EVALUATION KIT AVAILABLE Click here to ask about production status of specific part numbers. MAX22191 Ultra-Low-Power, Parasitically Powered Digital Input General Description Benefits and Features The MAX22191 is an IEC 61131-2 compliant, industrial High Integration for Flexible Circuit Designs digital input (DI) device. The MAX22191 translates a 24V Interfaces to Optocouplers or Digital Isolators industrial switching signal to a 3.3V/5V CMOS-level Capable of Driving an Optocoupler and Status LED output, or to a 2.3mA (typ) current output for driving an Operational as Sink or Source Digital Input optocoupler and/or LED. Voltage thresholds and current Ultra-High Speed: 250ns (max) Propagation Delay levels in the MAX22191 are compliant with Type 1 and Test Pulse Diagnostic Type 3 inputs, while minimizing power dissipation. The Allows for Small Footprint TVS Surge Protection MAX22191 is also compliant with 48V inputs, with the Reduced Power and Heat Dissipation addition of external resistors. Parasitically Powered from the Field Input Accurate 15% Input-Current Limiting Operating power is derived from the input signal, eliminating 100A (typ) Quiescent Current with Optocoupler the need for an external field-side power supply. A 250ns 96% (typ) Current-Transfer Efficiency to Optocoupler (max) fast response time is ideal for high-speed inputs. Robust Design Additionally, a CMOS-compatible test input is available for Operates from -60V to +60V Input Voltage safety diagnostics. -40C to +125C Ambient Operating Temperature The MAX22191 features robust functionality for harsh industrial systems and is capable of normal operation with Ordering Information appears at end of data sheet. input signals ranging from -60V to +60V. Integrated thermal shutdown further protects the device when V is present. CC The MAX22191 is available in a small, 6-lead SOT23 package and operates over the -40C to +125C ambient temperature range. Applications Process Automation Industrial Automation Motor Controls Individually Isolated Inputs Current Sourcing Inputs Simplified Block Diagram MAX22191 OUT IN TEST REXT 2.3mA V CC INT REF GND 19-100229 Rev 1 10/20MAX22191 Ultra-Low-Power, Parasitically Powered Digital Input Absolute Maximum Ratings (All voltages referenced to GND, unless otherwise stated) Continuous Power Dissipation (T = +70C) A V ........................................................................-0.3V to +6V 6L SOT23 (derate at 8.7mW/C above +70C) ...........696mW CC IN ...........................................................................-70V to +60V Operating Temperature Range TEST .......................................................................-0.3V to +6V Ambient Temperature ................................... -40C to +125C OUT (3.0V V 5.5V) ........................ -0.3V to (V + 0.3V) Junction Temperature ..................................................+150C CC CC OUT (V = 0V) .......................-0.3V to min (V + 0.3V), +6V Storage Temperature Range ............................ -65C to +150C CC IN REXT (3.0V V 5.5V) ...................... -0.3V to (V + 0.3V) Lead Temperature (soldering, 10s) .................................+300C CC CC REXT (V = 0V) .....................-0.3V to min (V + 0.3V), +6V Soldering (reflow) ............................................................+260C CC IN Short-Circuit Duration OUT to GND ..........................................................Continuous Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 6 SOT23 Package Code U6-1 Outline Number 21-0058 Land Pattern Number 90-0175 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient ( ) 115C/W JA Junction to Case ( ) 80C/W JC Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Maxim Integrated 2 www.maximintegrated.com