Click here for production status of specific part numbers. MAX3224E/MAX3225E/ 15kV ESD-Protected, 1A, 1Mbps, MAX3226E/MAX3227E/ 3.0V to 5.5V, RS-232 Transceivers MAX3244E/MAX3245E with AutoShutdown Plus General Description Next Generation Device Features The MAX3224E/MAX3225E/MAX3226E/MAX3227E/ For Space-Constrained Applications: MAX3244E/MAX3245E are 3V-powered EIA/TIA-232 and MAX3228E/MAX3229E: 15kV ESD-Protected, V.28/V.24 communications interfaces with automatic shut- +2.5V to +5.5V, RS-232 Transceivers in UCSP down/wakeup features, high data-rate capabilities, and MAX3222E/MAX3232E/MAX3241E/MAX3246E: enhanced electrostatic discharge (ESD) protection. All 15kV ESD-Protected, Down to 10nA, +3.0V to transmitter outputs and receiver inputs are protected to +5.5V, Up to 1Mbps, True RS-232 Transceivers 15kV using IEC 1000-4-2 Air-Gap Discharge, 8kV using (MAX3246E Available in UCSP) IEC 1000-4-2 Contact Discharge, and 15kV using the For Low-Voltage or Data Cable Applications: Human Body Model. MAX3380E/MAX3381E: +2.35V to +5.5V, 1A, All devices achieve a 1A supply current using Maxims 2Tx/2Rx RS-232 Transceivers with 15kV revolutionary AutoShutdown Plus feature. These devic- ESD-Protected I/O and Logic Pins es automatically enter a low-power shutdown mode when the RS-232 cable is disconnected or the transmitters of Ordering Information the connected peripherals are inactive, and the UART PART TEMP RANGE PIN-PACKAGE driving the transmitter inputs is inactive for more than 30 seconds. They turn on again when they sense a valid MAX3224ECTP+ 0C to +70C 20 TQFN-EP* transition at any transmitter or receiver input. MAX3224ECUP+ 0C to +70C 20 TSSOP AutoShutdown Plus saves power without changes to the MAX3224ECAP+ 0C to +70C 20 SSOP existing BIOS or operating system. MAX3224ECPP+ 0C to +70C 20 Plastic DIP The MAX3225E/MAX3227E/MAX3245E also fea- MAX3224EETP+ -40C to +85C 20 TQFN-EP* ture MegaBaud operation, guaranteeing 1Mbps for MAX3224EEUP+ -40C to +85C 20 TSSOP high-speed applications such as communicating with ISDN modems. The MAX3224E/MAX3226E/MAX3244E MAX3224EEAP+ -40C to +85C 20 SSOP guarantee 250kbps operation. The transceivers have a MAX3224EEPP+ -40C to +85C 20 Plastic DIP proprietary low-dropout transmitter output stage enabling MAX3224EAAP+ -40C to +125C 20 SSOP true RS-232 performance from a +3.0V to +5.5V supply with a dual charge pump. The charge pump requires only +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. four small 0.1F capacitors for operation from a 3.3V supply. The MAX3224EMAX3227E feature a logic-level Ordering Information continued at end of data sheet. output (READY) that asserts when the charge pump is regulating and the device is ready to begin transmitting. Selector Guide All devices are available in a space-saving TQFN, SSOP, and TSSOP (MAX3224E/MAX3225E/MAX3244E/ NO. OF GUARANTEED Auto- READY MAX3245E) packages. PART DRIVERS/ DATA RATE Shutdown OUTPUT RECEIVERS (bps) Plus Applications MAX3224E 2/2 250k Notebook, Subnotebook, and Palmtop Computers MAX3225E 2/2 1M Cellular Phones Battery-Powered Equipment MAX3226E 1/1 250k Hand-Held Equipment MAX3227E 1/1 1M Peripherals MAX3244E 3/5 250k Printers Automotive MAX3245E 3/5 1M AutoShutdown Plus, MegaBaud, and UCSP are trademarks of Maxim Integrated Products, Inc. 19-1339 Rev 11 11/18MAX3224E/MAX3225E/ 15kV ESD-Protected, 1A, 1Mbps, MAX3226E/MAX3227E/ 3.0V to 5.5V, RS-232 Transceivers MAX3244E/MAX3245E with AutoShutdown Plus Absolute Maximum Ratings V to GND ............................................................-0.3V to +6V 20-Pin TQFN (derate 21.3mW/C above +70C) ....1702.1mW CC V+ to GND (Note 1) .................................................-0.3V to +7V 20-Pin Plastic DIP V- to GND (Note 1) ..................................................+0.3V to -7V (derate 11.11mW/C above +70C) ............................889mW V+ +V-(Note 1) ................................................................+13V 20-Pin SSOP (derate 8.00mW/C above +70C) ........640mW Input Voltages 20-Pin TSSOP (derate 11mW/C above +70C) .....879.1 mW T IN, FORCEON, FORCEOFF to GND ..............-0.3V to +6V 28-Pin Wide SO (derate 12.5mW/C above +70C) ..........1W R IN to GND ...................................................................25V 28-Pin SSOP (derate 9.1mW/C above +70C) .......727.3mW Output Voltages 28-Pin TSSOP (derate 14mW/C above +70C) ....1025.6mW T OUT to GND .............................................................13.2V 36-Pin TQFN (derate 26.3mW/C above +70C) ..... 2105.3mW R OUT, INVALID, READY to GND ...... -0.3V to (V + 0.3V) Operating Temperature Ranges CC Short-Circuit Duration MAX32 EC .................................................0C to +70C T OUT to GND ......................................................Continuous MAX32 EE ............................................. -40C to +85C Continuous Power Dissipation (T = +70C) MAX32 EAA ............................................ -40C to +125C A 16-Pin SSOP (derate 7.10mW/C above +70C) .....571.4mW Storage Temperature Range ............................ -65C to +160C 16-Pin TSSOP (derate 9.4 mW/C above +70C) ....754.7mW Lead Temperature (soldering, 10s) .................................+300C 16-Pin TQFN (derate 20.8mW/C above +70C) ...1666.7mW Soldering Temperature (reflow) .......................................+260C Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 16-SSOP PACKAGE CODE A16+2 Outline Number 21-0056 Land Pattern Number 90-0106 Thermal Resistance, Single layer board: Junction to Ambient ( ) 140 JA Junction to Case ( ) 34 JC Thermal Resistance, Four-layer board: Junction to Ambient ( ) 86 JA Junction to Case ( ) 33 JC 16-TSSOP PACKAGE CODE U16+1 Outline Number 21-0066 Land Pattern Number 90-0117 Thermal Resistance, Single layer board: Junction to Ambient ( ) 106 JA Junction to Case ( ) 27 JC Thermal Resistance, Four-layer board: Junction to Ambient ( ) 90 JA Junction to Case ( ) 27 JC Maxim Integrated 2 www.maximintegrated.com