2 MAX31629 I C Digital Thermometer and Real-Time Clock General Description Benefits and Features 2 The MAX31629 I C digital thermometer and real-time Integration of Temperature Sensor and Real-Time clock (RTC) integrates the critical functions of a real-time Clock Saves Space and Cost clock and a temperature monitor in a small-outline 8-pin Measures Temperatures from -55C to +125C TDFN package. Communication to the device is accom- (-67F to +257F) 2 plished through an I C interface. The wide power-supply Real-Time Clock with Leap-Year Compensation through the Year 2100 range and minimal power requirement of the device allow for accurate time/temperature measurements in battery- 32 Bytes of SRAM for General Data Storage 8-Pin TDFN Package powered applications. Minimal Power Requiremen ts Allow for Accurate The digital thermometer provides 9-bit to 12-bit tempera- ture readings that indicate the temperature of the device. Time/Temperature Measurements in Battery-Powered Applications No additional components are required the device is truly 2.2V to 5.5V Wide Power-Supply Range a temperature-to-digital converter. User-Programmability Flexibly Supports Different The clock/calendar provides seconds, minutes, hours, Application Requirements day, day of the week, month, day of the month, and year. Thermometer Resolution is User Programmable to The end-of-the-month date is automatically adjusted for 9, 10, 11, or 12 Bits months with less than 31 days, including corrections for Thermostatic and Time Alarm Settings are User leap years. It operates in either a 12- or 24-hour format Definable with AM/PM indicator in 12-hour mode. The crystal oscil- Dedicated Open-Drain Alarm Output lator frequency is internally divided, as specified by device Industry-Standard Serial Interface Works with a configuration. An open-drain output is provided that can Variety of Common Microcontrollers be used as the oscillator input for a microcontroller. 2 Data is Read from/Written to through an I C Serial The open-drain alarm output of the device becomes Interface (Open-Drain I/O Lines) active when either the measured temperature exceeds the programmed overtemperature limit (TH) or current Applications time reaches the programmed alarm setting. The user Networking Equipment can configure which event (time only, temperature only, Industrial Equipment either, or neither) generates an alarm condition. For stor- Office Equipment age of general system data or time/temperature data Data Loggers and Any Thermally Sensitive Systems logging, the device features 32 bytes of SRAM. Applications for the device include networking equipment, industrial equipment, office equipment, thermal data loggers, or any microprocessor-based, thermally sensitive Ordering Information appears at end of data sheet. system. For related parts and recommended products to use with this part, refer to www.maximintegrated.com/MAX31629.related. 19-7305 Rev 1 12/142 MAX31629 I C Digital Thermometer and Real-Time Clock Absolute Maximum Ratings Voltage Range on V Relative to Ground .........-0.3V to +6.0V Operating Temperature Range ........................ -55C to +125C DD Voltage Range on Any Pin Storage Temperature Range ............................ -55C to +125C Relative to Ground................................ -0.3V to (V + 0.3V) Lead Temperature (soldering, 10s) .................................+300C DD ESD Protection (all pins, Human Body Model) ....................2kV Soldering Temperature (reflow) .......................................+260C Continuous Power Dissipation (T = +70C) A TDFN (derate 24.4mW/C above +70C ................1951.2mW Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) TDFN Junction-to-Ambient Thermal Resistance (B ).......... 41NC/W JA Junction-to-Case Thermal Resistance (B ) ................ 8NC/W JC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Recommended Operating Conditions (T = -55C to +125C, unless otherwise noted.) (Note 2) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Voltage Supply V (Note 3) 2.2 5.5 V DD 0.3 x Input Logic 0 V (Note 3) -0.5 V IL V DD V + DD Input Logic 1 V (Note 3) 0.7V V IH DD 0.5 Electrical Characteristics (2.2V V 5.5V, T = -55C to +125C, unless otherwise noted.) DD A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS V = 2.2V (Note 4) 0.1 DD Standby Current I A DDS V = 5.0V (Note 4) 0.2 DD V = 2.2V (Note 5) 0.8 DD Timekeeping Current I A DDC V = 5.0V (Note 5) 1 DD V = 2.2V (Note 5) 100 DD 2 I C Communication I A DD2 V = 5.0V (Note 5) 150 DD V = 2.2V (Note 5) 1100 DD Thermometer Current I A DDT V = 5.0V (Note 5) 1100 DD V = 2.2V (Note 5) 1100 DD Active Current I A DD V = 5.0V (Note 5) 1200 DD Logic 0 Output V (Note 6) 0 0.4 V OL (SDA, ALRM, OSC) Input Current, Each I/O Pin 0.4V < V < 0.9 V -10 +10 A I/O DD -10C to +85C, 2.7V < V < 5.5V 2 DD Thermometer Error T C ERR 4 sigma, 2.7V < V < 5.5V 3 DD Resolution 9 12 Bits Maxim Integrated 2 www.maximintegrated.com