MAX2092 700MHz to 2700MHz Analog VGA with Threshold Alarm Circuit and Error Amplifier for Level Control General Description Benefits and Features The MAX2092 high-linearity analog variable-gain ampli fier Wide Band Analog VGA Increases System (VGA) is a monolithic SiGe BiCMOS attenuator/amplifier/ Performance error amplifier with an alarm circuit designed to interface 700MHz to 2700MHz RF Frequency Range with 50I systems operating in the 700MHz to 2700MHz High Linearity frequency range. The device features a gain range of +32.5dBm OIP3 +18.2dBm Output -1dB Compression Point +18.1dB to -22.3dB, a noise figure of 5.2dB, OIP3 linear- ity of +32.5dBm, and a wide RF bandwidth. Each of these 18.1dB Gain with 40.4dB Attenuation Range and 0.03dB Gain Variation Over 100MHz Bandwidth at features makes the device an ideal VGA for numerous receiver and transmitter applications. When paired with 1835MHz 5.2dB Noise Figure (Includes Attenuator Insertion the MAX2091 or MAX2091B variable gain upconverter, a Loss) complete 2-chip IF-RF signal conditioning solution is pos- sible for microwave point-to-point transmitters. Integrated Error Amplifier and Alarm Circuit Simplifies ALC Operation The MAX2092 operates from a single +5V supply, and is available in a compact 20-pin TQFN package (5mm Lowers Power Consumption with Power-Down x 5mm) with an exposed pad. Electrical per formance is Capability guaranteed over the extended temperature range from Package with Exposed Pad Improves Heat T = -40NC to +95NC. C Dissipation and System Performance Applications Microwave Point-to-Point Receivers and Transmitters RF Variable-Gain Stages Temperature Compensation Circuits Ordering Information appears at end of data sheet. Cellular Applications WiMAX Applications LTE Applications Fixed Broadband Wireless Access Wireless Local Loop WiMAX is a registered certification mark and registered service mark of WiMAX Forum. 19-6377 Rev 1 7/15MAX2092 700MHz to 2700MHz Analog VGA with Threshold Alarm Circuit and Error Amplifier for Level Control Absolute Maximum Ratings V , V ........................................................-0.3V to +6V Operating Case Temperature CC RF CC A RF OUT, RF IN ........................................ -0.3V to (V + 0.3V) Range (Note 2) ............................................... -40NC to +95NC CC R BIAS, CTRL1, CTRL2, Maximum Junction Temperature .....................................+150NC PLVLSET, DET VIN ... -0.3V to Minimum (V + 0.3V, +3.6V) Storage Temperature Range ............................ -65NC to +150NC CC RF IN Input Power ........................................................+15dBm Lead Temperature (soldering, 10s) ................................+300NC RF OUT Output Power ..................................................+23dBm Soldering Temperature (reflow) .................................... +260NC Continuous Power Dissipation (Note 1) .............................2.5W Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Based on junction temperature T = T + (B x V x I ). This formula can be used when the temperature of the J C JC CC CC exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction temperature must not exceed +150NC. Note 2: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB. C A Package Thermal Characteristics Junction-to-Ambient Thermal Resistance (q ) Junction-to-Case Thermal Resistance (q ) JA JC (Notes 3, 4) ................................................................. 32C/W (Notes 1, 4) ................................................................... 7C/W Note 3: Junction temperature T = T + (q x V x I ). This formula can be used when the ambient temperature of the PCB is J A JA CC CC known. The junction temperature must not exceed +150NC. Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. DC Electrical Characteristics (Typical Application Circuit with V = 4.75V to 5.8V, V = 0V, and T = -40C to +95C. Typical values are at V = 5.5V and CC GND C CC T = +25C, unless otherwise noted.) (Note 5) C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage V 4.75 5.8 V CC Power down: CTRL1 = 0, CTRL2 = 0 2 3 Total Supply Current I VGA-only mode: CTRL1 = 1, CTRL2 = 0 80 90 mA DC ALC mode: CTRL1 = 1, CTRL2 = 1 93 110 CTRL1/CTRL2 Logic-Low Input V 0.8 V IL Voltage CTRL1, CTRL2 Logic-High Input V 2.2 V IH Voltage Input Logic Current I I -1 +1 A IH, IL PLVLSET Input-Voltage Range V 0 2.5 V IN DET VIN Input-Voltage Range V 0 2.5 V IN Maxim Integrated 2 www.maximintegrated.com