Click here for production status of specific part numbers.
MAX3224E/MAX3225E/ 15kV ESD-Protected, 1A, 1Mbps,
MAX3226E/MAX3227E/ 3.0V to 5.5V, RS-232 Transceivers
MAX3244E/MAX3245E with AutoShutdown Plus
General Description Next Generation Device Features
The MAX3224E/MAX3225E/MAX3226E/MAX3227E/ For Space-Constrained Applications:
MAX3244E/MAX3245E are 3V-powered EIA/TIA-232 and MAX3228E/MAX3229E: 15kV ESD-Protected,
V.28/V.24 communications interfaces with automatic shut- +2.5V to +5.5V, RS-232 Transceivers in UCSP
down/wakeup features, high data-rate capabilities, and
MAX3222E/MAX3232E/MAX3241E/MAX3246E:
enhanced electrostatic discharge (ESD) protection. All
15kV ESD-Protected, Down to 10nA, +3.0V to
transmitter outputs and receiver inputs are protected to
+5.5V, Up to 1Mbps, True RS-232 Transceivers
15kV using IEC 1000-4-2 Air-Gap Discharge, 8kV using
(MAX3246E Available in UCSP)
IEC 1000-4-2 Contact Discharge, and 15kV using the
For Low-Voltage or Data Cable Applications:
Human Body Model.
MAX3380E/MAX3381E: +2.35V to +5.5V, 1A,
All devices achieve a 1A supply current using Maxims
2Tx/2Rx RS-232 Transceivers with 15kV
revolutionary AutoShutdown Plus feature. These devic-
ESD-Protected I/O and Logic Pins
es automatically enter a low-power shutdown mode when
the RS-232 cable is disconnected or the transmitters of
Ordering Information
the connected peripherals are inactive, and the UART
PART TEMP RANGE PIN-PACKAGE
driving the transmitter inputs is inactive for more than 30
seconds. They turn on again when they sense a valid MAX3224ECTP+ 0C to +70C 20 TQFN-EP*
transition at any transmitter or receiver input.
MAX3224ECUP+ 0C to +70C 20 TSSOP
AutoShutdown Plus saves power without changes to the
MAX3224ECAP+ 0C to +70C 20 SSOP
existing BIOS or operating system.
MAX3224ECPP+ 0C to +70C 20 Plastic DIP
The MAX3225E/MAX3227E/MAX3245E also fea-
MAX3224EETP+ -40C to +85C 20 TQFN-EP*
ture MegaBaud operation, guaranteeing 1Mbps for
MAX3224EEUP+ -40C to +85C 20 TSSOP
high-speed applications such as communicating with
ISDN modems. The MAX3224E/MAX3226E/MAX3244E
MAX3224EEAP+ -40C to +85C 20 SSOP
guarantee 250kbps operation. The transceivers have a
MAX3224EEPP+ -40C to +85C 20 Plastic DIP
proprietary low-dropout transmitter output stage enabling
MAX3224EAAP+ -40C to +125C 20 SSOP
true RS-232 performance from a +3.0V to +5.5V supply
with a dual charge pump. The charge pump requires only +Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
four small 0.1F capacitors for operation from a 3.3V
supply. The MAX3224EMAX3227E feature a logic-level
Ordering Information continued at end of data sheet.
output (READY) that asserts when the charge pump is
regulating and the device is ready to begin transmitting.
Selector Guide
All devices are available in a space-saving TQFN,
SSOP, and TSSOP (MAX3224E/MAX3225E/MAX3244E/
NO. OF GUARANTEED Auto-
READY
MAX3245E) packages. PART DRIVERS/ DATA RATE Shutdown
OUTPUT
RECEIVERS (bps) Plus
Applications
MAX3224E 2/2 250k
Notebook, Subnotebook, and Palmtop Computers
MAX3225E 2/2 1M
Cellular Phones
Battery-Powered Equipment MAX3226E 1/1 250k
Hand-Held Equipment
MAX3227E 1/1 1M
Peripherals
MAX3244E 3/5 250k
Printers
Automotive MAX3245E 3/5 1M
AutoShutdown Plus, MegaBaud, and UCSP are trademarks of
Maxim Integrated Products, Inc.
19-1339; Rev 11; 11/18MAX3224E/MAX3225E/ 15kV ESD-Protected, 1A, 1Mbps,
MAX3226E/MAX3227E/ 3.0V to 5.5V, RS-232 Transceivers
MAX3244E/MAX3245E with AutoShutdown Plus
Absolute Maximum Ratings
V to GND ............................................................-0.3V to +6V 20-Pin TQFN (derate 21.3mW/C above +70C) ....1702.1mW
CC
V+ to GND (Note 1) .................................................-0.3V to +7V 20-Pin Plastic DIP
V- to GND (Note 1) ..................................................+0.3V to -7V (derate 11.11mW/C above +70C) ............................889mW
V+ +V-(Note 1) ................................................................+13V 20-Pin SSOP (derate 8.00mW/C above +70C) ........640mW
Input Voltages 20-Pin TSSOP (derate 11mW/C above +70C) .....879.1 mW
T_IN, FORCEON, FORCEOFF to GND ..............-0.3V to +6V 28-Pin Wide SO (derate 12.5mW/C above +70C) ..........1W
R_IN to GND ...................................................................25V 28-Pin SSOP (derate 9.1mW/C above +70C) .......727.3mW
Output Voltages 28-Pin TSSOP (derate 14mW/C above +70C) ....1025.6mW
T_OUT to GND .............................................................13.2V 36-Pin TQFN (derate 26.3mW/C above +70C) ..... 2105.3mW
R_OUT, INVALID, READY to GND ...... -0.3V to (V + 0.3V) Operating Temperature Ranges
CC
Short-Circuit Duration MAX32_ _EC_ _ .................................................0C to +70C
T_OUT to GND ......................................................Continuous MAX32_ _EE_ _ ............................................. -40C to +85C
Continuous Power Dissipation (T = +70C) MAX32_ _EAA_ ............................................ -40C to +125C
A
16-Pin SSOP (derate 7.10mW/C above +70C) .....571.4mW Storage Temperature Range ............................ -65C to +160C
16-Pin TSSOP (derate 9.4 mW/C above +70C) ....754.7mW Lead Temperature (soldering, 10s) .................................+300C
16-Pin TQFN (derate 20.8mW/C above +70C) ...1666.7mW Soldering Temperature (reflow) .......................................+260C
Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
16-SSOP
PACKAGE CODE A16+2
Outline Number 21-0056
Land Pattern Number 90-0106
Thermal Resistance, Single layer board:
Junction to Ambient ( ) 140
JA
Junction to Case ( ) 34
JC
Thermal Resistance, Four-layer board:
Junction to Ambient ( ) 86
JA
Junction to Case ( ) 33
JC
16-TSSOP
PACKAGE CODE U16+1
Outline Number 21-0066
Land Pattern Number 90-0117
Thermal Resistance, Single layer board:
Junction to Ambient ( ) 106
JA
Junction to Case ( ) 27
JC
Thermal Resistance, Four-layer board:
Junction to Ambient ( ) 90
JA
Junction to Case ( ) 27
JC
Maxim Integrated 2
www.maximintegrated.com