin for frequency modulation to Dual 2.2MHz Step-Down Controller with Synchro- minimize EMI interference. nous Boost Controller and HV 200mA LDO The ICs will be offered with a synchronous step-up Current-Mode Controller with Forced-Fixed controller. This preboost circuitry turns on during low Frequency and Skip Modes input-voltage conditions, and is designed to provide power Thermally Enhanced 7mm x 7mm, 48-Pin TQFN to step-down controller channels with input voltages as Packages with Exposed Pad low at 2V. Protection Features Improve System Reliability The ICs feature a power-OK monitor and overvoltage Supply Overvoltage and Undervoltage Lockout and undervoltage lockout. Protection features include Overtemperature and Short-Circuit Protections cycle-by-cycle current limit and thermal shutdown. The MAX20030/MAX20031 are specified for operation over the -40C to +125C automotive temperature range. Device Options PART PACKAGE Applications MAX20030 48-Pin TQFN, 48-Pin QFND Instrument Cluster MAX20031 48-Pin TQFN, 48-Pin QFND Distributed DC Power Systems Navigation and Radio Head Units Ordering Information and Typical Operating Circuit appear at end of data sheet. 19-8485 Rev 21 7/21MAX20030/MAX20031 Dual Buck, Sync Boost and LDO Complete Front-End Power Supply with 17A I Q Absolute Maximum Ratings IN, CS3P, FB3, EN1EN4, TERM, INLDO, LX to ESD Results AGND ................................................................-0.3V to +42V Human Body Model ........................................................2.5kV CDM (MAX20030) .............425V (all pins), 750V (corner pins) OUT1, OUT2, OUT4 to AGND ..............................-0.3V to +12V CDM (MAX20030B) ..........500V (all pins), 750V (corner pins) CS1 to OUT1 ........................................................-0.3V to +0.3V CDM (MAX20031) .............475V (all pins), 750V (corner pins) CS2 to OUT2 ........................................................-0.3V to +0.3V CDM (MAX20031B) ..........500V (all pins), 750V (corner pins) CS3P to CS3N .....................................................-0.3V to +0.3V LU ................................................................................100mA BIAS, AGND ............................................................-0.3V to +6V Continuous Power Dissipation (T = +70C) A FSYNC, FOSC, BSTON, PGOOD , SPS, FB1, FB2, FB4, TQFN (derate 37mW/C above +70C) .....................2963mW COMP , EXTVCC to AGND ................. +0.3V to BIAS + 0.3V Operating Temperature Range ...................... -40C to +125C DL to PGND (Note 1) ............................ -0.3V to BIAS + 0.3V Junction Temperature ......................................................+150C BST to LX (Note 1) ..............................................-0.3V to +6V Storage Temperature Range ............................ -65C to +150C DH to LX (Note 1).................................... -0.3V to BIAS + 0.3V Lead Temperature (soldering, 10s) .................................+300C PGND to AGND ..................................................-0.3V to +0.3V Soldering Temperature (reflow) ...................................... +260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Self-protected against transient voltages exceeding these limits for 50ns under normal operation and loads up to the maximum rated output current. Package Information PACKAGE TYPE: 48 TQFN Package Code T4877+9C Outline Number 21-0144 Land Pattern Number 90-0464 PACKAGE TYPE: 48 SW TQFN Package Code T4877Y+9C Outline Number 21-100354 Land Pattern Number 90-100116 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 23.3C/W JA Junction to Case ( ) 1C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer board. For detailed information on package thermal consideration see www.maxim-ic.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com