X-On Electronics has gained recognition as a prominent supplier of MAX2615ETA+T RF Amplifier across the USA, India, Europe, Australia, and various other global locations. MAX2615ETA+T RF Amplifier are a product manufactured by Analog Devices. We provide cost-effective solutions for RF Amplifier, ensuring timely deliveries around the world.

MAX2615ETA+T Analog Devices

MAX2615ETA+T electronic component of Analog Devices
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Part No.MAX2615ETA+T
Manufacturer: Analog Devices
Category: RF Amplifier
Description: RF Amplifier Broadband Gain Block
Datasheet: MAX2615ETA+T Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
100: USD 3.6912 ea
Line Total: USD 369.12 
Availability - 0
MOQ: 100  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 12 Dec to Wed. 18 Dec
MOQ : 100
Multiples : 1
100 : USD 3.6912
250 : USD 3.15
500 : USD 2.8271
2500 : USD 2.3231
5000 : USD 2.2523

0
Ship by Tue. 10 Dec to Thu. 12 Dec
MOQ : 1
Multiples : 1
1 : USD 4.9257
10 : USD 3.528
25 : USD 3.339
100 : USD 2.9862
250 : USD 2.7139
500 : USD 2.5079
1000 : USD 2.3019
2500 : USD 2.2171

   
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Rohs Phthalates Compliant
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the MAX2615ETA+T from our RF Amplifier category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MAX2615ETA+T and other electronic components in the RF Amplifier category and beyond.

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Click here for production status of specific part numbers. MAX2612MAX2616 40MHz to 4GHz Linear Broadband Amplifiers General Description Benefits and Features The MAX2612MAX2616 is a family of high-performance Extremely Flat Frequency Response broadband gain blocks designed for use as a PA predriver, < 0.5dB, 1GHz to 4GHz low-noise amplifier, or as a cascadable 50I amplifier with Low Noise Figure: 2.0dB at f = 2.0GHz RFIN up to +19.5dBm output power. These devices are suited 40MHz to 4000MHz Frequency Range for many applications that include cellular infrastructure, Industrys Highest Max P Rating private or commercial microwave radios, and CATV or IN cable modems. The operating frequency range extends Large OIP3 Ranges from 40MHz to 4000MHz. The amplifier operates on a MAX2615/MAX2616: +37dBm +3V to a +5.25V supply with input and output ports internally MAX2612: +35.2dBm matched to 50I. The device family is available in a pin- MAX2613: +31.2dBm to-pin compatible, compact 2mm x 3mm TDFN lead-free MAX2614: +30dBm package. Output P1dB: +19.5dBm (MAX2615/MAX2616) High Gain: 18.6dB Applications Shutdown Mode (MAX2612/MAX2613/ Cellular Infrastructure MAX2614/MAX2616) Microwave Radio Adjustable Bias Current for Improved OIP3 Wireless LAN (MAX2615) Test and Measurement 3.0V to 5.25V Supply Range Automotive Compact 2mm x 3mm TDFN Package Industry-High ESD Rating: 2.5kV HBM AEC-Q100 QualifiedRefer to Ordering Information Ordering Information appears at end of data sheet. for List of /V Parts Typical Application Circuits 3V TO 5.25V 3V TO 5.25V 10F 10nF 470pF 10F 10nF 470pF 21.5kI 220nH 220nH MAX2612 MAX2613 N.C. MAX2614 MAX2615 MAX2616 V V CC CC EN/BIAS EN/BIAS 0.01F 0.01F 0.01F 0.01F RFIN RFOUT RFIN RFOUT GND GND 19-6309 Rev 5 3/19MAX2612MAX2616 40MHz to 4GHz Linear Broadband Amplifiers Absolute Maximum Ratings V ,EN/RBIAS, RFOUT to GND .........................-0.3V to +6.0V Junction Temperature .....................................................+150NC CC Maximum Input Power (RFIN) .......................................+20dBm Storage Temperature Range ............................ -65NC to +160NC Continuous Power Dissipation (T = +70NC) Lead Temperature (soldering, 10s) ................................+300NC A Soldering Temperature (reflow) ......................................+260NC TDFN (derates 16.7mW/NC above +70NC) .............1333.3mW Operating Temperature Range .......................... -40NC to +85NC Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) TDFN Junction-to-Ambient Thermal Resistance (B ) ..........60NC/W Junction-to-Case Thermal Resistance (B ) ...................11NC/W JA JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Package Information 8 TDFN PACKAGE CODE T823+1 Outline Number 21-0174 Land Pattern Number 90-0091 Thermal Resistance, Single-Layer Board: Junction to Ambient ( ) 60C/W JA Junction to Case ( ) 11C/W JC Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 60C/W JA Junction to Case ( ) 11C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Maxim Integrated 2 www.maximintegrated.com

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
ANALOG DEVICES
Analog Devices Hittite
ANALOG DEVICES (LINEAR TECHNOLOGY)
ANALOG DEVICES (MAXIM INTEGRATED)
ANALOG DEVICES (TRINAMIC)
Analog Devices / Hittite
Analog Devices / Linear Technology
Analog Devices Inc
Analog Devices Inc.
Analog Devices Inc./Maxim Integrated
Analog Devices, Inc.
DA4
Dallas
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Dallas Semiconductor (VA)
HANSCHIP semiconductor
LINEAR
LINEAR TECH
Linear Technology
Linear Technology (part of ADI)
LT
LT4
MAXIM
Maxim Integrated
MAXIM INTEGRATED / ANALOG DEVICES
Maxim Integrated Products
MAXIM-DALLAS
MX4
Technology
Trinamic
TRINAMIC / ANALOG DEVICES
Trinamic Motion Control
Trinamic Motion Control GmbH
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