Click here for production status of specific part numbers. MAX25612/MAX25612B Automotive Synchronous High Voltage LED Controller Simple to Optimize for Efficiency, Board Space, and General Description Input Operating Range The MAX25612/MAX25612B are single-channel high- Synchronous MOSFET Driver Improves Efficiency brightness LED (HB LED) drivers for automotive front- by up to 5% for High-Current Boost, Buck-Boost, light applications such as high beam, low beam, daytime SEPIC, and High-Side Buck Applications running light (DRL), turn indicator, fog light and other LED Programmable Switching Frequency (200kHz to lights. They can take an input voltage from 5V to 48V and 2.2MHz) can drive a string of LEDs with a maximum output voltage 20-Pin TSSOP Package with Exposed Pad of 60V. The MAX25612/MAX25612B are fully synchronous and Thermally Enhanced 4mm x 4mm, 20-Pin and are suitable for boost, buck-boost, SEPIC, and high- Side-Wettable TQFN Packages side buck applications that need synchronous rectification Protection Features Increase System Reliability providing efficiencies greater than 90%. Short Circuit, Overvoltage and Thermal Protection The MAX25612/MAX25612B sense output current at Fault Diagnosis through Fault Flag the high side of the LED string. High-side current Automotive Ready sensing is required to protect against shorts from the -40C to +125C Operating Temperature Range output to the ground or battery input. It is also the most AEC-Q100 Qualified flexible scheme for driving LEDs, allowing boost, high- side buck, or buck-boost mode configurations. The PWM input provides LED dimming ratios of up to Simplified Typical Operating Circuit 5000:1, and the ICTRL input provides additional analog dimming capability in the MAX25612/MAX25612B. L1 R The MAX25612/MAX25612B also include a FLT flag CS LED VIN N2 that indicates open string, shorted string, and thermal R OVP1 C BST shutdown. The MAX25612/MAX25612B have built-in BST P1 spread-spectrum modulation for improved electromagnetic IN DH COUT compatibility performance. The MAX25612/ LX MAX25612B are available in a space-saving (4mm x DL N1 UVEN ROVP2 4mm), 20-pin side-wettable TQFN or a 20-pin TSSOP VCC CSP package and are specified to operate over the -40C to RSC MAX25612/ R CS FET +125C automotive temperature range. MAX25612B CSN PGND Applications OVP ISENSE+ FLT Automotive Exterior Lighting: ISENSE- PWMDIM High-Beam/Low-Beam/Signal/Position Lights DIMOUT ICTRL RCOMP COMP Daytime Running Lights (DRLs) RT SGND EP C CCOMP COMP HF Fog Light and Adaptive Front-Light Assemblies Commercial, Industrial, and Architectural Lighting Benefits and Features Integration Minimizes BOM and Cost +5.0V to +48V Wide Input Voltage Range with a Maximum +65V Boost Output Ordering Information appears at end of data sheet. Integrated pMOS Dimming FET Driver ICTRL Input for Analog Dimming Integrated High-Side Current-Sense Amplifier 200Hz Ramp Generator Simplifies PWM Dimming 19-100543 Rev 4 1/20MAX25612/MAX25612B Automotive Synchronous High Voltage LED Controller Absolute Maximum Ratings IN, UVEN to PGND ...............................................-0.3V to +52V OVP, FLT, ICTRL, PWMDIM to SGND ....................-0.3V to +6V ISENSE+, ISENSE-, DIMOUT to PGND ...............-0.3V to +65V Continuous Current on IN ................................................100mA ISENSE- to ISENSE+ ...........................................-0.6V to +0.3V Continuous Current on DL ................................................+50mA BST, DH to PGND .................................................-0.3V to +70V Short Circuit Duration on V ...................................Continuous CC LX to PGND...........................................................-0.3V to +65V Continuous Power Dissipation (20-Pin TSSOP) (T = A BST to LX ................................................................-0.3V to +6V +70C, derate 26mW/C above +70C.) ...................2122mW DH to LX ....................................................... -0.3V to VCC+0.3V Continuous Power Dissipation (20-Pin TQFN SW) (T = A DL to PGND ................................................. -0.3V to VCC+0.3V +70C, derate 25.6mW/C above +70C.) ................2050mW CSP, CSN to SGND ..................................... -0.3V to VCC+0.3V Operating Temperature Range ......................... -40C to +125C CSP-CSN .............................................................-0.3V to +0.3V Junction Temperature ......................................................+150C COMP, RT to SGND .......................................-0.3V to Vcc+0.3V Storage Temperature Range ............................ -65C to +150C V to SGND ..........................................................-0.3V to +6V Lead Temperature (Soldering, 10s) .................................+300C CC SGND to PGND ....................................................-0.3V to +0.3V Soldering Temperature (Reflow) ......................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 20-TSSOP PACKAGE CODE U20E+3C Outline Number 21-100132 Land Pattern Number 90-100049 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 46C/W JA Junction to Case ( ) 2C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 37C/W JA Junction to Case ( ) 2C/W JC 20-TQFN SW PACKAGE CODE T2044Y+3C Outline Number 21-100068 Land Pattern Number 90-0037 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 59C/W JA Junction to Case ( ) 6C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 39C/W JA Junction to Case ( ) 6C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com