EVALUATION KIT AVAILABLE Click here for production status of specific part numbers. 2 MAX31889 0.25C Accurate I C Temperature Sensor General Description Benefits and Features The MAX31889 operates from a 1.7V to 3.6V supply volt- High Accuracy and Precision age, and is a low-power, high-accuracy digital temperature 0.25C Accuracy from -20C to +105C sensor with 0.25C accuracy from -20C to +105C and 0.65C Accuracy from -40C to +125C 0.65C accuracy from -40C to +125C. The MAX31889 Long Battery Life has 16-bit resolution (0.005C). 1.7V to 3.6V Operating Voltage 2 The device uses a standard I C serial interface to commu- 68A Operating Current During Measurement nicate with a host controller. Two GPIO pins are available. 0.55A Standby Current GPIO1 can be configured to trigger a temperature converi- Small Size son, while GPIO0 can be configured to generate an inter- 2mm x 2mm x 0.8mm, 6-Pin DFN rupt for selectable status bits. Safety and Compliance The MAX31889 includes a 32-word FIFO for the tempera- High and Low Temperature Alarms ture data and also includes high and low threshold digital 2 I C Digital Interface temperature alarms. The device is available in a 2mm x 2mm x 0.8mm, 6-pin, DFN package. Configurable Convert Temperature Input Pin Configurable Interrupt Output Pin 32-Word FIFO for Temperature Data Applications 2 4 I C Addresses AvailableMore Addresses Precision Temperature Monitoring Available by Request RTD Replacement Unique ROM IDs Allow Device to Be NIST Internet of Things (IoT) Sensors Traceable Ordering Information appears at end of data sheet. Simplified Block Diagram MAX31889MAX31889 GPIO1 SDA CONTROL LOGIC GPIO0 2 I C INTERFACE SCL REGISTERS TEMP GND V DD SENSOR 19-100693 Rev 0 01/202 MAX31889 0.25C Accurate I C Temperature Sensor Absolute Maximum Ratings V to GND .............................................................. -0.3V to +6V Operating Temperature Range .............................-40C to 125C DD GPIOx to GND .......................................................... -0.3V to +6V Junction Temperature .......................................................+150C SDA,SCL to GND ..................................................... -0.3V to +6V Storage Temperature Range ..............................-65C to +150C Continuous Power Dissipation (Multilayer Board DFN, T = +70 Lead Temperature (soldering, 10s) ..................................+300C A C, derate 5.47mW/C above 70C ) ...................... 437.25mW/C Soldering Temperature (reflow) ........................................+260C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information DFN Package Code L622+2 Outline Number 21-100397 Land Pattern Number 90-100138 Thermal Resistance, Four-Layer Board: Junction to Ambient ( ) 182.96C/W JA Junction to Case ( ) 50.75C/W JC For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a +, , or - in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. 19-100693 www.maximintegrated.com Maxim Integrated 2