MAX2029 19-1017 Rev 0 10/07 High-Linearity, 815MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch General Description Features 815MHz to 1000MHz RF Frequency Range The MAX2029 high-linearity passive upconverter or downconverter mixer is designed to provide +36.5dBm 570MHz to 900MHz LO Frequency Range IIP3, 6.7dB NF, and 6.5dB conversion loss for an 815MHz 960MHz to 1180MHz LO Frequency Range to 1000MHz RF frequency range to support GSM/cellular (Refer to the MAX2031 Data Sheet) base-station transmitter or receiver applications. With a DC to 250MHz IF Frequency Range 570MHz to 900MHz LO frequency range, this particular 6dB/6.5dB (Upconverter/Downconverter) mixer is ideal for low-side LO injection architectures. For a Conversion Loss pin-to-pin-compatible mixer meant for high-side LO injec- 36.5dBm/39dBm (Downconverter/Upconverter) tion, refer to the MAX2031 data sheet. Input IP3 In addition to offering excellent linearity and noise perfor- +25dBm/+27dBm (Upconverter/Downconverter) Input 1dB Compression Point mance, the MAX2029 also yields a high level of compo- nent integration. This device includes a double-balanced 6.7dB Noise Figure passive mixer core, a dual-input LO selectable switch, Integrated LO Buffer and an LO buffer. On-chip baluns are also integrated to Integrated RF and LO Baluns allow for a single-ended RF input for downconversion (or Low -3dBm to +3dBm LO Drive RF output for upconversion), and single-ended LO inputs. Built-In SPDT LO Switch with 53dB Isolation and The MAX2029 requires a nominal LO drive of 0dBm, and 50ns Switching Time supply current is guaranteed to be below 100mA. Pin Compatible with the MAX2039/MAX2041 The MAX2029 is pin compatible with the MAX2039, 1700MHz to 2200MHz Mixers MAX2041, MAX2042, MAX2044 series of 1700MHz to External Current-Setting Resistor Provides Option 2200MHz, 2000MHz to 3000MHz, and 3200MHz to for Operating Mixer in Reduced-Power/Reduced- 3900MHz mixers, making this family of passive upcon- Performance Mode verters and downconverters ideal for applications Lead-Free Package Available where a common printed-circuit board (PCB) layout is used for multiple frequency bands. Ordering Information The MAX2029 is available in a compact 20-pin thin PKG PART TEMP RANGE PIN-PACKAGE QFN package (5mm x 5mm) with an exposed paddle. CODE Electrical performance is guaranteed over the extended 20 Thin Q FN-E P * -40C to +85C temperature range. M AX 2029E TP /- T-40 C to + 85 C T2055-3 ( 5mm x 5mm ) Applications 20 Thin Q FN-E P * M AX20 29E TP + /+ T- 40C to + 85 C T2055-3 ( 5mm x 5mm ) Cellular Band WCDMA Predistortion Receivers and cdma2000 Base T = Tape and reel. Microwave and Fixed Stations *EP = Exposed paddle. Broadband Wireless +Denotes lead-free package. GSM 850/GSM 900 2G Access and 2.5G EDGE Base Pin Configuration/ Wireless Local Loop Stations Functional Diagram Private Mobile Radios TDMA and Integrated Military Systems Digital Enhanced TOP VIEW Network (iDEN ) Base Microwave Links 20 19 18 17 16 Stations Digital and Spread- V 1 15 LO2 CC PHS/PAS Base Stations Spectrum V Communication Systems RF 2 MAX2029 14 CC WiMAX Base Stations and Customer Premise TAP 3 13 GND Equipment GND 4 12 GND E.P. GND 5 11 LO1 67 8 910 cdma2000 is a registered trademark of Telecommunications Industry Association. iDENis a registered trademark of Motorola, Inc. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim s website at www.maxim-ic.com. V CC GND LOBIAS IF+ VCC IF- LOSEL GND GND GNDHigh-Linearity, 815MHz to 1000MHz Upconversion/ Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS V to GND...........................................................-0.3V to +5.5V Continuous Power Dissipation (T = +85C) (Note A) CC C RF (RF is DC shorted to GND through a balun)..................50mA 20-Pin Thin QFN-EP................................................................5W LO1, LO2 to GND..................................................-0.3V to +0.3V (Note B)....................................................................+38C/W JA IF+, IF- to GND...........................................-0.3V to (V + 0.3V) .................................................................................+13C/W CC JC TAP to GND...........................................................-0.3V to +1.4V Operating Temperature Range (Note C) ....T = -40C to +85C C LOSEL to GND ...........................................-0.3V to (V + 0.3V) Maximum Junction Temperature .....................................+150C CC LOBIAS to GND..........................................-0.3V to (V + 0.3V) Storage Temperature Range .............................-65C to +150C CC RF, LO1, LO2 Input Power*............................................+20dBm Lead Temperature (soldering, 10s) .................................+300C Note A: Based on junction temperature T = T + ( x V x I ). This formula can be used when the temperature of the J C JC CC CC exposed paddle is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150C. Note B: Junction temperature T = T + ( x V x I ). This formula can be used when the ambient temperature of the EV kit J A JA CC CC PCB is known. The junction temperature must not exceed +150C. See the Applications Information section for details. Note C: T is the temperature on the exposed paddle of the package. T is the ambient temperature of the device and PCB. C A *Maximum reliable continuous input power applied to the RF, LO, and IF ports of this device is +15dBm from a 50 source. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = +4.75V to +5.25V, no RF signals applied, T = -40C to +85C. IF+ and IF- are DC grounded through CC C an IF balun. Typical values are at V = +5V, T = +25C, unless otherwise noted.) CC C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5.00 5.25 V CC Supply Current I 85 100 mA CC LOSEL Input Logic-Low V 0.8 V IL LOSEL Input Logic-High V 2V IH Input Current I , I 0.01 A IH IL AC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, C5 = 3.3pF, L1 and C4 not used, V = +4.75V to +5.25V, RF and LO ports are driven from 50 sources, CC P = -3dBm to +3dBm, P = 0dBm, f = 815MHz to 1000MHz, f = 570MHz to 900MHz, f = 90MHz, f < f , T = -40C to LO RF RF LO IF LO RF C +85C, unless otherwise noted. Typical values are at V = +5V, P = 0dBm, f = 920MHz, f = 830MHz, f = 90MHz, CC LO RF LO IF T = +25C, unless otherwise noted.) (Note 1) C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS RF Frequency Range f (Note 2) 815 1000 MHz RF LO Frequency Range f (Note 2) 570 900 MHz LO IF Frequency Range f External IF transformer dependence (Note 2) DC 250 MHz IF LO Drive P (Note 2) -3 +3 dBm LO LO2 selected, P = +3dBm, T = +25C, LO C f = 920MHz to 960MHz, f = 830MHz to 48 53 RF LO 870MHz LO1-to-LO2 Isolation (Note 3) dB LO1 selected, P = +3dBm, T = +25C, LO C f = 920MHz to 960MHz, f = 830MHz to 50 56 RF LO 870MHz Maximum LO Leakage at RF Port P = +3dBm -17 dBm LO P = +3dBm, f = 920MHz to 960MHz, LO RF Maximum LO Leakage at IF Port -29.5 -23 dBm f = 830MHz to 870MHz (Note 3) LO 2 MAX2029