Click here to ask an associate for production status of specific part numbers. Surge Protected IO-Link Transceiver with DC- MAX22514 DC IO-Link Master Transceivers Product Highlights The MAX22514 is capable of being used in both IO- High Configurability and Integration Link devices and IO-Link master applications. A SPI IO-Link Device and Master Applications interface is used for extended configurability and COM1, COM2, and COM3 Data Rates diagnostics, and the transceiver is capable of Integrated High-Efficiency 200mA DC-DC Buck operating at the COM1, COM2, and COM3 IO-Link Regulator data rates. The MAX22514 can be configured to 200A/2mA/5mA Current Sinks/Sources enable the required 5mA pull-down/pull-up current C/Q Receiver is Configurable for 5V TTL on the C/Q line and generate a wake-up pulse. Highly Configurable Driver Overload Handling Four Selectable Driver Slew Rates Simplified Application Diagram SPI Configuration and Monitoring 7V Integrated Temperature Sensor 5V 1F Configurable C/Q Driver: PNP, NPN, and PP 3.3V R1 1F R2 CLX Modes L Integrated Protection Enables Robust Systems VCC FB LIN LX 1F VL V33 V5 PV24 Integrated 1kV/500 Surge Protection RESET/POK VM WU Spread Spectrum DC-DC GPO CS V 24 10nF SCLK SCLK Reverse Polarity Protection MISO SDO MAX22514 L+ MOSI SDI Glitch Filter for Improved Burst Resilience RX RX TX TX Hot-Plug Protection RTS TXEN C/Q CQGND L- GND Optimized for Small Sensor Designs VCCB C/Q 1F GND Accurate Oscillator for IO-Link Communication 2.4 (typ) Driver On-Resistance for Low Power Dissipation 1.2MHz DC-DC Switching Rate Pin Configuration Integrated 3.3V and 5V Linear Regulators TOP VIEW (BUMPS ON B OTTOM) Available in Tiny WLP (2.5mm x 2.6mm) and TQFN (4mm x 5mm) Packages FB VCCB LX PV CQGND 24 A1 A2 A3 A4 A5 Key Applications IO-Link and Industrial Sensor and Actuator Devices V5 V33 GND LIN C/Q The MAX22514 features a SPI interface for B3 B1 B2 B4 B5 configuration and diagnostics. A high level of VL CS GND V V24 M integration (including two linear regulators, a DC-DC C1 C2 C3 C4 C5 buck regulator, and integrated surge protection, combined with low power dissipation and small MCLK SDI TX RX RESET/POK packages) optimizes the MAX22514 for use in many D1 D2 D3 D4 D5 different industrial and IO-Link small sensor applications. SCLK SDO TXEN WU IRQ E1 E2 E3 E4 E5 WLP (2.5mm x 2.6mm) See more Who should use this part. Ordering Information appears at end of data sheet. 19-101287 Rev 1 2/22 2021 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. One Analog Way, Wilmington, MA 01887 U.S.A. Tel: 781.329.4700 2021 Analog Devices, Inc. All rights reserved. MICROCONTROLLER MAX22514 Surge Protected IO-Link Transceiver with DC-DC Absolute Maximum Ratings All voltages referenced to GND, unless otherwise noted. SDO, RX, MCLK .................................... -0.3V to (V + 0.3V) L V (Continuous) .............................................. -36V to +36V IRQ, WU .......................................................... -0.3V to +6V 24 V (Peak, 100s) ............................................ -52V to +65V CQGND ........................................................ -0.3V to +0.3V 24 PV24 (Continuous)........................................... -0.3V to +36V Continuous Current into V24, LX, GND, or CQGND ........ 1A PV (Peak, 100s) MAX(-0.3V, V - 52V) to MIN(+52V, V Continuous Current into PV .................................. 200mA 24 24 24 24 + 52V) Peak Current into PV (100s) ...................................... 1A 24 LX .......................................................-0.3V to (PV + 0.3V) 24 Continuous Current into C/Q ................................... 500mA LIN (Continuous) .................. MAX(-0.3V, V - 0.3V) to +36V 5 Continuous Current into Any Other Pin ..................... 50mA LIN (Peak, 100s) ................ MAX(-0.3V, V - 0.3V) to +52V 5 Continuous Power Dissipation C/Q (Continuous) MAX(-36V, V - 36V) to MIN(+36V, V + 24 24 24-pin TQFN (T = +70C, derates at 28.6mW/C above A 36V) +70C) .................................................................... 2285.7mW C/Q (Peak, 100s) MAX(-52V, V - 60V) to MIN(+52V, V + 24 24 25-bump WLP (T = +70C, derates at 22.74mW/C above A 60V) +70C) ....................................................................... 1819mW VM, FB, VCCB, RESET/POK ............................... -0.3V to +6V Operating Temperature Range .................. -40C to +125C V , V ................................................................ -0.3V to +6V 5 L Maximum Junction Temperature .............................. +150C V .......................................................... -0.3V to (V + 0.3V) 33 5 Storage Temperature Range ..................... -40C to +150C LOGIC INPUTS Soldering Temperature (Reflow) (TQFN only, soldering, 10 CS, SCLK, SDI, TX, TXEN .................... -0.3V to (V + 0.3V) seconds) ...................................................................... +300C L LOGIC OUTPUTS Bump Reflow Temperature ...................................... +260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 24 TQFN T2445+2C Package Code Outline Number 21-0201 Land Pattern Number 90-0083 Thermal Resistance, Four Layer Board: Junction-to-Ambient ( ) 35C/W JA Junction-to-Case Thermal Resistance ( ) 1.8C/W JC 25 WLP Package Code W252V2+1 Outline Number 21-100546 Land Pattern Number Refer to App Note 1891 Thermal Resistance, Four Layer Board: Junction-to-Ambient ( ) 43.98C/W JA Junction-to-Case Thermal Resistance (JC) N/A For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal- tutorial. www.analog.com Analog Devices 2