EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. MAX25610A/MAX25610B Synchronous Buck and Buck-Boost LED Driver/DC-DC Converter General Description Benefits and Features The MAX25610A/MAX25610B are fully synchronous Automotive Ready: AEC-Q100 Qualified LED drivers that provide constant output current to Integration Minimizes BOM to Save Space and Cost drive high-power LEDs. The MAX25610A/MAX25610B Wide input Voltage Range from 5V to 36V in Buck- integrate two 60m power MOSFETs for synchronous Boost LED Driver Applications operation, minimizing external components. Flexible 2.2MHz Switching Frequency Option Reduces configuration supports buck, inverting buck-boost, and Inductor Size boost conversion. The devices incorporate current- Internal Current-Sense Option Reduces Cost mode control that provides fast transient response and Integrated High and Low-Side Switching MOSFETs eases loop stabilization. The MAX25610A/MAX25610B PWM Dimming with an Analog Control Voltage include cycle by cycle current limiting, output overvoltage Minimizes Additional Components for Dimming protection (OVP), open-string protection, output short- Wide Dimming Ratio Allows High Contrast Ratio circuit protection (SCP), and thermal shutdown. Analog and PWM Dimming In LED driver applications, the MAX25610A/MAX25610B Multi-Topology Architecture Provides Flexibility provide analog dimming of the LED current through the Buck LED Driver for 1-to-2 LEDs When Operating REFI pin, and PWM dimming through the PWMDIM of Automotive Battery Applications pin. Switching is enabled when PWMDIM is high, and Inverting Buck-Boost LED Driver for 3-to-5 LEDs disabled with both MOSFETs off when PWMDIM is low. When Operating from Automotive Battery Analog programming of the PWMDIM pin enables the Applications built-in digital dimming function, with dimming frequency Protection Features and Wide Temperature Range selected by the PWMFRQ pin. Increase System Reliability The MAX25610A/MAX25610B include two 5V regulators. -40C to +125C Operating Temperature Range A regulated 5V between V and AGND is used for IC CC Short-Circuit, Overvoltage, and Thermal Protection bias, REFI and PWMFRQ programming. Another low FLT Flag for Fault Indication current regulated 5V between V and INN is used for EE analog PWMDIM and FLT pullup. Both PWMDIM and Ordering Information appears at end of data sheet. FLT reference INN for easy system interface. Switching frequency is internally set at 400kHz for the MAX25610A Simplified Application Circuit and 2.2MHz for the MAX25610B. The devices have built- in spread spectrum to reduce EMI noise. External and VIN+ CBST internal current sense are supported, with 3% and 6% INP BST L BATTERY GND CIN respective LED current accuracy. V IN- C V LX IN2 IN- INN The MAX25610A/MAX25610B are well-suited for LX IC-GND R OUT1 automotive applications requiring high voltage input and OUT CVEE LED1 VEE PWM or can withstand load dump events up to 40V. The devices ANALOG PWMDIM C OUT can also be used as a DC-DC converter using the DIMMING R MAX25610A OUT2 FB input as feedback for the output voltage divider. OPEN-DRAIN FLT FAULT The MAX25610A/MAX25610B are available in thermally C PWMFRQ PGND LEDn enhanced 16-pin TSSOP-EP and 16-pin TQFN packages. PWMFRQ V CC 100k They are specified to operate over the -40C to +125C RPWMFRQ FB automotive temperature range. VCC COMP C COMP C VCC IC-GND R REFI REFI DOMAIN Applications AGND RCOMP Automotive Lighting Applications Industrial Lighting Applications 19-100449 Rev 5 4/19MAX25610A/MAX25610B Synchronous Buck and Buck-Boost LED Driver/DC-DC Converter Absolute Maximum Ratings INP to PGND .........................................................-0.3V to +40V FLT to INN ............................................................-0.3V to +6.0V INP to LX ...............................................................-0.3V to +40V Short-Circuit Between V and AGND .....................Continuous CC LX to PGND...........................................................-0.3V to +40V Continuous Power Dissipation (Multilayer Board) TSSOP-EP V to AGND .......................................................-0.3V to +6.0V (T = +70C, derate 26.1mW/C above +70C) ........2088mW CC A BST to LX .............................................................-0.3V to +6.0V Continuous Power Dissipation (Multilayer Board) TQFN-EP INP to INN .............................................................-0.3V to +40V (T = +70C, derate 33.3mW/C above +70C) ........2667mW A PGND to AGND ....................................................-0.3V to +0.3V Operating Temperature Range ......................... -40C to +125C PWMFRQ, OUT to AGND ...........................-0.3V to V + 0.3V Junction Temperature ......................................................+150C CC REFI, COMP to AGND ................................-0.3V to V + 0.3V Storage Temperature Range ............................ -40C to +150C CC FB to AGND...........................................................-0.3V to +16V Soldering Temperature (reflow) .......................................+260C INN to AGND .........................................................-0.3V to +24V LX Continuous RMS Current (per pin) .................................1.5A V , PWMDIM to INN ..........................................-0.3V to +6.0V INP, PGND Continuous RMS Current ..................................2.5A EE Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information TSSOP PACKAGE CODE U16E+3C Outline Number 21-0108 Land Pattern Number 90-0120 Thermal Resistance, Single-Layer Board: Junction-to-Ambient ( ) 47C/W JA Junction-to-Case Thermal Resistance ( ) 3C/W JC Thermal Resistance, Four Layer Board: Junction-to-Ambient ( ) 38.3C/W JA Junction-to-Case Thermal Resistance ( ) 3C/W JC TQFN PACKAGE CODE T1655Y+3C Outline Number 21-100279 Land Pattern Number 90-0072 Thermal Resistance, Single-Layer Board: Junction-to-Ambient ( ) 48C/W JA Junction-to-Case Thermal Resistance ( ) 2C/W JC Thermal Resistance, Four-Layer Board: Junction-to-Ambient ( ) 30C/W JA Junction-to-Case Thermal Resistance ( ) 2C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com