MAX2090 50MHz to 1000MHz Analog VGA with Threshold Alarm Circuit and Error Amplifier for Level Control General Description Benefits and Features The MAX2090 high-linearity analog variable-gain ampli- S Wideband Coverage fier (VGA) is a monolithic SiGe BiCMOS attenuator, 50MHz to 1000MHz RF Frequency Range amplifier, error amplifier, and alarm circuit, designed to S High Linearity interface with 50I systems operating in the 50MHz to +38dBm OIP3 (100MHz) 1000MHz frequency range. An external analog control +17.5dBm Output -1dB Compression Point voltage controls the analog attenuator. The device fea- (100MHz) tures a gain range of -10.9dB to +26.1dB, a noise figure S 26.1dB Gain of 4dB, OIP3 linearity of +38dBm, and a wide RF band- S 37dB Attenuator Range width. Each of these features makes the device an ideal VGA for numerous receiver and transmitter applications. S 4dB Noise Figure (Includes Attenuator Insertion In addition, the device operates from a single +5.0V sup- Loss) ply. S 0.25dB Gain Variation Over 100MHz Bandwidth This device is available in a compact 20-pin TQFN pack- S Analog Attenuator Controlled with External age (5mm x 5mm) with an exposed pad. Electrical per- Voltage formance is guaranteed over the extended temperature S Alarm Circuit with Adjustable Threshold range, from T = -40NC to +95NC. C S Extended +4.75V to +5.8V Supply Range Applications S Lead(Pb)-Free Package Point-to-Point Receivers and Transmitters S Power-Down Capabilities RF/IF Variable-Gain Stages Ordering Information appears at end of data sheet. Temperature-Compensation Circuits Cellular Applications WiMAX Applications LTE Applications Fixed Broadband Wireless Access Wireless Local Loop WiMAX is a trademark of WiMAX Forum. For related parts and recommended products to use with this part, refer to: www.maximintegrated.com/MAX2090.related For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-6034 Rev 2 5/15MAX2090 50MHz to 1000MHz Analog VGA with Threshold Alarm Circuit and Error Amplifier for Level Control ABSOLUTE MAXIMUM RATINGS V , V ........................................................-0.3V to +6V RF OUT Output Power .................................................+20dBm CC A CC RF RF IN, RF OUT ........................................ -0.3V to (V + 0.3V) Continuous Power Dissipation (Note 1) ..............................2.5W CC R BIAS, ALM THRES, PLVLSET, Operating Case Temperature Range (Note 2) .. -40NC to +95NC AMP OUT ..........................................................-0.3V to +3.6V Maximum Junction Temperature .....................................+150NC CTRL1, CTRL2 .....................................................-0.3V to +3.6V Storage Temperature Range ............................ -65NC to +150NC ALM ......................................................................-0.3V to +3.6V Lead Temperature (soldering, 10s) ................................+300NC DET VIN ..............................................................-0.3V to +3.6V Soldering Temperature (reflow) ......................................+260NC RF IN Input Power ........................................................+15dBm Note 1: Based on junction temperature T = T + (q x V x I ). This formula can be used when the temperature of the J C JC CC CC exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150NC. Note 2: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS TQFN Junction-to-Ambient Thermal Resistance q (Notes 3, 4) ..+29NC/W JA Junction-to-Case Thermal Resistance q (Notes 1, 4) .........7NC/W JC Note 3: Junction temperature T = T + (q x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150NC. Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, V = 4.75V to 5.8V, V = 0V, and T = -40NC to +95NC. Typical values are at V = 5.5V, CC GND C CC V = 2.5V, and T = +25NC, unless otherwise noted.) (Note 5) PLVLSET C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5.0 5.8 V CC CTRL1 = 1, CTRL2 = 1 81 110 Total Supply Current I CTRL1 = 1, CTRL2 = 0 71 100 mA DC CTRL1 = 0, CTRL2 = 0 5.7 15 CTRL1/CTRL2 Logic-Low Input V 0.8 V IL Voltage CTRL1/CTRL2 Logic-High Input V 2.2 V IH Voltage CTRL1/CTRL2 Input Logic I , I -10 +10 FA IH IL Current PLVLSET Input Resistance R 650 kI IN PLVLSET Input Voltage Range 0 2.5 V PLVLSET Minimum Control 0 0.1 0.2 V Voltage Maxim Integrated 2