X-On Electronics has gained recognition as a prominent supplier of MAX2209EBS+T RF Detector across the USA, India, Europe, Australia, and various other global locations. MAX2209EBS+T RF Detector are a product manufactured by Analog Devices. We provide cost-effective solutions for RF Detector, ensuring timely deliveries around the world.

MAX2209EBS+T Analog Devices

MAX2209EBS+T electronic component of Analog Devices
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Part No.MAX2209EBS+T
Manufacturer: Analog Devices
Category: RF Detector
Description: RF Detector RF Power Detector
Datasheet: MAX2209EBS+T Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
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1 : USD 2.7027
10 : USD 1.953
25 : USD 1.827
100 : USD 1.6128
250 : USD 1.512
500 : USD 1.3084
1000 : USD 1.1498
2500 : USD 1.1097
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We are delighted to provide the MAX2209EBS+T from our RF Detector category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MAX2209EBS+T and other electronic components in the RF Detector category and beyond.

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MAX2209 19-4946 Rev 0 10/09 RF Power Detector General Description Features The MAX2209 is a wideband (800MHz to 2GHz) RF S -25dBm to 0dBm Power Detection Range power detector. It takes an RF signal from the directional S 0.5dB Detection Error Due to Temperature coupler at the input, and outputs a DC voltage propor- S +2.7V to +5V Single-Supply Operation tional to the RF peak voltage. The change in output 2 voltage versus temperature is very repeatable from part S Space-Saving 4-Bump, 1mm UCSP Package to part and enables a lookup table based on nominal S On-Chip 50I Termination and DC-Blocking behavior, minimizing the effective detection error to less Capacitor than Q0.5dB relative to room temperature. The MAX2209 comes in a space-saving 2 x 2, 0.5mm pitch wafer-level package (WLP) and requires only two external components. Applications Ordering Information Dual-Band WCDMA Handsets PIN- TOP PART TEMP RANGE High-Speed Downlink Packet Access (HSDPA) PACKAGE MARK High-Speed Uplink Packet Access (HSUPA) MAX2209EBS+ -40NC to +85NC 4 UCSP AGJ +Denotes a lead(Pb)-free/RoHS-compliant package. Pin Configuration/Functional Diagram/Typical Operating Circuit MAX2209 V CC A1 A2 ADC OUT V CC B1 B2 RF INPUT GND RFIN UCSP is a trademark of Maxim Integrated Products, Inc. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLERF Power Detector ABSOLUTE MAXIMUM RATINGS V to GND .............................................................-0.3V to +6V Junction-to-Ambient Thermal CC RFIN to GND .........................................-0.3V to + (V + 0.3V) Resistance (B ) (Note 1) ..........................................335NC/W CC JA OUT to GND ..........................................-0.3V to + (V + 0.3V) Operating Temperature Range .......................... -40NC to +85NC CC RFIN Input Power ..........................................................+10dBm Storage Temperature Range ............................ -65NC to +160NC Continuous Power Dissipation (T = +70NC) Junction Temperature ....................................................+150NC A 4-Bump WLP (derate 3mW/NC above +70NC) .............238mW Bump Temperature (soldering, Note 2) Infrared (15s) ...............................................................+260NC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 2: For detailed information on soldering, refer to Application Note 1891: Wafer-Level Packaging (WLP) and Its Applications. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION ESD SENSITIVE DEVICE DC ELECTRICAL CHARACTERISTICS (V = 2.7V to 5.0V, T = -40NC to +85NC, no RF signal applied. Typical values are at V = 2.8V, T = +25NC, unless otherwise CC A CC A noted.) (Note 3) PARAMETER CONDITIONS MIN TYP MAX UNITS Supply Voltage 2.7 5.0 V Supply Current 3.6 6 mA Idle Output Voltage V = 2.8V, no RF signal 35 mV CC Output Current Source Capability P = 0dBm, V forced to 0.5V 750 1800 FA IN OUT Output Current Sink Capability No RF signal, V forced to 2V 300 525 FA OUT AC ELECTRICAL CHARACTERISTICS (T = -40NC to +85NC, 50I system, V = 2.8V. Typical values are at T = +25NC, unless otherwise noted.) (Note 3) A CC A PARAMETER CONDITIONS MIN TYP MAX UNITS RF Input Frequency 800 2000 MHz 800MHz -17 RF Input VSWR dB 2000MHz -12 -5dBm input 0.88 Output Voltage, 836MHz V -25dBm input 0.06 -5dBm input 0.72 Output Voltage, 1950MHz V -25dBm input 0.06 Residual Error after Room -5dBm input Q0.5 Temperature Calibration dB -25dBm input Q1.5 (T = -40NC to +85NC) (Note 4) A Note 3: Guaranteed by production test at T = +25NC. Guaranteed by design and characterization at T = -40NC and A A T = +85NC. A Note 4: Guaranteed by design and characterization. See the Typical Operating Characteristics. 2 MAX2209

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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