EVALUATION KIT AVAILABLE MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod General Description Features The MAX2021 low-noise, high-linearity, direct upcon- 650MHz to 1200MHz RF Frequency Range version/downconversion quadrature modulator/demod- Scalable Power: External Current-Setting ulator is designed for RFID handheld and portal Resistors Provide Option for Operating Device in readers, as well as single and multicarrier 650MHz to Reduced-Power/Reduced-Performance Mode 1200MHz GSM/EDGE, cdma2000 , WCDMA, and 36-Pin, 6mm x 6mm TQFN Provides High Isolation iDEN base-station applications. Direct conversion architectures are advantageous since they significantly in a Small Package reduce transmitter or receiver cost, part count, and Modulator Operation: power consumption as compared to traditional IF-based Meets 4-Carrier WCDMA 65dBc ACLR double conversion systems. +21dBm Typical OIP3 In addition to offering excellent linearity and noise perfor- mance, the MAX2021 also yields a high level of compo- +58dBm Typical OIP2 nent integration. This device includes two matched +16.7dBm Typical OP 1dB passive mixers for modulating or demodulating in-phase and quadrature signals, two LO mixer amplifier drivers, -32dBm Typical LO Leakage and an LO quadrature splitter. On-chip baluns are also 43.5dBc Typical Sideband Suppression integrated to allow for single-ended RF and LO connec- -174dBm/Hz Output Noise Density tions. As an added feature, the baseband inputs have been matched to allow for direct interfacing to the trans- DC to 550MHz Baseband Input Allows a Direct mit DAC, thereby eliminating the need for costly I/Q Launch DAC Interface, Eliminating the Need for buffer amplifiers. Costly I/Q Buffer Amplifiers The MAX2021 operates from a single +5V supply. It is DC-Coupled Input Allows Ability for Customer available in a compact 36-pin TQFN package (6mm x Offset Voltage Control 6mm) with an exposed pad. Electrical performance is Demodulator Operation: guaranteed over the extended -40C to +85C temper- ature range. +35.2dBm Typical IIP3 Applications +76dBm Typical IIP2 > 30dBm IP 1dB RFID Handheld and Portal Readers 9.2dB Typical Conversion Loss Single and Multicarrier WCDMA 850 Base Stations 9.3dB Typical NF Single and Multicarrier cdmaOne and cdma2000 Base Stations 0.06dB Typical I/Q Gain Imbalance GSM 850/GSM 900 EDGE Base Stations 0.15 I/Q Typical Phase Imbalance Predistortion Transmitters and Receivers Ordering Information WiMAX Transmitters and Receivers PART TEMP RANGE PIN-PACKAGE Fixed Broadband Wireless Access 36 TQFN-EP* Military Systems MAX2021ETX+ -40C to +85C (6mm x 6mm) Microwave Links 36 TQFN-EP* MAX2021ETX+T -40C to +85C Digital and Spread-Spectrum Communication Systems (6mm x 6mm) Video-on-Demand (VOD) and DOCSIS Compliant +Denotes a lead(Pb)-free/RoHS-compliant package. Edge QAM Modulation *EP = Exposed pad. Cable Modem Termination Systems (CMTS) T = Tape and reel. cdma2000 is a registered certification mark and registered service mark of the Telecommunications Industry Association. iDEN is a registered trademark of Motorola Trademark Holdings, LLC. cdmaOne is a trademark of CDMA Development Group. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrateds website at www.maximintegrated.com. 19-3918 Rev 2 4/13MAX2021 High-Dynamic-Range, Direct Up-/Downconversion 650MHz to 1200MHz Quadrature Mod/Demod ABSOLUTE MAXIMUM RATINGS VCC to GND ........................................................-0.3V to +5.5V RBIASLO3 Maximum Current .............................................10mA BBI+, BBI-, BBQ+, BBQ- to GND...............-3.5V to (V + 0.3V) Continuous Power Dissipation (Note 1) ...............................7.6W CC LO, RF to GND Maximum Current ......................................30mA Operating Case Temperature Range (Note 2) ....-40C to +85C RF Input Power...............................................................+30dBm Maximum Junction Temperature .....................................+150C Baseband Differential I/Q Input Power...........................+20dBm Storage Temperature Range .............................-65C to +150C LO Input Power...............................................................+10dBm Lead Temperature (soldering, 10s) .................................+300C RBIASLO1 Maximum Current .............................................10mA Soldering Temperature (reflow) .......................................+260C RBIASLO2 Maximum Current .............................................10mA Note 1: Based on junction temperature T = T + ( x V x I ). This formula can be used when the temperature of the J C JC CC CC exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150C. Note 2: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS TQFN Junction-to-Ambient Junction-to-Case Thermal Resistance ( ) (Notes 3, 4) .......................+34C/W Thermal Resistance ( ) (Notes 1, 4) ......................+8.5C/W JA JC Note 3: Junction temperature T = T + ( x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150C. Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. DC ELECTRICAL CHARACTERISTICS (MAX2021 Typical Application Circuit, V = 4.75V to 5.25V, GND = 0V, I/Q inputs terminated into 50 to GND, LO input terminated into CC 50, RF output terminated into 50, 0V common-mode input, R1 = 432, R2 = 619, R3 = 332, T = -40C to +85C, unless otherwise C noted. Typical values are at V = 5V, T = +25C, unless otherwise noted.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5.00 5.25 V CC Total Supply Current I Pins 3, 13, 15, 31, 33 all connected to V 230 271 315 mA TOTAL CC Total Power Dissipation 1355 1654 mW RECOMMENDED AC OPERATING CONDITIONS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT RF Frequency (Note 5) f 650 1200 MHz RF LO Frequency (Note 5) f 750 1200 MHz LO IF Frequency (Note 5) f 550 MHz IF LO Power Range P -6 +3 dBm LO 2 Maxim Integrated