EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX22502E 100Mbps Full-Duplex RS-485/RS-422 Transceiver for Long Cables General Description Benefits and Features The MAX22502E full-duplex, ESD-protected, RS-485/ High-Speed Operation Over Long Distances RS-422 transceiver is optimized for high-speed (up to Up to 100Mbps Data Rate 100Mbps) communication over long cables.This transceiver Integrated Preemphasis Extends Cable Length High Receiver Sensitivity features larger receiver hysteresis for high noise rejection and improved signal integrity. Integrated preemphasis Wide Receiver Bandwidth Symmetrical Receiver Thresholds circuitry extends the distance, and increases the data rate, of reliable communication by reducing inter-symbol Integrated Protection Increases Robustness interference (ISI) caused by long cables when supplied with -15V to +15V Common Mode Range 5V. Integrated hot-swap protection and a fail-safe receiver 15kV ESD Protection (Human Body Model) ensure a logic-high on the receiver output when input signals 7kV IEC61000-4-2 Air-Gap ESD Protection are shorted or open for longer than 10s (typ). 6kV IEC61000-4-2 Contact Discharge The MAX22502E is available in a 12-pin TDFN-EP (3mm ESD Protection x 3mm) package and operates over the -40C to +125C Driver Outputs are Short-Circuit Protected ambient temperature range. Flexibility for Many Different Applications 3V to 5.5V Supply Range Applications Low Voltage Logic Supply Down to 1.6V Motion Control Low 5A (max) Shutdown Current Available in 12-pin TDFN (3mm x 3mm) Package Encoder Interfaces -40C to +125C Operating Temperature Range Field Bus Networks Industrial Control Systems Ordering Information appears at end of data sheet. Backplane Busses Simplified Block Diagram VL VCC B RO R A RE SHUTDOWN DE Y DI D Z PSET MAX22502E GND 19-100135 Rev 1 4/19MAX22502E 100Mbps Full-Duplex RS-485/RS-422 Transceiver for Long Cables Absolute Maximum Ratings V ........................................................................-0.3 V to +6 V Continuous Power Dissipation (Multilayer Board (derate CC RE, DE, DI, VL ....................................................-0.3 V to +6 V 24.4mW/C above +70C)) ........................................1951mW RO .............................................................-0.3 V to (V + 0.3) V Operating Temperature Range ........................ -40C to +125C L PSET ......................................................-0.3 V to (V + 0.3) V Junction Temperature .....................................................+150C CC A, B, Y, Z ................................................................-15V to +15V Storage Temperature Range ........................... -65C to +150C Short-Circuit Duration (RO, Y, Z) to GND Reflow Temperature ........................................................+300C Continuous Power Dissipation (Single Layer Board (derate 15.9mW/C above +70C)) ...........................1269mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 12 TDFN-EP PACKAGE CODE TD1233+1C Outline Number 21-0664 Land Pattern Number 90-0397 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 63C/W JA Junction to Case ( ) 8C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 41C/W JA Junction to Case ( ) 8C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com