EVALUATION KIT AVAILABLE MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator General Description Benefits and Features The MAX2022 low-noise, high-linearity, direct conversion 1500 MHz to 3000MHz RF Frequency Range quadrature modulator/demodulator is designed for single 1500 MHz to 3000MHz LO Frequency Range and multicarrier 1500MHz to 3000MHz UMTS/WCDMA, Scalable Power: External Current-Setting Resistors LTE/TD-LTE, cdma2000 , and DCS/PCS base-station Provide Option for Operating Device in Reduced- applications. Direct conversion architectures are advanta- Power/Reduced-Performance Mode geous since they significantly reduce transmitter or receiv- 36-Pin, 6mm x 6mm TQFN Provides High Isolation in er cost, part count, and power consumption as compared a Small Package to traditional IF-based double conversion systems. Modulator Operation (2140MHz): Meets Four-Carrier WCDMA 65dBc ACLR In addition to offering excellent linearity and noise perfor- mance, the MAX2022 also yields a high level of component 23.3dBm Typical OIP3 integration. This device includes two matched passive mix- 51.5dBm Typical OIP2 ers for modulating or demodulating in-phase and quadra- 45.7dBc Typical Sideband Suppression ture signals, three LO mixer amplifier drivers, and an LO -40dBm Typical LO Leakag e quadrature splitter. On-chip baluns are also integrated -173.2dBm/Hz Typical Output Noise, Eliminating the to allow for single-ended RF and LO connections. As an Need for an RF Output Filter added feature, the baseband inputs have been matched Broadband Baseband Input to allow for direct interfacing to the transmit DAC, thereby DC-Coupled Input Provides for Direct Launch DAC eliminating the need for costly I/Q buffer amplifiers. Interface, Eliminating the Need for Costly I/Q The MAX2022 operates from a single +5V supply. It is Buffer Amplifiers available in a compact 36-pin TQFN package (6mm x Demodulator Operation (1890MHz): 6mm) with an exposed paddle. Electrical performance is 39dBm Typical IIP3 guaranteed over the extended -40C to +85C tempera- 58dBm Typical IIP2 ture range. 9.2dB Typical Conversion Loss 9.4dB Typical NF Applications Single and Multicarrier WCD MA/UMTS and Ordering Information appears at end of data sheet. LTE/TD-LTE Base Stations For related parts and recommended products to use with this part, refer Single and Multicarrier cdm aOne and cdma2000 to www.maximintegrated.com/MAX2022.related. Base Stations WCDMA, ACLR, ALTCLR and Noise vs. RF Output Single and Multicarrier DCS 1800/PCS 1900 EDGE Power at 2140MHz for Single, Two, and Four Carriers Base Stations PHS/PAS Base Stations -60 -125 4C ADJ -62 Predistortion Transmitters 4C ALT Fixed Broadband Wireless Access -64 -135 -66 Wireless Local Loop -68 -145 Private Mobile Radio 2C ADJ 1C ADJ -70 Military Systems -72 -155 Microwave Links 4C -74 2C Digital and Spread-Spectrum Communication Systems 2C ALT 1C ALT -76 -165 1C -78 NOISE FLOOR cdma2000 is a registered trademark of Telecommunications -80 -175 Industry Association. -50 -40 -30 -20 -10 0 RF OUTPUT POWER PER CARRIER (dBm) cdmaOne is a trademark of CDMA Development Group. 19-3572 Rev 3 7/13 ACLR AND ALT CLR (dBc) NOISE FLOOR (dBm/Hz)MAX2022 High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator Absolute Maximum Ratings VCC to GND .......................................................-0.3V to +5.5V RBIASLO3 Maximum Current ............................................10mA BBIP, BBIN, BBQP, BBQN to GND .......... -2.5V to (V + 0.3V) Continuous Power Dissipation (Note 1) .............................. 7.6W CC LO, RF to GND Maximum Current .....................................50mA Operating Case Temperature Range (Note 2) ... -40C to +85C RF Input Power ..............................................................+20dBm Maximum Junction Temperature .....................................+150C Baseband Differential I/Q Input Power ...........................+20dBm Storage Temperature Range ............................ -65C to +150C LO Input Power ..............................................................+10dBm Lead Temperature (soldering, 10s) .................................+300C RBIASLO1 Maximum Current ............................................10mA Soldering Temperature (reflow) .......................................+260C RBIASLO2 Maximum Current ............................................10mA Note 1: Based on junction temperature T = T + ( x V x I ). This formula can be used when the temperature of the exposed J C JC CC CC pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150C. T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. Note 2: C A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics TQFN Junction-to-Ambient Junction-to-Case Thermal Resistan ce ( ) (Notes 3, 4) .....................+34C/W Thermal Resistan ce ( ) (Notes 1, 4) ....................+8.5C/W JA JC Note 3: Junction temperature T = T + ( x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150C. Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. DC Electrical Characteristics (MAX2022 Typical Application Circuit, V = 4.75V to 5.25V, V = 0V, I/Q ports terminated into 50 to GND, LO and RF ports CC GND terminated into 50 to GND, R1 = 432, R2 = 562, R3 = 301, T = -40C to +85C, unless otherwise noted. Typical values are at C V = 5V, T = +25C, unless otherwise noted.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5.00 5.25 V CC Total Supply Current I Pins 3, 13, 15, 31, 33 all connected to V 292 342 mA TOTAL CC Total Power Dissipation 1460 1796 mW Recommended AC Operating Conditions PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF Frequency f (Note 5) 1500 3000 MHz RF LO Frequency f (Note 5) 1500 3000 MHz LO IF Frequency f (Note 5) 1000 MHz IF LO Power Range P -3 +3 dBm LO Maxim Integrated 2 www.maximintegrated.com