EVALUATION KIT AVAILABLE MAX20070/MAX20070B Integrated TFT Power Supplies and LED Backlight Drivers General Description Benefits and Features The MAX20070/MAX20070B are highly integrated Integrates Both TFT Power Supplies and LED power supplies and LED backlight drivers for automotive Backlight Driver in One IC, Reducing Component TFT-LCD applications. The devices integrate one buck- Count boost converter, one boost converter, two gate-driver Alleviates EMI Due to Spread Spectrum on Both supplies, and a boost/SEPIC converter that can power Source Driver Supplies and LED Driver one to two strings of LEDs in the display backlight. 10000:1 Dimming Ratio at 200Hz Dimming The source-driver power supplies consist of a boost Frequency converter and an inverting buck-boost converter that can Available in a 32-Pin (5mm x 5mm) TQFN with an generate voltages up to +15V and -15V. Both source- Exposed Pad for Heat Dissipation and Operates driver power supplies can deliver up to 100mA. The Over the -40C to +105C Ambient Temperature positive source-driver supply regulation voltage (V ) POS Range is set by connecting an external resistor-divider on FBP. Connecting the FBP pin to ground sets the regulation volt- Ordering Information appears at end of data sheet. age (V ) to +6.5V. The negative source-driver supply POS voltage (V ) is always tightly regulated to -V within NEG POS +50mV. The source-driver supplies use an input voltage Simplified Operating Circuit from 2.7V to 5.5V to generate the output voltages. The gate-driver power supplies consist of regulated charge pumps that generate up to +22V and -22V and can BATTERY INPUT L1 D1 deliver up to 3mA each. The regulation voltage (V ) C21 C2 GVDD TFT POWER LGND LGND INPUT BATT on the positive charge pump is set by a resistor-divider VCC IN C22 C1 R17 on FBPG the regulation voltage (V ) on the negative GVEE AGND DRAIN PGVDD charge pump is set by a resistor-divider on FBNG. OVP C7 COMP D3-2 CS The ICs feature a dual-string LED driver that operates off C3 DP ISET a separate input voltage (V ) and can power up to two BATT D3-1 R12 R11 R15 R16 VGVDD strings of LEDs with 160mA (max) of current per string. R4 FBPG LGND C13 PGND C9 MAX20070 The startup and shutdown sequences for all power R5 AGND MAX20070B OUT1 domains are controlled using one of the seven preset AGND OUT2 DGVDD LGND modes that are selectable through a resistor on SEQ. VGVEE DIM LGND INPUT DGVEE DIM TFT POWER INPUT C10 D5 L3 DN The MAX20070/MAX20070B are available in a 32-pin, D13 D6 C11 C19 LX 5mm x 5mm TQFN package with an exposed pad, and C20 D11 HVINP C23 FBP D12 operate over the -40C to +105C ambient temperature VPOS R6 FBNG AGND POS range. C12 V R7 NEG NEG REF TFT POWER C5 R8 SEQ INPUT C14 Applications INN GND LXN D2 C6 Automotive Dashboards AGND EN ENABLE INPUT L2 FLT Automotive Central Information Displays FAULT OUTPUT EP Automotive Head-Up Displays LGND AGND Automotive Navigation Systems 19-7118 Rev 7 7/17MAX20070/MAX20070B Integrated TFT Power Supplies and LED Backlight Drivers Absolute Maximum Ratings BATT to GND ........................................................-0.3V to +52V DGVEE to GND .....................................................-24V to +0.3V OUT , DRAIN, OVP to GND .................................-0.3V to +52V GND to PGND ......................................................-0.3V to +0.3V IN, INN, V , FLT, DIM, CS, EN to GND ...............-0.3V to +6V GND to LGND ......................................................-0.3V to +0.3V CC COMP, ISET to GND ................................ -0.3V to (V + 0.3V) Continuous Power Dissipation (T = +70C) CC A DRAIN and CS Continuous Current .....................................2.4A TQFN (derate 34.5mW/C above +70C), FBPG, FBNG, REF, FBP, SEQ to GND .....-0.3V to (V + 0.3V) Multilayer Board .........................................................2759mW IN LXP, HVINP to GND ..............................................-0.3V to +22V Operating Temperature Range ......................... -40C to +105C PGVDD, POS to GND ........................... -0.3V to V + 0.3V Junction Temperature ......................................................+150C HVINP NEG to GND........................................................-24V to +0.3V Storage Temperature Range ............................ -65C to +150C LXN to INN ............................................................-24V to +0.3V Lead Temperature (soldering, 10s) .................................+300C DP, DN to PGND .................................-0.3V to (V + 0.3V) Soldering Temperature (reflow) .........................................260C HVINP DGVDD to GND ....................................................-0.3V to +24V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Note 1) Package Thermal Characteristics TQFN Junction-to-Ambient Thermal Resistance ( ) ..........29C/W JA Junction-to-Case Thermal Resistance ( ) ..............1.7C/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (V = 3.6V, V = 12V, Typical operating circuit as Figure 5, = -40C to +105C, unless otherwise noted. Typical values are at IN BATT T = +25C.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS INPUT SUPPLY IN Voltage Range 2.7 5.5 V IN UVLO Threshold Rising 2.45 2.55 2.65 V IN UVLO Hysteresis 100 mV IN Quiescent Current V = V , V = 3.6V 4 10 A EN GND IN IN Quiescent Current V = V = 3.6V, no switching 2.2 mA EN IN REFERENCE Reference Output Voltage No load 1.234 1.25 1.266 V Reference UVLO Threshold REF rising 1 1.2 V Reference UVLO Hysteresis 100 mV Reference Load Regulation 0 < I < 100A 10 20 mV REF Reference Line Regulation 2.7V < V < 5.5V 2 5 mV IN BOOST REGULATOR V VIN 15 HVINP Output Voltage Range V V 5 15 POS V = V , V = 2.7V to FBP GND IN POS Output Regulation 6.37 6.5 6.63 V 5.5V, 1mA < I < 100mA POS Operating Frequency Dither disabled 850 1000 1150 kHz Frequency Dither +0/-12 % Maxim Integrated 2 www.maximintegrated.com