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MAX22245, MAX22246 Reinforced, Fast, Low-Power, Two- Channel Digital Isolators Product Highlights AEC-Q100 Qualification for /V devices Simplified Application Diagram Reinforced Galvanic Isolation for Digital Signals 1.8V 2.5V 3.3V 8-SOIC with 8mm of Creepage and Clearance 0.1F 0.1F 0.1F 0.1F Withstands 5kV for 60s (V ) RMS ISO VL VCC Continuously Withstands 848V (V ) RMS IOWM MICRO MAX22246C/F MAX22502E V V V DD DDA DDB RE CONTROLLER B Withstands 12.8kV Surge Between GNDA and RX OUT1 IN1 RO GNDB with 1.2/50s Waveform A 2.5V High CMTI (50kV/s, typ) DE Y Low Power Consumption TX DI IN2 OUT2 Z 0.78mW per Channel at 1Mbps with V = 1.8V DD GNDB PSET GND GNDA 4k 1.47mW per Channel at 1Mbps with V = 3.3V DD GND 3.28mW per Channel at 100Mbps with V = DD 1.8V Pin Description Low Propagation Delay and Low Jitter Maximum Data Rate Up to 200Mbps TOP VIEW Low Propagation Delay 7ns (typ) at V = 3.3V DD + + V 1 8 V V 1 8 V DDA DDB DDA DDB Clock Jitter RMS 7.5ps (typ) Safety Regulatory Approvals IN1 2 MAX22245 7 OUT1 OUT1 2 MAX22246 7 IN1 UL According to UL1577 IN2 3 6 OUT2 IN2 3 6 OUT2 cUL According to CSA Bulletin 5A VDE 0884-11 Reinforced Insulation (Pending) GNDA 4 5 GNDB GNDA 4 5 GNDB Key Applications WIDE SOIC WIDE SOIC Automotive These devices transfer digital signals between circuits Hybrid Electric Vehicle with different power domains, using as little as 0.78mW Chargers per-channel at 1Mbps (1.8V supply). The low-power Battery Management Systems (BMS) feature reduces system dissipation, increases reliability, Inverters and enables compact designs. The MAX22245/MAX22246 are a family of 2-channel Devices are available with a maximum data rate of reinforced, fast, low-power digital galvanic isolators 25Mbps or 200Mbps, and with outputs that are either using Maxims proprietary process technology. All default high or default low. The devices feature low devices feature reinforced isolation for a withstand propagation delay and low clock jitter, which reduces voltage rating of 5kV for 60 seconds. Both RMS system latency. automotive and general-purpose devices are rated for Independent 1.71V to 5.5V supplies on each side of the operation at ambient temperatures of -40C to +125C. isolator also make the devices suitable for use as level Devices with /V suffix are AEC-Q100 qualified. Refer to translators. the Ordering Information for all automotive grade part The MAX22245 features two channels transferring data numbers. in the same direction. The two channels of the Industrial MAX22246 transfer data in opposite directions, and this Isolated SPI makes the MAX22246 ideal for isolating the Tx and Rx Isolated RS-232, RS-485/RS-422, CAN lines of a transceiver. Fieldbus Communications Ordering Information appears at end of data sheet. Motor Drive 19-100820 Rev 8 11/21 2021 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. One Analog Way, Wilmington, MA 01887 U.S.A. Tel: 781.329.4700 2021 Analog Devices, Inc. All rights reserved. Reinforced, Fast, Low-Power, Two- MAX22245, MAX22246 Channel Digital Isolators Absolute Maximum Ratings V to GNDA ........................................................-0.3V to +6V OUT on Side B to GNDB ........................................... 30mA DDA Continuous Power Dissipation (T = +70C) V to GNDB ........................................................-0.3V to +6V A DDB Wide SOIC (derate 11.35mW/C above +70C) ...... 908.1mW IN on Side A to GNDA ...........................................-0.3V to +6V Temperature Ratings IN on Side B to GNDB ...........................................-0.3V to +6V Operating Temperature Range ...................... -40C to +125C OUT on Side A to GNDA ...................... -0.3V to (V + 0.3V) DDA Maximum Junction Temperature ................................. +150C OUT on Side B to GNDB ...................... -0.3V to (V + 0.3V) DDB Storage Temperature Range ......................... -60C to +150C Short-Circuit Continuous Current Lead Temperature (soldering, 10s) ............................. +300C OUT on Side A to GNDA ........................................... 30mA Soldering Temperature (reflow) ................................... +260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 8 Wide SOIC Package Code W8MS+7 Outline Number 21-100415 Land Pattern Number 90-100146 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction-to-Ambient ( ) 88.1C/W JA Junction-to-Case Thermal Resistance ( ) 42.4C/W JC Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. www.analog.com Analog Devices 2