EVALUATION KIT AVAILABLE MAX20086MAX20089 Dual/Quad Camera Power Protectors General Description Benefits and Features The MAX20086MAX20089 dual/quad camera power pro- Small Solution tector ICs deliver up to 600mA load current to each of their Up to Four 600mA Protection Switches four output channels. Each output is individually protected 3V to 15V Input Supply 3V to 5.5V Device Supply from short-to-battery, short-to-ground, and overcurrent conditions. The ICs operate from a 3V to 5.5V supply and 26V Short-to-Battery Isolation Adjustable Current Limit (100mA to 600mA) with a 3V to 15V camera supply. The input-to-output volt- 2 age drop is only 110mV (typ) at 300mA. Selectable I C Addresses Small (4mm x 4mm) 20-Pin SWTQFN Package 2 The ICs provide an enable input and I C interface to read Precision the diagnostic status of the device. An on-board ADC enables reading of the current through each switch. The 8% Current-Limit Accuracy 0.5ms Soft-Start ASIL B- and ASIL D-compliant versions include support 0.25ms Soft-Shutdown for reading an additional seven diagnostic measurements 0.3A Shutdown Current through the ADC, ensuring high-fault coverage. 110mV Drop at 300mA The MAX20086MAX20089 include overtemperature shut- Designed for Safety Applications down and overcurrent limiting on each output channel ASIL B/D Compliant separately. All devices are designed to operate from -40C Short to V /GND Diagnostics to +125C ambient temperature. BAT Differential Output Over/Undervoltage Diagnostics Input Over/Undervoltage Diagnostics Applications Individual 8-Bit Current, Output Voltage, and Power-over-Coax for Radar and Camera Modules 2 Supply Readings Over I C Autoretry on Fault AEC-Q100, -40C to +125C Ordering Information appears at the end of data sheet. 19-100154 Rev 3 3/18MAX20086MAX20089 Dual/Quad Camera Power Protectors Absolute Maximum Ratings IN to PGND ...........................................................-0.3V to +20V Continuous Power Dissipation (T = +70 C) A OUT to IN .............................................................-20V to +26V 20-Pin SWTQFN-EP (derate 30.3 mW/C > 70C) .. 2424mW OUT to PGND .....................................................-0.3V to +26V Operating Temperature .................................... -40C to +125C V to GND ............................................................-0.3V to +6V Junction Temperature ......................................................+150C DD EN, ISET to GND ........................................-0.3V to V + 0.3V Storage Temperature Range ............................ -65C to +150C DD SDA, SCL, ADDR, INT to GND ............................-0.3V to +6.0V Lead Temperature Range ................................................+300C GND to PGND ......................................................-0.3V to +0.3V Output Short-Circuit Duration, Continuous Maximum Continuous Output Current .................................1A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 20 SWTQFN-EP PACKAGE CODE T2044Y+4C Outline Number 21-100068 Land Pattern Number 90-0409 Thermal Resistance, Single-Layer Board: Junction-to-Ambient Thermal Resistance ( ) 48C/W JA Junction-to-Case Thermal Resistance ( ) 2C/W JC Thermal Resistance, Four-Layer Board: Junction-to-Ambient Thermal Resistance ( ) 33C/W JA Junction-to-Case Thermal Resistance ( ) 2C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com