MAX20317 Universal 3.5mm Accessory Management IC General Description Benefits and Features 2 The MAX20317 is an I C controllable, universal 3.5mm Allows Wide Range of Applications by Supporting accessory management IC. The device provides a universal Universal 3.5mm Jack Types jack interface solution, as well as a compact solution for Auto-Configuration for CTIA and OMTP Headsets the power management and interface control of a powered Supports MEMS Microphone accessory, such as an active noise cancelling (ANC) 50m Ground Switch headset. Enables Long Utilization of Accessories by Supplying The MAX20317 automatically measures headset Power Through 3.5mm Jack impedance with a high precision, triple current source Powered Accessory/Headset Detection 8 bit ADC. After impedance detection, the device also Bypass Switch to Power Accessories such as detects when a headset is in a CTIA or OMTP configuration ANC Headsets and automatically configures the SLEEVE and RING2 Programmable Button Detection in Powered terminals to correctly connect the microphone and ground Accessory Mode lines. Empowers New Path in Data Communication to When a boost supply is applied, the MAX20317 can Accessories detect the presence of an ANC headset. When the ANC Power Line Communication by 3.5mm Jack headset is detected and enabled, a button-press monitoring Bidirectional Digital Data Communication in Power circuit activates and flags button presses by detecting the Mode voltage drop across a sense resistor. Allow Emergence of New Accessory Types The MAX20317 provides a power line communication tool Provides Comfortable Sounds by Introducing to a headset to exchange the data with the host device. Automatic Volume Adjustment The MAX20317 has the two separate ground sense inputs Adaptive Volume Control Based on Precision from the SLEEVE and RING2 terminals of the connector Headset Impedance to provide a high ground isolation to the audio codec. False Insertion Detection The MAX20317 is available in a space-saving, 20-bump, Saves Board Space with Small Form Factor 0.4mm pitch, 1.65mm x 2.05mm wafer-level package 1.65mm x 2.05mm 4 x 5 Array 20 Bump 0.4mm (WLP) and operates over the -40C to +85C extended Pitch WLP temperature range. Applications Ordering Information appears at end of data sheet. Smart Phones Tablet PCs Phablet Notebook PCs Typical Application Circuit CODEC VCC +5V MIC1 MIC1-BIAS R-G L-G R-A L-A 1F 1F 6.8 VIO V V RSEN MIC OUT CC BOOST G SNSR G SNSL APPLICATION MIC SLEEVE PROCESSOR MAX20317 LEFT RING2 SDA SDA DETIN DET SCL SCL SLEEVE SL RIGHT INT SLEEVE SR GND RING2 SL RING2 SR DGND GND 19-100037 Rev 0 5/17MAX20317 Universal 3.5mm Accessory Management IC Absolute Maximum Ratings All voltages are referred to GND unless otherwise noted Continuous Current into Any Other Terminal .................100mA V , SCL, SDA, INT ...............................................-0.3V to +6V Continuous Power Dissipation (Multilayer Board) CC V , RSEN .....................................................-0.3V to +12V (Derate 18.02mW/C above +70C) .......................1441.6mW BOOST MIC OUT ....................................................-0.3V to V + 0.3V Operating Temperature Range ........................... -40C to +85C CC DETIN .............................................................-3V to V + 0.3V Junction Temperature ......................................................+150C CC SLEEVE, SLEEVE SL, SLEEVE SR, Storage Temperature Range ............................ -65C to +150C RING2, RING2 SL, RING2 SR ..........................-0.3V to +6V Soldering Temperature (Reflow) ......................................+260C G SNSL, G SNSR ..............................................-0.3V to +0.3V Continuous Current into V , RSEN, BOOST MIC OUT, RING2, SLEEVE .......................................200mA Package Thermal Characteristics (Note 1) WLP Junction-to-Ambient Thermal Resistance, Four Layer Board ( ) ..........................................55.49C/W JA Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Electrical Characteristics (V = +3.0V to +5.5V, V = 0V to +5.5V, T = -40C to +85C, unless otherwise noted. Typical values are at V = +3.5V, CC BOOST A CC T = +25C.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS V CC Supply Voltage Range V 3 5.5 V CC V POR V 0.9 1.7 2.45 V CC CCPOR V = +3.5V, DETIN = 1 2 5 CC A BYPASS (0x08 2 ) = 0, DETIN = 0 10 15 V Supply Current I CC VCC V = +3.5V, BYPASS (0x08 2 ) = 1, CC 0.1 0.2 mA DETIN = 0, I = 30mA VBOOST Bypass Supply Voltage V 5.5 V BOOST Range DETIN DETIN Pullup Current I 4.5 A DETIN PU DETIN Detection 1/3 x 1/2 x 2/3 x V Threshold V V V CC CC CC SET IDET (0x0B 5:4 ) = 01 95 100 105 A DETIN Current Source I SET IDET (0x0B 5:4 ) = 10 1.05 1.1 1.15 DETIN mA SET IDET (0x0B 5:4 ) = 11 5.25 5.5 5.75 Maxim Integrated 2 www.maximintegrated.com