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Reinforced, Fast, Low-Power, MAX22290/MAX22291 Two-Channel Digital Isolators Product Highlights Simplified Application Diagram AEC-Q100 Qualification for /V Devices Reinforced Galvanic Isolation for Digital Signals 1.8V 2.5V 3.3V 8-SOIC with 4mm of Creepage and Clearance 0.1F 0.1F 0.1F 0.1F Withstands 3kV for 60s (V ) RMS ISO VL VCC MAX22291C Continuously withstands 445V (V ) MAX22291F MICRO RMS IOWM MAX22502E V V V DD DDA DDB RE CONTROLLER B Withstands 10kV Surge between GNDA and RX OUT1 IN1 RO GNDB with 1.2/50s Waveform A 2.5V High CMTI (50kV/s, typ) DE Y Low Power Consumption TX IN2 OUT2 DI Z 0.78mW per Channel at 1Mbps with V = 1.8V GNDB PSET DD GND GNDA 4k 1.47mW per Channel at 1Mbps with V = 3.3V DD GND 3.28mW per Channel at 100Mbps with V = 1.8V DD Low Propagation Delay and Low Jitter Pin Configurations Up to 200Mbps Maximum Data Rate Low Propagation Delay 7ns (typ) at V = 3.3V TOP VIEW DD Clock Jitter RMS 7.5ps (typ) + + 1 8 1 8 VDDA VDDB VDDA VDDB Safety Regulatory Approvals IN1 2 MAX22290 7 OUT1 OUT1 2 MAX22291 7 IN1 UL According to UL1577 cUL According to CSA Bulletin 5A IN2 3 6 OUT2 IN2 3 6 OUT2 VDE 0884-11 Reinforced Insulation (Pending) GNDA 4 5 GNDB GNDA 4 5 GNDB Key Applications NARROW SOIC NARROW SOIC Automotive Hybrid Electric Vehicle Chargers These devices transfer digital signals between circuits Battery Management Systems (BMS) with different power domains, using as little as 0.78mW Inverters per channel at 1Mbps (1.8V supply). The low-power feature reduces system dissipation, increases reliability, and enables compact designs. The MAX22290/MAX22291 is a family of 2-channel reinforced, fast, low-power digital galvanic isolators The devices are available with a maximum data rate of using Maxims proprietary process technology. All 25Mbps or 200Mbps, and with outputs that are either devices feature reinforced isolation for a withstand default high or default low. They feature low propagation voltage rating of 3kV for 60 seconds. Both RMS delay and low clock jitter, which reduces system latency. automotive and general-purpose devices are rated for Independent 1.71V to 5.5V supplies on each side of the operation at ambient temperatures of -40C to +125C. isolator also make the devices suitable for use as level Devices with /V suffix are AEC-Q100 qualified. See the translators. Ordering Information table for all automotive grade part The MAX22290 features two channels transferring data numbers. in the same direction. The two channels of the Industrial MAX22291 transfer data in opposite directions, and this Isolated SPI makes the MAX22291 ideal for isolating the Tx and Rx Isolated RS-232, RS-485/RS-422, CAN lines of a transceiver. Fieldbus Communications Ordering Information appears at end of data sheet. Motor Drive 19-101159 Rev 2 10/21 2021 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. One Analog Way, Wilmington, MA 01887 U.S.A. Tel: 781.329.4700 2021 Analog Devices, Inc. All rights reserved. MAX22290/MAX22291 Reinforced, Fast, Low-Power, Two-Channel Digital Isolators Absolute Maximum Ratings V to GNDA ........................................................-0.3V to +6V OUT on Side B to GNDB ........................................... 30mA DDA Continuous Power Dissipation (T = +70C) V to GNDB ........................................................-0.3V to +6V A DDB Narrow SOIC (derate 5.79mW/C above +70C) ... 462.96mW IN on Side A to GNDA ...........................................-0.3V to +6V Temperature Ratings IN on Side B to GNDB ...........................................-0.3V to +6V Operating Temperature Range ...................... -40C to +125C OUT on Side A to GNDA ...................... -0.3V to (V + 0.3V) DDA Maximum Junction Temperature ................................. +150C OUT on Side B to GNDB ...................... -0.3V to (V + 0.3V) DDB Storage Temperature Range ......................... -60C to +150C Short-Circuit Continuous Current Lead Temperature (soldering, 10s) ............................. +300C OUT on Side A to GNDA ........................................... 30mA Soldering Temperature (reflow) ................................... +260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 8 NARROW SOIC Package Code S8MS+24 Outline Number 21-0041 Land Pattern Number 90-0096 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction-to-Ambient ( ) 172.8C/W JA Junction-to-Case Thermal Resistance ( ) 67.6C/W JC Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. www.analog.com Analog Devices 2