EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX20058 60V, 1A, Automotive Synchronous Step-Down DC-DC Converter General Description Benefits and Features The MAX20058 is a high-efficiency, high-voltage, syn- Synchronous DC-DC Converters with Integrated FETs chronous step-down DC-DC converter IC with integrated 60V Input for 14V and 24V Systems MOSFETs that operates over a 4.5V to 60V input. The Internal Compensation converters can deliver up to 1A current. Output voltage is Flexibility programmable from 0.8V to 90%V . The feedback volt- IN Output Adjustable from 0.8V to 90%V IN age-regulation accuracy over -40C to +125C is 1.5%. 200kHz to 2200kHz Adjustable Frequency with External Clock Synchronization The IC features a peak-current-mode-control architecture and can be operated in the pulse-width modulation (PWM) Programmable Peak Current Limit (1.14A or 1.6A) or pulse-frequency modulation (PFM) control schemes. RESET Output and EN Input (26V max) Simplify Power Sequencing The MAX20058 is available in a 12-pin (3mm x 3mm) side-wettable TDFN package with an exposed pad for Protection Features and Operating Range Ideal for thermal heat dissipation. Automotive Applications Programmable EN/UVLO Threshold Applications Adjustable Soft-Start and Prebiased Power-Up 14V/24V Systems Thermal Shutdown Truck Applications -40C to +125C Automotive Temperature Range AEC-Q100 Qualified Ordering Information appears at end of data sheet. 19-100263 Rev 2 5/19MAX20058 60V, 1A, Automotive Synchronous Step-Down DC-DC Converter Absolute Maximum Ratings V to SGND .........................................................-0.3V to +65V Continuous Power Dissipation IN EN/UVLO to SGND ...............................................-0.3V to +26V (Multilayer Board) (T = +70C, A EXTVCC to SGND ................................................-0.3V to +14V derate 24.4mW/C above +70C) ...........................1951.2mW LX to PGND..................................................-0.3V to V + 0.3V Operating Temperature Range ......................... -40C to +125C IN FB, SS, MODE/ILIM, Junction Temperature ......................................................+150C RT/SYNC to SGND .................................-0.3V to V + 0.3V Storage Temperature Range ............................ -65C to +150C CC PGND to SGND.................................................... -0.3V to +0.3V Lead Temperature (soldering, 10s) .................................+300C LX Total RMS Current ........................................................1.2A Soldering Temperature (reflow) .......................................+260C RESET, V to SGND ............................................-0.3V to +6V ESD Protection Human Body Model ................................2kV CC Package Information 12 SW TDFN-EP Package Code TD1233Y+2 Outline Number 21-100176 Land Pattern Number 90-100072 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 41C/W JA Junction to Case ( ) 8.5C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com